SLVSGG8C November   2023  – October 2024 TPS6287B10 , TPS6287B15 , TPS6287B20 , TPS6287B25 , TPS6287B30

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed-Frequency DCS-Control Topology
      2. 8.3.2  Forced-PWM and Power-Save Modes
      3. 8.3.3  Transient Non-Synchronous Mode (optional)
      4. 8.3.4  Precise Enable
      5. 8.3.5  Start-Up
      6. 8.3.6  Switching Frequency Selection, Only Applies to TPS6287BxxJE2
      7. 8.3.7  Output Voltage Setting
        1. 8.3.7.1 Output Voltage Range
        2. 8.3.7.2 Output Voltage Setpoint
        3. 8.3.7.3 Non-Default Output Voltage Setpoint
        4. 8.3.7.4 Dynamic Voltage Scaling
        5. 8.3.7.5 Droop Compensation
      8. 8.3.8  Compensation (COMP)
      9. 8.3.9  Mode Selection / Clock Synchronization (MODE/SYNC)
      10. 8.3.10 Spread Spectrum Clocking (SSC)
      11. 8.3.11 Output Discharge
      12. 8.3.12 Undervoltage Lockout (UVLO)
      13. 8.3.13 Overvoltage Lockout (OVLO)
      14. 8.3.14 Overcurrent Protection
        1. 8.3.14.1 Cycle-by-Cycle Current Limiting
        2. 8.3.14.2 Hiccup Mode
        3. 8.3.14.3 Current-Limit Mode
      15. 8.3.15 Power Good (PG)
        1. 8.3.15.1 Standalone, Primary Device Behavior
        2. 8.3.15.2 Secondary Device Behavior
      16. 8.3.16 Remote Sense
      17. 8.3.17 Thermal Warning and Shutdown
      18. 8.3.18 Stacked Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
      2. 8.4.2 Undervoltage Lockout
      3. 8.4.3 Standby
      4. 8.4.4 On
    5. 8.5 Programming
      1. 8.5.1 Serial Interface Description
      2. 8.5.2 Standard-, Fast-, Fast-Mode Plus Protocol
      3. 8.5.3 HS-Mode Protocol
      4. 8.5.4 I2C Update Sequence
      5. 8.5.5 I2C Register Reset
      6. 8.5.6 Dynamic Voltage Scaling (DVS)
  10. 9 Device Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Inductor Selection
        2. 10.2.2.2 Selecting the Input Capacitors
        3. 10.2.2.3 Selecting the Compensation Resistor
        4. 10.2.2.4 Selecting the Output Capacitors
        5. 10.2.2.5 Selecting the Compensation Capacitor CC
        6. 10.2.2.6 Selecting the Compensation Capacitor CC2
      3. 10.2.3 Application Curves
    3. 10.3 Typical Application - TPS6287BxV Devices
      1. 10.3.1 Design Requirements for TPS6287BxV
    4. 10.4 Typical Application Using Two TPS6287B25 in a Stacked Configuration
      1. 10.4.1 Design Requirements For Two Stacked Devices
      2. 10.4.2 Detailed Design Procedure
        1. 10.4.2.1 Selecting the Compensation Resistor
        2. 10.4.2.2 Selecting the Output Capacitors
        3. 10.4.2.3 Selecting the Compensation Capacitor CC
      3. 10.4.3 Application Curves for Two Stacked Devices
    5. 10.5 Typical Application Using Three TPS6287B25 in a Stacked Configuration
      1. 10.5.1 Application Curves
    6. 10.6 Power Supply Recommendations
    7. 10.7 Layout
      1. 10.7.1 Layout Guidelines
      2. 10.7.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

TPS6287B10 TPS6287B15 TPS6287B20 TPS6287B25 TPS6287B30 RZV Package 24 Pin WQFNFigure 5-1 RZV Package 24 Pin WQFN
Table 5-1 Pin Functions
PINTYPE(1)DESCRIPTION
NO.NAME
1VOSNS

I

Output voltage sense (differential output voltage sensing).
2ENIThis pin is the enable pin of the device. Connect to this pin using a series resistor of at least 15kΩ. A logic low level on this pin disables the device, and a logic high level on the pin enables the device. Do not leave this pin unconnected.

For stacked operation interconnect EN pins of all stacked devices with a resistor to the supply voltage or a GPIO of a processor. See Section 8.3.18 for a detailed description.

3VSET1IStart-up output voltage set pin. A resistor or short-circuit to GND or VIN defines the selected output voltage. See Table 8-5
3FSET

I

Only applies to TPS6287BxxJE2WRZVR. Frequency select pin. A resistor or a short circuit to GND or VIN determines the switching frequency if not externally synchronized. See Section 8.3.6 for the frequency options.
4VSET2IStart-up output voltage set pin. A resistor or short-circuit to GND or VIN defines the selected output voltage. See Table 8-5
5, 6, 15, 16VINPPower supply input. Connect the input capacitor as close as possible between pin VIN and GND.
7, 8,

13, 14

GNDGNDGround pin
9, 10, 11, 12SWOThis pin is the switch pin of the converter and is connected to the internal Power MOSFETs.
17SYNCOUTOInternal clock output pin for synchronization in stacked mode. Leave this pin floating for single device operation. Connect this pin to the MODE/SYNC pin of the next device in the daisy-chain in stacked operation. Do not use this pin to connect to a non-TPS6287Bx- device.

During start-up, this pin is used to identify if a device must operate as a secondary converter in stacked operation. Connect a 47kΩ resistor from this pin to GND to define a secondary converter in stacked operation. See Section 8.3.18 for a detailed description.

18MODE/SYNCIThe device runs in Power-Save mode when this pin is pulled low. If the pin is pulled high, the device runs in Forced-PWM mode. Do not leave this pin unconnected. The mode pin can also be used to synchronize the device to an external clock.

19

VSET4

I

Start-up output voltage set pin. A logic low level or a logic high level on the pin defines the start-up output voltage according to Table 8-7

19

SDA

I/O

I2C serial data pin. Do not leave this pin floating. Connect a pullup to logic high level.

Connect to GND for secondary devices in stacked operation.

20

VSET3

IStart-up output voltage set pin. A logic low level or a logic high level on the pin defines the start-up output voltage according to Table 8-7

20

SCLI/OI2C serial clock pin. Do not leave this pin floating. Connect a pullup resistor to a logic high level.

Connect to GND for secondary devices in stacked operation.

21

PGI/OOpen drain power-good output. Low impedance when not "power good", high impedance when "power good". This pin can be left open or be tied to GND when not used in single device operation.

In stacked operation interconnect the PG pins of all stacked devices. Only the PG pin of the primary converter in stacked operation is an open drain output. For devices that are defined as secondary converters in stacked mode the pin is an input pin. See Section 8.3.18 for a detailed description.

22

AGNDGNDAnalog Ground. Connect to GND.

23

COMP—Device compensation input. A resistor and capacitor from this pin to AGND define the compensation of the control loop.

In stacked operation connect the COMP pins of all stacked devices together and connect a resistor and capacitor between the common COMP node and AGND.

24

GOSNS

—

Output ground sense (differential output voltage sensing)

Exposed Thermal Pads

—The thermal pads must be soldered to GND to achieve an appropriate thermal resistance and for mechanical stability.
(1) I = input, O = output, P = power, GND = ground