SLVSD80D November   2015  – May 2021 TPS65235

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Boost Converter
      2. 7.3.2  Linear Regulator and Current Limit
      3. 7.3.3  Boost Converter Current Limit
      4. 7.3.4  Charge Pump
      5. 7.3.5  Slew Rate Control
      6. 7.3.6  Short Circuit Protection, Hiccup and Overtemperature Protection
      7. 7.3.7  Tone Generation
      8. 7.3.8  Tone Detection
      9. 7.3.9  Disable and Enable
      10. 7.3.10 Component Selection
        1. 7.3.10.1 Boost Inductor
        2. 7.3.10.2 Capacitor Selection
        3. 7.3.10.3 Surge Components
        4. 7.3.10.4 Consideration for Boost Filtering and LNB Noise
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 TPS65235 I2C Update Sequence
    6. 7.6 Register Maps
      1. 7.6.1 Control Register 1 (address = 0x00H) [reset = 00010000]
      2. 7.6.2 Control Register 2 (address = 0x01H) [reset = 0000101]
      3. 7.6.3 Status Register (address = 0x02H) [reset = x0100000]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application for DiSEqc1.x Support
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
      4. 8.2.4 Typical Application for DiSEqc2.x Support
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
VoltageVIN, LX, BOOST, VLNB130V
VCP, GDR (referenced to VLNB pin)–0.37
VCC, EN, ADDR, FAULT, SCL, SDA, VCTRL, EXTM, DOUT, DIN, TCAP–0.37
ISET–0.33.6
PGND–0.30.3
Operating junction temperature, TJ–40150°C
Storage temperature, Tstg–55150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.