SLVSB02B November   2013  – July 2014 TPS62740 , TPS62742

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DCS-Control™
      2. 7.3.2 CTRL / Output Load
      3. 7.3.3 Enable / Shutdown
      4. 7.3.4 Power Good Output (PG)
      5. 7.3.5 Output Voltage Selection (VSEL1 - 4)
      6. 7.3.6 Softstart
      7. 7.3.7 Undervoltage Lockout UVLO
    4. 7.4 Device Functional Modes
      1. 7.4.1 VOUT And LOAD Output Discharge
      2. 7.4.2 Automatic Transition Into 100% Mode
      3. 7.4.3 Internal Current Limit
      4. 7.4.4 Dynamic Voltage Scaling with VSEL Interface
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Inductor Selection
        2. 8.2.1.2 DC/DC Output Capacitor Selection
        3. 8.2.1.3 Input Capacitor Selection
      2. 8.2.2 Application Curves
    3. 8.3 System Example
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

As for all switching power supplies, the layout is an important step in the design. Care must be taken in board layout to get the specified performance. If the layout is not carefully done, the regulator could show poor line and/or load regulation, stability issues as well as EMI problems and interference with RF circuits. It is critical to provide a low inductance, impedance ground path. Therefore, use wide and short traces for the main current paths. The input capacitor should be placed as close as possible to the IC pins VIN and GND. The output capacitor should be placed close between VOUT and GND pins. The VOUT line should be connected to the output capacitor and routed away from noisy components and traces (e.g. SW line) or other noise sources. The exposed thermal pad of the package and the GND pin should be connected. See Figure 43 for the recommended PCB layout.

10.2 Layout Example

TPS62740_Layout_min.gifFigure 43. Recommended PCB Layout