SLVSCW2A September   2015  – February 2016 TPS657095

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  State Diagram
      2. 7.3.2  Power-up Timing
      3. 7.3.3  GPO
      4. 7.3.4  GPIO
      5. 7.3.5  LED_EN
      6. 7.3.6  PWM Dimming
      7. 7.3.7  Crystal Oscillator and CLKOUT
      8. 7.3.8  LDOs
      9. 7.3.9  Undervoltage Lockout
      10. 7.3.10 Power Up/Power Down Default States
      11. 7.3.11 Output Voltage Discharge for LDO1 and LDO2
      12. 7.3.12 Power-Good Status Bits for LDO1 and LDO2
      13. 7.3.13 Short-Circuit Protection
      14. 7.3.14 Thermal Shutdown
      15. 7.3.15 LED Driver
      16. 7.3.16 4kByte OTP Memory
        1. 7.3.16.1 Programming the 4KByte OTP Memory
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Operational Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
    6. 7.6 Register Map
      1. 7.6.1  DEV_AND_REV_ID Register Address: 00h
      2. 7.6.2  OTP_REV Register Address: 01h
      3. 7.6.3  GPIO_CTRL Register Address: 02h
      4. 7.6.4  PWM_OSC_CNTRL Register Address: 03h
      5. 7.6.5  ISINK_CURRENT Register Address: 04h
      6. 7.6.6  LDO_CTRL Register Address: 05h
      7. 7.6.7  LDO1_VCTRL Register Address: 06h
      8. 7.6.8  LDO2_VCTRL Register Address: 07h
      9. 7.6.9  PWM_DUTY_THR_L Register Address: 08h
      10. 7.6.10 PWM_DUTY_THR_H Register Address: 09h
      11. 7.6.11 RESERVED Register Address: 0Ah
      12. 7.6.12 PWM_DUTY_L Register Address: 0Bh
      13. 7.6.13 PWM_DUTY_H Register Address: 0Ch
      14. 7.6.14 RESERVED Register Address: 0Dh
      15. 7.6.15 SPARE Register Address: 0Eh
      16. 7.6.16 4K_OTP_PASSWORD Register Address: 0Fh
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Capacitor Selection
        2. 8.2.2.2 Input Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Summary
    2. 12.2 Chip Scale Package Dimensions

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

12.1 Package Summary

TPS657095 po_bott_4x4_lvsbi1.gif Figure 39. Chip Scale Package
(Bottom View)
TPS657095 po_top_4x4_lvscw2.gif Figure 40. Chip Scale Package
(Top View)

Code:

  • YM — Year Month date code
  • LLLL — Lot trace code
  • S — Assembly site code

12.2 Chip Scale Package Dimensions

The TPS657095 device is available in a 16-bump chip scale package (YFF, NanoFree™). The package dimensions are given as:

  • D = ca. 1700 ±25 μm
  • E = ca. 1700 ±25 μm