SLVSGO6B December   2022  – January 2025 TPS631010 , TPS631011

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Rating
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics 
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Enable and Soft Start
      3. 7.3.3 Adjustable Output Voltage
      4. 7.3.4 Mode Selection (PFM/FPWM)
      5. 7.3.5 Output Discharge
      6. 7.3.6 Reverse Current Operation
      7. 7.3.7 Protection Features
        1. 7.3.7.1 Input Overvoltage Protection
        2. 7.3.7.2 Output Overvoltage Protection
        3. 7.3.7.3 Short Circuit Protection
        4. 7.3.7.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Setting the Output Voltage
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design with WEBENCH Tools
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Shutdown

To avoid thermal damage of the device, the temperature of the die is monitored. The device stops operation once the sensed temperature rises over the thermal threshold. After the temperature drops below the thermal shutdown hysteresis, the converter returns to normal operation.