SLVSB35C October   2012  – July 2015 TPS62175 , TPS62177

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Enable/Shutdown (EN)
      2. 8.3.2 Output Discharge
      3. 8.3.3 Current Limit and Short Circuit Protection
      4. 8.3.4 Power Good (PG)
      5. 8.3.5 Undervoltage Lockout (UVLO)
      6. 8.3.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Soft Start
      2. 8.4.2 Pulse Width Modulation (PWM) Operation
      3. 8.4.3 Power Save Mode Operation
      4. 8.4.4 Sleep Mode Operation
      5. 8.4.5 100% Mode Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Programming the Output Voltage
        2. 9.2.2.2 External Component Selection
          1. 9.2.2.2.1 Output Filter and Loop Stability
          2. 9.2.2.2.2 Inductor Selection
          3. 9.2.2.2.3 Output Capacitor Selection
          4. 9.2.2.2.4 Input Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Microcontroller Power Supply
      2. 9.3.2 Inverting Power Supply
      3. 9.3.3 TPS62175 Adjustable Output Voltages
        1. 9.3.3.1 5-V / 0.5-A Power Supply
        2. 9.3.3.2 2.5-V / 0.5-A Power Supply
        3. 9.3.3.3 1.8-V / 0.5-A Power Supply
        4. 9.3.3.4 1.2-V / 0.5-A Power Supply
        5. 9.3.3.5 1-V / 0.5-A Power Supply
      4. 9.3.4 TPS62177 Fixed 3.3-V / 0.5-A Power Supply
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Information
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQC|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

spacing

DQC Package
10-Pin WSON
Top View
TPS62175 TPS62177 SLVSAB35_pinout.gif

spacing

spacing

Pin Functions

PIN (1) I/O DESCRIPTION
NAME NO.
PGND 1 — Power ground connection
VIN 2 I Supply voltage for the converter
EN 3 I Enable input (High = enabled, Low = disabled)
NC 4 — This pin is recommended to be connected to AGND but can left be floating
FB 5 I Voltage feedback of adjustable version. Connect resistive divider to this pin. TI recommends connecting FB to AGND for fixed voltage versions for improved thermal performance.
AGND 6 — Analog ground connection
PG 7 O Output power good (open drain, requires pullup resistor)
SLEEP 8 I Sleep mode input (High = normal operation, Low = sleep mode operation). Can be operated dynamically during operation. If sleep mode is not used, connect to VOUT.
SW 9 O Switch node, connected to the internal MOSFET switches. Connect inductor between SW and output capacitor.
VOS 10 I Output voltage sense pin and connection for the control loop circuitry.
Exposed Thermal Pad — — Must be connected to AGND and PGND. Must be soldered to achieve appropriate power dissipation and mechanical reliability.
(1) For more information about connecting pins, see Detailed Description and Application and Implementation sections.