SLVSBJ1B September   2012  – January 2017 TPS65051-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Operation
      2. 7.3.2  DCDC1 Converter
      3. 7.3.3  DCDC2 Converter
      4. 7.3.4  Dynamic Voltage Positioning
      5. 7.3.5  Soft Start
      6. 7.3.6  100% Duty-Cycle Low-Dropout Operation
      7. 7.3.7  Undervoltage Lockout
      8. 7.3.8  Mode Selection
      9. 7.3.9  Enable
      10. 7.3.10 RESET
      11. 7.3.11 Short-Circuit Protection
      12. 7.3.12 Thermal Shutdown
      13. 7.3.13 Low Dropout Voltage Regulators
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Save Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output-Voltage Setting
          1. 8.2.2.1.1 Converter 1 (DCDC1)
          2. 8.2.2.1.2 Converter 2 (DCDC2)
        2. 8.2.2.2 Output Filter Design (Inductor and Output Capacitor)
          1. 8.2.2.2.1 Inductor Selection
          2. 8.2.2.2.2 Output-Capacitor Selection
          3. 8.2.2.2.3 Input-Capacitor Selection
        3. 8.2.2.3 Low-Dropout Voltage Regulators (LDOs)
        4. 8.2.2.4 RESET
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resource
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VI Input voltage on all pins except AGND, PGND, and EN_LDO1 pins with respect to AGND –0.3 7 V
Input voltage range on EN_LDO1 pins with respect to AGND –0.3 VCC + 0.5
II Current at VINDCDC1/2, L1, PGND1, L2, PGND2 1800 mA
Current at all other pins 1000 mA
VO Output voltage for LDO1, LDO2, LDO3, and LDO4 –0.3 4 V
Continuous total power dissipation See the Thermal Information
TA Operating free-air temperature –40 125 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) 2000 V
Charged-device model (CDM), per AEC Q100-011 750 V
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VI Input voltage for step-down converters, VINDCDC1/2 2.5 6 V
VO Output voltage for step-down converter, VDCDC1 0.6 VINDCDC1/2 V
Output voltage for step-down converter, VDCDC2 0.6 VINDCDC1/2 V
VI Input voltage for LDOs, VINLDO1, VINLDO2, VINLDO3/4 1.5 6.5 V
VO Output voltage for LDO1 and LDO2 1 3.6 V
Output voltage for LDO3 and LDO4 1 3.6 V
IO Output current at L1 (DCDC1) 1000 mA
Output current at L2 (DCDC2) 600 mA
Output current at VLDO1, VLDO2 400 mA
Output current at VLDO3, VLDO4 200 mA
Inductor at L1, L2(1) 1.5 2.2 μH
CO Output capacitor at VDCDC1, VDCDC2(1) 10 22 μF
Output capacitor at VLDO1, VLDO2, VLDO3, VLDO4(1) 2.2 μF
CI Input capacitor at VCC(1) 1 μF
Input capacitor at VINLDO1, VINLDO2(1) 2.2 μF
Input capacitor at VINLDO3/4(1) 2.2 μF
TA Operating ambient temperature –40 125 °C
Resistor from battery voltage to VCC used for filtering(2) 1 10 Ω
(1) See the Application Information section of this data sheet for more details.
(2) Up to 2 mA can flow into VCC; when both converters are running in PWM, this resistor causes the UVLO threshold to shift accordingly.

6.4 Thermal Information

THERMAL METRIC(1) TPS65051-Q1 UNIT
RSM (VQFN)
32 PINS
RθJA Junction-to-ambient thermal resistance 37.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 30.1 °C/W
RθJB Junction-to-board thermal resistance 7.8 °C/W
ψJT Junction-to-top characterization parameter 0.4 °C/W
ψJB Junction-to-board characterization parameter 7.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

