SLVSFQ1A October   2023  – November 2024 TPS653860-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device and Documentation Support
    1. 4.1 Documentation Support
      1. 4.1.1 Related Documentation
      2. 4.1.2 Related Links
    2. 4.2 Receiving Notification of Documentation Updates
    3. 4.3 Support Resources
    4. 4.4 Trademarks
    5. 4.5 Electrostatic Discharge Caution
    6. 4.6 Glossary
  6. 5Revision History
  7. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Package Option Addendum
    2. 6.2 Tape and Reel Information
    3.     18

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCA|48
Thermal pad, mechanical data (Package|Pins)

4.4 Trademarks

PowerPAD™ and TI E2E™ are trademarks of Texas Instruments.

All trademarks are the property of their respective owners.