SLVSAM8D July 2013 – August 2019 TPS63050 , TPS63051
PRODUCTION DATA.
THERMAL METRIC(1) | TPS6305x | UNIT | ||
---|---|---|---|---|
WCSP | RMW | |||
12 PINS | 12 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 89.9 | 37.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 0.7 | 30.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 43.9 | 8.0 | °C/W |
ψJT | Junction-to-top characterization parameter | 2.9 | 0.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 43.7 | 7.8 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | 2.5 | °C/W |