SLVSD50D March 2016 – June 2017 TPS65320C-Q1
PRODUCTION DATA.
VALUE | UNIT | ||||
---|---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | ±2000 | V | |
Charged-device model (CDM), per AEC Q100-011 | All pins | ±500 | |||
Corner pins (1, 7, 8, and 14) | ±750 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
Supply inputs | VIN | 3.6 | 36 | V |
VIN_LDO | 3 | 20 | ||
Buck regulator | BOOT1 | 3.6 | 42 | V |
SW1 | –1 | 36 | ||
VFB1 | 0 | 0.8 | ||
SS | 0 | 3 | ||
COMP | 0 | 3 | ||
RT/CLK | 0 | 3 | ||
LDO regulator | LDO_OUT | 1.1 | 5.5 | V |
VFB2 | 0 | 0.8 | ||
nRST | 0 | 5.25 | ||
Control | EN1 | 0 | 36 | V |
EN2 | 0 | 36 | ||
Temperature | Operating junction temperature range, TJ | –40 | 150 | °C |
THERMAL METRIC(1) | TPS65320C-Q1 | UNIT | |
---|---|---|---|
PWP (HTSSOP) | |||
14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 41 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 33.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 25.4 | °C/W |
ψJT | Junction-to-top characterization parameter | 1.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 25.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.7 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
VIN (INPUT POWER SUPPLY) | ||||||
Operating input voltage | Normal mode, after initial start-up | 3.6 | 12 | 36 | V | |
Shutdown supply current | V(EN1) = V(EN2) = 0 V, 25°C | 2 | 7 | μA | ||
Initial start-up voltage | 6 | 36 | V | |||
ENABLE AND UVLO (EN1 AND EN2 PINS) | ||||||
Enable low level | 0.7 | V | ||||
Enable high level | 2.5 | V | ||||
V(VIN)(f) | Internal UVLO falling threshold | Ramp V(VIN) down until output turns OFF | 1.8 | 2.6 | 3 | V |
V(VIN)(r) | Internal UVLO rising threshold | Ramp V(VIN) up until output turns ON | 2.2 | 2.8 | 3.2 | V |
BUCK REGULATOR | ||||||
I(Qon) | Operating: non-switching supply | Measured at the VIN pin V(FB1) = 0.83 V, V(VIN) = 12 V, 25°C |
110 | 140 | μA | |
Output capacitance | ESR = 0.001 Ω to 0.1 Ω, large output capacitance may be required for load transient | 10 | μF | |||
V(ref1) | Voltage reference for FB1 pin | Buck regulator output: 1.1 V to 20 V. Buck regulator in continuous conducting mode without pulse-skipping |
0.788 | 0.8 | 0.812 | V |
DC output voltage accuracy | Includes voltage references, DC load and line regulation, process and temperature | –2% | 2% | |||
DC(LDR) | DC Load regulation, ΔVOUT / VOUT | IOUT = 0 to IOUTmax | 0.5% | |||
T(LDSR) | Transient load step response | V(VIN) = 12 V, IOUT = 200 mA to 3 A, TR = TF = 1 µs, Buck Output Voltage = 5 V, ƒS = 2 MHz |
5% | |||
BUCK REGULATOR: HIGH-SIDE MOSFET | ||||||
r(DS(on) HS FET) | On-resistance | V(VIN) = 12 V, V(SW) = 6 V | 127 | 250 | mΩ | |
BUCK REGULATOR: CURRENT-LIMIT | ||||||
Current-limit threshold | V(VIN) = 12 V, TJ = 25°C | 4 | 6 | A | ||
BUCK REGULATOR: TIMING RESISTOR AND EXTERNAL CLOCK (RT/CLK PIN) | ||||||
RT/CLK | High threshold | 1.9 | 2.2 | V | ||
RT/CLK | Low threshold | 0.5 | 0.7 | V | ||
LDO REGULATOR | ||||||
