SLVSB35C October   2012  – July 2015 TPS62175 , TPS62177

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Enable/Shutdown (EN)
      2. 8.3.2 Output Discharge
      3. 8.3.3 Current Limit and Short Circuit Protection
      4. 8.3.4 Power Good (PG)
      5. 8.3.5 Undervoltage Lockout (UVLO)
      6. 8.3.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Soft Start
      2. 8.4.2 Pulse Width Modulation (PWM) Operation
      3. 8.4.3 Power Save Mode Operation
      4. 8.4.4 Sleep Mode Operation
      5. 8.4.5 100% Mode Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Programming the Output Voltage
        2. 9.2.2.2 External Component Selection
          1. 9.2.2.2.1 Output Filter and Loop Stability
          2. 9.2.2.2.2 Inductor Selection
          3. 9.2.2.2.3 Output Capacitor Selection
          4. 9.2.2.2.4 Input Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Microcontroller Power Supply
      2. 9.3.2 Inverting Power Supply
      3. 9.3.3 TPS62175 Adjustable Output Voltages
        1. 9.3.3.1 5-V / 0.5-A Power Supply
        2. 9.3.3.2 2.5-V / 0.5-A Power Supply
        3. 9.3.3.3 1.8-V / 0.5-A Power Supply
        4. 9.3.3.4 1.2-V / 0.5-A Power Supply
        5. 9.3.3.5 1-V / 0.5-A Power Supply
      4. 9.3.4 TPS62177 Fixed 3.3-V / 0.5-A Power Supply
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Information
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQC|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Documentation Support

12.2.1 Related Documentation

Refer to the following documents for more information:

  • Optimizing the TPS62175 Output Filter, SLVA543
  • Powering Tiva™ C Series Microcontrollers Using the High Efficiency DCS-Control™ Topology, SPMA066
  • Using the TPS62175 in an Inverting Buck Boost Topology, SLVA542
  • TPS62175EVM-098 Evaluation Module, SLVU743
  • Semiconductor and IC Package Thermal Metrics, SPRA953
  • Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs, SZZA017

12.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 4. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS62175 Click here Click here Click here Click here Click here
TPS62177 Click here Click here Click here Click here Click here

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.5 Trademarks

DCS-Control, E2E are trademarks of Texas Instruments.

ARM Cortex is a trademark of ARM Limited.

All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.7 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.