VCC = VINDCDC1/2 = 3.6 V, EN = VCC, MODE = GND, L = 2.2 μH, CO = 10 μF, TA = –40°C to 125°C, typical values are at TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
VI Input voltage range at VINDCDC1/2 2.5 6 V
IQ Operating quiescent current
Total current into VCC, VINDCDC1/2, VINLDO1, VINLDO2, VINLDO3/4		 One converter, IO = 0 mA.
PFM mode enabled (Mode = GND) device not switching, EN_DCDC1 = VI OR EN_DCDC2 = VI;
EN_LDO1= EN_LDO2 = EN_LDO3 = EN_LDO = GND		 20 30 μA
Two converters, IO = 0 mA
PFM mode enabled (Mode = 0) device not switching,
EN_DCDC1 = VI AND EN_DCDC2 = VI;
EN_LDO1 = EN_LDO2 = EN_LDO3 = EN_LDO4 = GND		 32 40 μA
One converter, IO = 0 mA.
PFM mode enabled (Mode = GND) device not switching, EN_DCDC1 = VI OR EN_DCDC2 = VI;
EN_LDO1 = EN_LDO2 = EN_LDO3 = EN_LDO4 = VI 		180 250 μA
IQ Operating quiescent current into VCC One converter, IO = 0 mA.
Switching with no load (Mode = VI), PWM operation EN_DCDC1 = VI OR EN_DCDC2 = VI; EN_LDO1 = EN_LDO2 = EN_LDO3 = EN_LDO = GND		 0.85 mA
Two converters, IO = 0 mA
Switching with no load (Mode = VI), PWM operation EN_DCDC1 = VI AND EN_DCDC2 = VI; EN_LDO1 = EN_LDO2 = EN_LDO3 = EN_LDO = GND		 1.25 mA
I(SD) Shutdown current EN_DCDC1 = EN_DCDC2 = GND EN_LDO1 = EN_LDO2 = EN_LDO3 = EN_LDO4 = GND 9 12 μA
V(UVLO) Undervoltage lockout threshold for DC-DC converters and LDOs Voltage at VCC 1.8 2 V
EN_DCDC1, EN_DCDC2, DEFDCDC2, DEFLDO1, DEFLDO2, DEFLDO3, DEFLDO4, EN_LDO1, EN_LDO2, EN_LDO3, EN_LDO4
VIH High-level input voltage MODE, EN_DCDC1, EN_DCDC2, DEFDCDC2, DEFLDO1, DEFLDO2, DEFLDO3, DEFLDO4, EN_LDO1, EN_LDO2, EN_LDO3, EN_LDO4 1.2 VCC V
VIL Low-level input voltage MODE, EN_DCDC1, EN_DCDC2, DEFLDO1, DEFLDO2, DEFLDO3, DEFLDO4, EN_LDO1, EN_LDO2, EN_LDO3, EN_LDO4, DEFDCDC2 0 0.4 V
IlB Input bias current MODE = GND or VI MODE, EN_DCDC1, EN_DCDC2, DEFDCDC2,
DEFLDO1, DEFLDO2, DEFLDO3, DEFLDO4, EN_LDO1, EN_LDO2,
EN_LDO3, EN_LDO4		 0.01 1 μA
V_FB_LDOx = 1 V, FB_LDO1, FB_LDO2, FB_LDO3, FB_LDO4 100 nA
POWER SWITCH
rDS(on) P-channel MOSFET on-resistance DCDC1 VINDCDC1/2 = 3.6 V 280 630 mΩ
VINDCDC1/2 = 2.5 V 400
DCDC2 VINDCDC1/2 = 3.6 V 280 630
VINDCDC1/2 = 2.5 V 400
Ilkg P-channel leakage current VDCDCx = V(DS) = 6 V 1 μA
rDS(on) N-channel MOSFET on-resistance DCDC1 VINDCDC1/2 = 3.6 V 220 450 mΩ
VINDCDC1/2 = 2.5 V 320
DCDC2 VINDCDC1/2 = 3.6 V 220 450
VINDCDC1/2 = 2.5 V 320
Ilkg N-channel leakage current VDCDCx = V(DS) = 6 V 7 10 μA
I(LIMF) Forward current limit PMOS (high side) and NMOS (low side) DCDC1, 2.5 V ≤ VINDCDC1/2 ≤ 6 V 1.19 1.4 1.65 A
DCDC2, 2.5 V ≤ VINDCDC1/2 ≤ 6 V 0.85 1 1.15
Thermal shutdown Increasing junction temperature 150 °C
Thermal shutdown hysteresis Decreasing junction temperature 20 °C
OUTPUT
VO Output-voltage range for DCDC1, DCDC2 0.6 VINDCDC1/2 V
Vref Reference voltage 600 mV
VO DC output-voltage accuracy, DCDC1, DCDC2(1) VINDCDC1/2 = 2.5 V to 6 V, 0 mA < IO = < IO(maximum)
MODE = GND, PFM operation		 –2% 0 2%
VINDCDC1/2 = 2.5 V to 6 V, 0 mA < IO = < IO(maximum)
MODE = VI, PWM operation		 –1% 0 1%
ΔVO Power-save-mode ripple voltage(2) IO = 1 mA, MODE = GND, VO = 1.3 V, bandwith = 20 MHz 25 mVPP
VOL RESET, PB_OUT output low voltage IOL = 1 mA, Vhysteresis < 1 V, Vthreshold < 1 V 0.2 V
IOL RESET, PB_OUT sink current 1 mA
RESET, PB_OUT output leakage current After PB_IN has been pulled high once; Vthreshold > 1 V and Vhysteresis > 1 V, VOH = 6 V 10 nA
Vth Vthreshold, Vhysteresis threshold 0.98 1 1.02 V
VLDO1, VLDO2, VLDO3 AND VLDO4 LOW-DROPOUT REGULATORS
VI Input-voltage range for LDO1, LDO2, LDO3, LDO4 1.5 6.5 V
V(FB) Feedback voltage for FB_LDO1, FB_LDO2, FB_LDO3, and FB_LDO4 1 V
IO Maximum output current for LDO1, LDO2 400 mA
Maximum output current for LDO3, LDO4 200
I(SC) LDO1 short-circuit current limit VLDO1 = GND 750 mA
LDO2 short-circuit current limit VLDO2 = GND 850
LDO3 and LDO4 short-circuit current limit VLDO3 = GND, VLDO4 = GND 420
Dropout voltage at LDO1 IO = 400 mA, VINLDO = 3.4 V 400 mV
Dropout voltage at LDO2 IO = 400 mA, VINLDO = 1.8 V 280
Dropout voltage at LDO3, LDO4 IO = 200 mA, VINLDO = 1.8 V 280
Ilkg Leakage current from VinLDOx to VLDOx LDO enabled, VINLDO = 6.5 V, VO = 1 V at TA = 140°C 3 μA
VO Output voltage accuracy for LDO1, LDO2, LDO3, LDO4 IO = 10 mA –2% 1%
Line regulation for LDO1, LDO2, LDO3, LDO4 VINLDO1,2 = VLDO1,2 + 0.5 V (minimum 2.5 V) to 6.5 V,
VINLDO3,4 = VLDO3,4 + 0.5 V (minimum 2.5 V) to 6.5 V,
IO = 10 mA		 –1% 1%
Load regulation for LDO1, LDO2, LDO3, LDO4 IO = 0 mA to 400 mA for LDO1, LDO2
IO = 0 mA to 200 mA for LDO3, LDO4		 –1% 1%
PSRR Power-supply rejection ratio f = 10 kHz; IO = 50 mA; VI = VO + 1 V 70 dB
R(DIS) Internal discharge resistor at VLDO1, VLDO2, VLDO3, VLDO4 Active when LDO is disabled 350 Ω
Thermal shutdown Increasing junction temperature 140 °C
Thermal shutdown hysteresis Decreasing junction temperature 20 °C
(1) Output voltage specification does not include tolerance of external voltage-programming resistors.
(2) In power-save mode, device typically enters operation at IPSM = VI / 32 Ω.

