SLVS653C June 2008 – February 2016 TPS63010 , TPS63011 , TPS63012
PRODUCTION DATA.
MIN | MAX | UNIT | ||
---|---|---|---|---|
VI | Input voltage on VIN, VINA, VINA1, L1, L2, VOUT, PS, SYNC, VSEL, EN, FB | –0.3 | 7 | V |
TJ | Operating junction temperature | –40 | 150 | °C |
Tstg | Storage temperature | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(3) | ±2500 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)(3) | ±150 | |||
Machine model (MM) (3) | ±1000 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
Supply voltage at VIN, VINA | 2 | 5.5 | V | |
Operating free air temperature, TA | –40 | 85 | °C | |
Operating junction temperature, TJ | –40 | 125 | °C |
THERMAL METRIC(1) | TPS6301x | UNIT | |
---|---|---|---|
YFF (DSBGA) | |||
20 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 71.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 0.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 11.4 | °C/W |
ψJT | Junction-to-top characterization parameter | 2 | °C/W |
ψJB | Junction-to-board characterization parameter | 11.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |
PACKAGE(1) | THERMAL RESISTANCE RθJA |
POWER RATING TA ≤ 25°C |
DERATING FACTOR ABOVE TA = 25°C |
---|---|---|---|
YFF | 84 °C/W | 1190 mW | 12 mW/°C |