SLVSCM3B january   2015  – august 2023 TPS62065-Q1 , TPS62067-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6.     Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Mode Selection (TPS62065-Q1) and Forced PWM Mode (TPS62067A-Q1)
      2. 9.3.2 Power Good (PG, TPS62067x-Q1)
      3. 9.3.3 Enable
      4. 9.3.4 Shutdown and Output Discharge
      5. 9.3.5 Soft Start
      6. 9.3.6 Undervoltage Lockout (UVLO)
      7. 9.3.7 Internal Current Limit and Foldback Current Limit For Short-Circuit Protection
      8. 9.3.8 Clock Dithering
      9. 9.3.9 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power Save Mode
        1. 9.4.1.1 Dynamic Voltage Positioning
        2. 9.4.1.2 100% Duty-Cycle Low-Dropout Operation
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Output Voltage Setting
        2. 10.2.2.2 Output Filter Design (Inductor And Output Capacitor)
          1. 10.2.2.2.1 Inductor Selection
          2. 10.2.2.2.2 Output Capacitor Selection
          3. 10.2.2.2.3 Input Capacitor Selection
        3. 10.2.2.3 Checking Loop Stability
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.4.1 Layout Guidelines

As for all switching power supplies, the layout is an important step in the design. The input capacitor must be placed as close as possible to the IC pins.

Provide a low inductance, impedance ground, and supply path. Therefore, use wide and short traces for the main current paths. Connect the AGND and PGND pins of the device to the thermal pad land of the PCB and use this pad as a star point. Use a common power PGND node and a different node for the signal AGND to minimize the effects of ground noise. The FB divider network must be connected right to the output capacitor and the FB line must be routed away from noisy components and traces (for example, SW line).

Due to the small package of this converter and the overall small design size, the thermal performance of the PCB layout is important. To get a good thermal performance, a four or more layer PCB design is recommended. The PowerPAD of the IC must be soldered on the thermal pad area on the PCB to get a proper thermal connection. For good thermal performance, the exposed pad on the PCB must be connected to an inner GND plane with sufficient via connections. Refer to the documentation of the evaluation kit.