SLUSDN8
March 2021
TPS62865
,
TPS62867
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Device Options
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Power Save Mode
8.3.2
Forced PWM Mode
8.3.3
100% Duty Cycle Mode Operation
8.3.4
Soft Start
8.3.5
Switch Current Limit and HICCUP Short-Circuit Protection
8.3.6
Undervoltage Lockout
8.3.7
Thermal Shutdown
8.4
Device Functional Modes
8.4.1
Enable and Disable (EN)
8.4.2
Power Good (PG)
8.4.3
Voltage Setting and Mode Selection (VSET/MODE)
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Custom Design With WEBENCH® Tools
9.2.2.2
Setting The Output Voltage
9.2.2.3
Output Filter Design
9.2.2.4
Inductor Selection
9.2.2.5
Capacitor Selection
9.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
11.2.1
Thermal Considerations
12
Device and Documentation Support
12.1
Device Support
12.1.1
Third-Party Products Disclaimer
12.1.2
Development Support
12.1.2.1
Custom Design With WEBENCH® Tools
12.2
Documentation Support
12.2.1
Related Documentation
12.3
Support Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RQY|9
MPQF584
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slusdn8_oa
slusdn8_pm
12.2.1
Related Documentation
For related documentation, see the following:
Texas Instruments,
Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs
application report
Texas Instruments,
Semiconductor and IC Package Thermal Metrics
application report