ΔVO(ΔVI) | Line regulation | V(VIN_LDO) = 6 V to 20 V, V(VIN) = 20 V, I(LDO_OUT) = 10 mA, V(LDO_OUT) = 3.3 V | 20 | mV | ||
ΔVO(ΔIL) | Load regulation | I(LDO_OUT) = 10 mA to 200 mA, V(VIN) = 12 V, V(VIN_LDO) = 5 V, V(LDO_OUT) = 3.3 V |
35 | mV | ||
VDROPOUT | Dropout voltage (V(VIN_LDO) – V(LDO_OUT)) |
I(LDO_OUT) = 200 mA | 300 | 450 | mV | |
I(LDO_OUT) | Output current | V(LDO_OUT) in regulation, V(VIN) ≥ 4 V | 280 | mA | ||
VI(VIN_LDO) | Operating input voltage on VIN_LDO pin | V(LDO_OUT) in regulation | 3 | 20 | V | |
V(ref2) | Voltage reference FB2 pin | V(LDO_OUT) = 1.1 V to 5.5 V | 0.788 | 0.8 | 0.812 | V |
ICL(LDO_OUT) | Output current-limit | V(LDO_OUT) = 0 V (the LDO_OUT pin is shorted to ground) | 280 | 1000 | mA | |
IQ(LDO) | Quiescent current | V(VIN) = 12 V; Measured at VIN pin V(EN1) = 0 V, V(EN2) = 5 V, I(LDO_OUT) = 0.01 mA to 0.75 mA |
45 | 65 | μA | |
PSRR | Power supply ripple rejection | V(VIN_LDO)(rip) = 0.5 VPP, I(LDO_OUT) = 200 mA, frequency (ƒ) = 100 Hz, V(LDO_OUT) = 5 V and V(LDO_OUT) = 3.3 V |
60 | dB | ||
V(VIN_LDO)(rip) = 0.5 VPP, I(LDO_OUT) = 200 mA, ƒ = 150 kHz, V(LDO_OUT) = 5 V and V(LDO_OUT) = 3.3 V |
30 | dB | ||||
C(LDO_OUT) | Output capacitor | ESR = 0.001 Ω to 100 mΩ, large output capacitance may be required for load transient; V(LDO_OUT) ≥ 3.3 V | 1 | 40 | μF | |
C(LDO_OUT) | Output capacitor | ESR = 0.001 Ω to 100 mΩ, large output capacitance may be required for load transient; 1.2 V ≤ V(LDO_OUT) < 3.3 V | 20 | 40 | μF | |
LDO REGULATOR: RESET (nRST PIN) | ||||||
RESET threshold | V(LDO_OUT) decreasing | 85% | 90% | 95% | ||
VOH | Output high | Reset released due to rising LDO_OUT, V(LDO_OUT) ≥ 3.3 V, IOH= 100 μA(1) | –5% × V(LDO_OUT) | V | ||
VOL | Output low | Reset asserted due to falling LDO_OUT, IOL = 1 mA | 0.045 | 0.4 | V | |
OVER TEMPERATURE PROTECTION | ||||||
TSD | Thermal-shutdown trip point | 175 | ºC | |||
Thys | Hysteresis | 10 | ºC |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
BUCK REGULATOR: HIGH-SIDE MOSFET | ||||||
tonmin | Minimum on-time | ƒS = 2.5 MHz | 115 | ns | ||
BUCK REGULATOR: TIMING RESISTOR AND EXTERNAL CLOCK (RT/CLK PIN) | ||||||
ƒS | Switching-frequency range using RT mode | 100 | 2500 | kHz | ||
Switching frequency | 200-kΩ resistor connected between pin RT/CLK and GND | 523 | 585 | 640 | kHz | |
Switching-frequency range using CLK mode | 300 | 2200 | kHz | |||
Minimum CLK input pulse width | Measures at CLK input = 2.2 MHz | 30 | ns | |||
RT/CLK | Falling edge to SW rising edge delay | Measured at 500 kHz with 200-kΩ series resistor connected to RT/CLK pin | 60 | ns | ||
PLL | Lock-in time | Measured at 500 kHz | 100 | μs | ||
LDO REGULATOR: RESET (nRST PIN) | ||||||
Filter time | Delay before asserting nRST low | 7 | 14 | 21 | μs |
ƒS = 2 MHz | 3.6 V ≤ V(VIN) ≤ 6 V |
V(VIN) = 12 V | TJ = 25°C |
V(VIN_LDO) = 5 V | V(LDO_OUT) = 3.3 V |
I(LDO_OUT) = 100 mA | V(VIN_LDO) = 5 V |
V(VIN) = 12 V |
No Load | V(VIN) = 12 V |
V(LDO_OUT) = 3.3 V |