SLVSCW2A
September 2015 – February 2016
TPS657095
PRODUCTION DATA.
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
State Diagram
7.3.2
Power-up Timing
7.3.3
GPO
7.3.4
GPIO
7.3.5
LED_EN
7.3.6
PWM Dimming
7.3.7
Crystal Oscillator and CLKOUT
7.3.8
LDOs
7.3.9
Undervoltage Lockout
7.3.10
Power Up/Power Down Default States
7.3.11
Output Voltage Discharge for LDO1 and LDO2
7.3.12
Power-Good Status Bits for LDO1 and LDO2
7.3.13
Short-Circuit Protection
7.3.14
Thermal Shutdown
7.3.15
LED Driver
7.3.16
4kByte OTP Memory
7.3.16.1
Programming the 4KByte OTP Memory
7.4
Device Functional Modes
7.4.1
Shutdown Mode
7.4.2
Operational Mode
7.5
Programming
7.5.1
Serial Interface
7.6
Register Map
7.6.1
DEV_AND_REV_ID Register Address: 00h
7.6.2
OTP_REV Register Address: 01h
7.6.3
GPIO_CTRL Register Address: 02h
7.6.4
PWM_OSC_CNTRL Register Address: 03h
7.6.5
ISINK_CURRENT Register Address: 04h
7.6.6
LDO_CTRL Register Address: 05h
7.6.7
LDO1_VCTRL Register Address: 06h
7.6.8
LDO2_VCTRL Register Address: 07h
7.6.9
PWM_DUTY_THR_L Register Address: 08h
7.6.10
PWM_DUTY_THR_H Register Address: 09h
7.6.11
RESERVED Register Address: 0Ah
7.6.12
PWM_DUTY_L Register Address: 0Bh
7.6.13
PWM_DUTY_H Register Address: 0Ch
7.6.14
RESERVED Register Address: 0Dh
7.6.15
SPARE Register Address: 0Eh
7.6.16
4K_OTP_PASSWORD Register Address: 0Fh
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Output Capacitor Selection
8.2.2.2
Input Capacitor Selection
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Third-Party Products Disclaimer
11.2
Community Resources
11.3
Trademarks
11.4
Electrostatic Discharge Caution
11.5
Glossary
12
Mechanical, Packaging, and Orderable Information
12.1
Package Summary
12.2
Chip Scale Package Dimensions
Package Options
Mechanical Data (Package|Pins)
YFF|16
MXBG096W
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slvscw2a_oa
slvscw2a_pm
4 Revision History
DATE
REVISION
NOTES
February 2016
A
Contact TI for Rev A datasheet changes