6.6 Switching Characteristics

VCC = VINDCDC1/2 = 3.6 V, EN = VCC, MODE = GND, L = 2.2 μH, CO = 10 μF, TA = –40°C to 125°C, typical values are at TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OSCILLATOR
fSW Oscillator frequency 2.025 2.25 2.475 MHz
OUTPUT
tStart Start-up time Time from active EN to start switching 170 μs
tRamp VOUT ramp-up time Time to ramp from 5% to 95% of VO 750 μs
RESET delay time Input voltage at threshold pin rising 80 100 120 ms
PB-ONOFF debounce time 26 32 38 ms
VLDO1, VLDO2, VLDO3 AND VLDO4 LOW-DROPOUT REGULATORS
Regulation time for LDO1, LDO2, LDO3, LDO4 Load change from 10% to 90% 10 μs

6.7 Typical Characteristics

TPS65051-Q1 eff1_v_vo_lvs710.gif Figure 1. Efficiency vs Output Current
TPS65051-Q1 eff3_v_vo_lvs710.gif Figure 3. Efficiency vs Output Current
TPS65051-Q1 pssr_v_f_lvs710.gif Figure 5. Power-Supply Rejection Ratio vs Frequency
TPS65051-Q1 eff2_v_vo_lvs710.gif Figure 2. Efficiency vs Output Current
TPS65051-Q1 eff4_v_vo_lvs710.gif Figure 4. Efficiency vs Output Current