5 Revision History
Changes from C Revision (January 2016) to D Revision
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Changed PVIN pin number from 12 to 10 and changed pin 13 to "—" for the Exposed Thermal Pad in the Pin Functions table Go
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Moved Tstg spec from Handling Ratings table to Abs Max Ratings table; and, renamed Handling Ratings to ESD Ratings Go
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Added Receiving Notification of Documentation Updates and Community Resources sectionsGo
Changes from B Revision (April 2015) to C Revision
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Deleted sentence in the Overview description. Go
Changes from A Revision (September 2014) to B Revision
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Added "Outputs High Impedance During Shut Down" to Features. Go
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Changed front-page schematic Go
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Changed symbol for shut-down time Go
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Added tOFF to Timing Requirements Go
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Changed Figure 6Go
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Deleted "Output Discharge During Shut Down" subsection Go
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Changed "300 mA" to "200 mA" Go
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Changed Figure 8 Go
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Changed recommended capacitance value for C1 and C3, and reformatted table entries Go
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Changed "2 ×10 µF " to "10 µF" Go
Changes from * Revision (July 2013) to A Revision
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Added Device Information and Handling Rating tables, Feature Description section, Device Functional Modes, Programming section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo