SWCS046 Data sheet

SWCS046U March 2010 – October 2014 TPS65910

PRODUCTION DATA.

Package Options

Mechanical Data (Package|Pins)

RSL|48
- MPQF193A

Thermal pad, mechanical data (Package|Pins)

RSL|48
- QFND160K

Orderable Information

6 Detailed Description

6.1 Power Reference

The bandgap voltage reference is filtered by using an external capacitor connected across the VREF output and the analog ground REFGND (see Section 5.3, Recommended Operating Conditions). The VREF voltage is distributed and buffered inside the device.

6.2 Power Sources

The power resources provided by the TPS65910 device include inductor-based switched mode power supplies (SMPS) and linear low drop-out voltage regulators (LDOs). These supply resources provide the required power to the external processor cores and external components, and to modules embedded in the TPS65910 device.

Two of these SMPS have DVS capability SmartReflex Class 3 compatible. These SMPS provide independent core voltage domains to the host processor. The remaining SMPS provides supply voltage for the host processor I/Os.

Table 6-1 lists the power sources provided by the TPS65910 device.

Table 6-1 Power Sources

RESOURCE	TYPE	VOLTAGES	POWER
VIO	SMPS	1.5 V / 1.8 V / 2.5 V / 3.3 V	1000 mA
VDD1	SMPS	0.6 ... 1.5 in 12.5-mV steps	1500 mA
		Programmable multiplication factor: x2, x3
VDD2	SMPS	0.6 ... 1.5 in 12.5-mV steps	1500 mA
		Programmable multiplication factor: x2, x3
VDD3	SMPS	5 V	100 mA
VDIG1	LDO	1.2 V, 1.5 V, 1.8 V, 2.7 V	300 mA
VDIG2	LDO	1 V, 1.1 V, 1.2 V, 1.8 V	300 mA
VPLL	LDO	1.0 V, 1.1 V, 1.8 V, 2.5 V	50 mA
VDAC	LDO	1.8 V, 2.6 V, 2.8 V, 2.85 V	150 mA
VAUX1	LDO	1.8 V, 2.5 V, 2.8 V, 2.85 V	300 mA
VAUX2	LDO	1.8 V, 2.8 V, 2.9 V, 3.3 V	150 mA
VAUX33	LDO	1.8 V, 2.0 V, 2.8 V, 3.3 V	150 mA
VMMC	LDO	1.8 V, 2.8 V, 3.0 V, 3.3 V	300 mA

6.3 Embedded Power Controller

The embedded power controller manages the state of the device and controls the power-up sequence.

6.3.1 State-Machine

The EPC supports the following states:

No supply: The main battery supply voltage is not high enough to power the VRTC regulator. A global reset is asserted in this case. Everything on the device is off.

Backup: The main battery supply voltage is high enough to enable the VRTC domain but not enough to switch on all the resources. In this state, the VRTC regulator is in backup mode and only the 32-K oscillator and RTC module are operating (if enabled). All other resources are off or under reset.

Off: The main battery supply voltage is high enough to start the power-up sequence but device power on is not enabled. All power supplies are in OFF state except VRTC.

Active: Device power-on enable conditions are met and regulated power supplies are on or can be enabled with full current capability.

Sleep: Device SLEEP enable conditions are met and some selected regulated power supplies are in low-power mode.

Figure 6-1 shows the transitions of the state-machine.

Figure 6-1 Embedded Power Control State-Machine

Device power-on enable conditions:

If none of the device power-on disable conditions is met, the following conditions are available to turn on and/or maintain the ON state of the device:

PWRON signal low level.
Or PWRHOLD signal high level.
Or DEV_ON control bit set to 1 (default inactive).
Or interrupt flag active (default INT1 low) while the device is off (NRESPWRON = 0) generates a power-on enable condition during a fixed delay (T_DOINT1 pulse duration defined in Section 5.22.2, Power Control Timing).

The power-on enable condition pulse occurs only if the interrupt status bit is initially low (no previous identical interrupt pending in the status register).

The Interrupt sources expected when the device is off are:

PWRON low-level interrupt (PWRON_IT = 1 in INT_STS_REG register)
PWRHOLD rising-edge interrupt (PWRHOLD_IT = 1 in INT_STS_REG register)

The Interrupt sources expected if enabled when the device is off are:

RTC Alarm interrupt (RTC_ALARM_IT = 1 or RTC_PERIOD_IT = 1 in INT_STS_REG register)
First-time input voltage rising above VMBHI threshold (Boot mode or EEPROM dependent) and input voltage > VMBCH threshold (VMBCH_IT = 1 in INT_STS_REG register).

GPIO_CKSYNC cannot be used to turn on the device (OFF-to-ACTIVE state transition), even if its associated interrupt is not masked, but can be used as an interrupt source to wake up the device from SLEEP-to-ACTIVE state.

Device power-on disable conditions:

PWRON signal low level during more than the long-press delay: t_dPWRONLP (can be disabled though register programming). The interrupt corresponding to this condition is PWRON_LP_IT in the INT_STS_REG register.
Or Die temperature has reached the thermal shutdown threshold.
Or DEV_OFF or DEV_OFF_RST control bit set to 1 (value of DEV_OFF is cleared when the device is in OFF state).

Device SLEEP enable conditions:

SLEEP signal low level (default, or high level depending on the programmed polarity)
And DEV_SLP control bit set to 1
And interrupt flag inactive (default INT1 high): no nonmasked interrupt pending

The SLEEP state can be controlled by programming DEV_SLP and keeping the SLEEP signal in the active polarity state, or it can be controlled through the SLEEP signal setting the DEV_SLP bit to 1 once, after device turn-on.

6.3.2 Switch-On/-Off Sequences

The power sequence is the automated switching on of the device resources when an off-to-active transition takes place.

The device supports three embedded power sequences selectable by the device BOOT pins.

BOOT0	BOOT1	Processor Supported
0	0	AM3517, AM3505
1	0	OMAP3 Family, AM3715/03, DM3730/25
0	1	EEPROM sequence

Details of the boot sequence timing are given in Section 5.22.1. EEPROM sequences can be used for specific power up sequence for corresponding application processor. For details of EEPROM sequence refer to the user guides on the product folder: http://focus.ti.com/docs/prod/folders/print/tps65910.html.

6.3.3 Control Signals

6.3.3.1 SLEEP

When none of the device sleep-disable conditions are met, a falling edge (default, or rising edge, depending on the programmed polarity) of this signal causes an ACTIVE-to-SLEEP state transition of the device. A rising edge (default, or falling edge, depending on the programmed polarity) causes a transition back to ACTIVE state. This input signal is level sensitive and no debouncing is applied.

While the device is in SLEEP state, predefined resources are automatically set in their low-power mode or off. Resources can be kept in their active mode: (full-load capability), programming the SLEEP_KEEP_LDO_ON and the SLEEP_KEEP_RES_ON registers. These registers contain 1 bit per power resource. If the bit is set to 1, then that resource stays in active mode when the device is in SLEEP state. 32KCLKOUT is also included in the SLEEP_KEEP_RES_ON register and the 32-kHz clock output is maintained in SLEEP state if the corresponding mask bit is set.

6.3.3.2 PWRHOLD

When none of the device power-on disable conditions are met, a rising edge of this signal causes an OFF-to-ACTIVE state transition of the device and a falling edge causes a transition back to OFF state. Typically, this signal is used to control the device in a slave configuration. It can be connected to the SYSEN output signal from other TPS659xx devices, or the NRESPWRON signal of another TPS65910 device. This input signal is level sensitive and no debouncing is applied.

A rising edge of PWRHOLD is highlighted though an associated interrupt.

6.3.3.3 BOOT0/BOOT1

These signals determine which processor the device is working with and hence which power-up sequence is needed. See Section 5.22.1 for more details. There is no debouncing on this input signal.

6.3.3.4 NRESPWRON

This signal is used as the reset to the processor. It is held low until the ACTIVE state is reached. See Section 5.22.2 to get detailed timing.

6.3.3.5 CLK32KOUT

This signal is the output of the 32K oscillator, which can be enabled or not during the power-on sequence, depending on the Boot mode. It can be enabled and disabled by register bit, during ACTIVE state of the device. CLK32KOUT output can also be enabled or not during SLEEP state of the device depending on the SLEEPMASK register programming.

6.3.3.6 PWRON

A falling edge on this signal causes after t_dbPWRONF debouncing delay (defined in Figure 5-4 and Table 5-5) an OFF-to-ACTIVE state or SLEEP-to-ACTIVE state transition of the device and makes the corresponding interrupt (PWRON_IT) active. The PWRON input is connected to an external push-button. The built-in debouncing time defines a minimum button press duration that is required for button press detection. Any button press duration which is lower than this value is ignored, considered an accidental touch.

After an OFF-to-ACTIVE state transition, the PMIC maintains ACTIVE during t_dOINT delay, if the button is released. After this delay if none of the device enabling conditions is set by the processor supplied, the PMIC automatically turns off. If the button is not released, the PMIC maintains ACTIVE up to t_dPWRONLPTO, because PWRON low is a device enabling condition. After a SLEEP-to-ACTIVE state transition, the PMIC maintains ACTIVE as long as an interrupt is pending.

If the device is already in ACTIVE state, a PWRON low level makes the corresponding interrupt (PWRON_IT) active.

When the PMIC is in ACTIVE mode, if the button is pressed for longer time than t_dPWRONLP, the PMIC generates the PWON_LP_IT interrupt. If the processor does not acknowledge the long press interrupt within a period of t_dPWRONLPTO – t_dPWRONLP, the PMIC goes to OFF mode and shuts down the DCDCs and LDOs.

6.3.3.7 INT1

INT1 signal (default active low) warns the host processor of any event that occurred on the TPS65910 device. The host processor can then poll the interrupt from the interrupt status register through I²C to identify the interrupt source. A low level (default setting) indicates an active interrupt, highlighted in the INT_STS_REG register. The polarity of INT1 can be set by programming the IT_POL control bit.

Any (not masked or masked) interrupt detection causes a POWER ON enable condition during a fixed delay t_DOINT1 (only) when the device is in OFF state (when NRESPWON signal is low). Any (not masked) interrupt detection is causing a device wakeup from SLEEP state up to acknowledge of the pending interrupt. Any of the interrupt sources can be masked by programming the INT_MSK_REG register. When an interrupt is masked, its corresponding interrupt status bit is still updated, but the INT1 flag is not activated.

Interrupt source masking can be used to mask a device switch-on event. Because interrupt flag active is a POWER ON enable condition during t_DOINT1 delay, any interrupt not masked must be cleared to allow turn off of the device after the t_DOINT1 POWER ON enable pulse duration.. See section: Interrupts, for interrupt sources definition.

6.3.3.8 SDASR_EN2 and SCLSR_EN1

SDASR_EN2 and SCLSR_EN1 are the data and clock signals of the serial control interface (SR-I²C) dedicated to SmartReflex applications. These signals can also be programmed to be used as enable signals of one or several supplies, when the device is on (NRESPWRON high). A resource assigned to SDASR_EN2 or SCLSR_EN1 control automatically disables the serial control interface.

Programming EN1_LDO_ASS_REG, EN2_LDO_REG, and SLEEP_KEEP_LDO_ON_REG registers: SCLSR_EN1 and SDASR_EN2 signals can be used to control the turn on/off or sleep state of any LDO type supplies.

Programming EN1_SMPS_ASS_REG, EN2_SMPS_ASS_REG, and SLEEP_KEEP_RES_ON registers: SCLSR_EN1 and SDASR_EN2 signals can be used to control the turn on/off or low-power state (PFM mode) of SMPS type supplies.

SDASR_EN2 and SCLSR_EN1 can be used to set output voltage of VDD1 and VDD2 SMPS from a roof to a floor value, preprogrammed in the VDD1_OP_REG, VDD2_OP_REG, and teh VDD1_SR_REG, VDD2_SR_REG registers. Tun-off of VDD1 and VDD2 can also be programmed either in VDD1_OP_REG, VDD2_OP_REG or in VDD1_SR_REG, VDD2_SR_REG registers.

When a supply is controlled through SCLSR_EN1 or SCLSR_EN2 signals, its state is no longer driven by the device SLEEP state.

6.3.3.9 GPIO_CKSYNC

GPIO_CKSYNC is a configurable open-drain digital I/O: directivity, debouncing delay and internal pullup can be programmed in the GPIO0_REG register. GPIO_CKSYNC cannot be used to turn on the device (OFF-to-ACTIVE state transition), even if its associated interrupt is not masked, but can be used as an interrupt source to wake up the device from SLEEP-to-ACTIVE state.

Programming DCDCCKEXT = 1, VDD1, VDD2, VIO, and VDD3 DC-DC switching can be synchronized using a 3-MHz clock set though the GPIO_CKSYNC pin.

6.3.4 Dynamic Voltage Frequency Scaling and Adaptive Voltage Scaling Operation

Dynamic voltage frequency scaling (DVFS) operation: a supply voltage value corresponding to a targeted frequency of the digital core supplied is programmed in VDD1_OP_REG or VDD2_OP_REG registers.

The slew rate of the voltage supply reaching a new VDD1_OP_REG or VDD2_OP_REG programmed value is limited to 12.5 mV/µs, fixed value. Adaptative voltage scaling (AVS) operation: a supply voltage value corresponding to a supply voltage adjustment is programmed in VDD1_SR_REG or VDD2_SR_REG registers. The supply voltage is then intended to be tuned by the digital core supplied, based its performance self-evaluation. The slew rate of VDD1 or VDD2 voltage supply reaching a new programmed value is programmable though the VDD1_REG or VDD2_REG register, respectively.

A serial control interface (SR-I²C) is dedicated to SmartReflex applications such as DVFS and class 3 AVS, and thus gives access to the VDD1_OP_REG, VDD1_SR_REG, and VDD2_OP_REG, VDD2_SR_REG register.

A general-purpose serial control interface (CTL-I²C) also gives access to these registers, if SR_CTL_I2C_SEL control bit is set to 1 in the DEVCTRL_REG register (default inactive).

Both control interfaces are compliant with HS-I²C specification (100 kbps, 400 kbps, or 3.4 Mbps).

Figure 6-2 shows an example of a SmartReflex operation. To optimize power efficiency, the voltage domains of the host processor uses the DVFS and AVS features provided by SmartReflex.

1. T_SR: Time used by the SmartReflex controller

2. T_I2C: Time used for data transfer through the I²C interface

3. T_SMPS: Time required by the SMPS to converge to new voltage value

Figure 6-2 SmartReflex Operation Example

6.4 32-kHz RTC Clock

The TPS65910 device can provide a 32-kHz clock to the platform through the CLK32KOUT output, the source of this 32-kHz clock can be:

32-kHz crystal connected from OSC32IN to OSC32KOUT pins
A square-wave 32-kHz clock signal applied to OSC32IN input (OSC32KOUT kept floating).
Internal 32-kHz RC oscillator, to reduce the BOM, if an accurate clock is not needed by the system.

Default selection of a 32-kHz RC oscillator versus 32-kHz crystal oscillator or external square-wave 32-kHz clock depends on the Boot mode or device version (EEPROM programming):

BOOT1 = 0, BOOT0 = 1: quartz oscillator or external square wave 32-kHz clock default
BOOT1 = 0, BOOT0 = 0: 32-kHz RC oscillator default

Switching from the 32-kHz RC oscillator to the 32-kHz crystal oscillator or external square-wave 32-kHz clock can also be programmed though DEVCTRL_REG register, taking benefit of the shorter turn-on time of the internal RC oscillator.

Switching from the 32-kHz crystal oscillator or external square-wave clock to the RC oscillator is not supported.

Figure 6-3 Crystal Oscillator 32-kHz Clock

6.5 RTC

The RTC, which is driven by the 32-kHz clock, provides the alarm and timekeeping functions. The RTC is kept supplied when the device is in the OFF or the BACKUP state.

The main functions of the RTC block are:

Time information (seconds/minutes/hours) directly in binary-coded decimal (BCD) format
Calendar information (Day/Month/Year/Day of the week) directly in BCD code up to year 2099
Programmable interrupts generation: The RTC can generate two interrupts: a timer interrupt RTC_PERIOD_IT periodically (1s/1m/1h/1d period) and an alarm interrupt RTC_ALARM_IT at a precise time of the day (alarm function). These interrupts are enabled using IT_ALARM and IT_TIMER control bits. Periodically interrupts can be masked during the SLEEP period to avoid host interruption and are automatically unmasked after SLEEP wakeup (using the IT_SLEEP_MASK_EN control bit).
Oscillator frequency calibration and time correction

Figure 6-4 RTC Digital Section Block Diagram

NOTE

INT_ALARM can generate a wakeup of the platform.

INT_TIMER cannot generate a wakeup of the platform.

6.5.1 Time Calendar Registers

All the time and calendar information are available in these dedicated registers, called TC registers. Values of the TC registers are written in BCD format.

Year data ranges from 00 to 99
- Leap year = Year divisible by four (2000, 2004, 2008, 2012...)
- Common year = other years
Month data ranges from 01 to 12
Day value ranges from:
- 1 to 31 when months are 1, 3, 5, 7, 8, 10, 12
- 1 to 30 when months are 4, 6, 9, 11
- 1 to 29 when month is 2 and year is a leap year
- 1 to 28 when month is 2 and year is a common year
Week value ranges from 0 to 6
Hour value ranges from 00 to 23 in 24-hour mode and ranges from 1 to 12 in AM/PM mode
Minutes value ranges from 0 to 59
Seconds value ranges from 0 to 59

To modify the current time, software writes the new time into TC registers to fix the time/calendar information. The DBB can write into TC registers without stopping the RTC. In addition, software can stop the RTC by clearing the STOP_RTC bit of the control register and check the RUN bit of the status to be sure that the RTC is frozen. Then update TC values, and then restart the RTC by setting the STOP_RTC bit.

Example: Time is 10H54M36S PM (PM_AM mode set), 2008 September 5, previous register values are:

Register	Value
SECONDS_REG	0x36
MINUTES_REG	0x54
HOURS_REG	0x90
DAYS_REG	0x05
MONTHS_REG	0x09
YEARS_REG	0x08

The user can round to the closest minute, by setting the ROUND_30S register bit. TC values are set to the closest minute value at the next second. The ROUND_30S bit is automatically cleared when the rounding time is performed.

Example:

If current time is 10H59M45S, a round operation changes time to 11H00M00S.
if current time is 10H59M29S, a round operation changes time to 10H59M00S.

6.5.2 General Registers

Software can access the RTC_STATUS_REG and RTC_CTRL_REG registers at any time (except for the RTC_CTRL_REG[5] bit, which must be changed only when the RTC is stopped).

6.5.3 Compensation Registers

The RTC_COMP_MSB_REG and RTC_COMP_LSB_REG registers must respect the available access period. These registers must be updated before each compensation process. For example, software can load the compensation value into these registers after each hour event, during an available access period.

Figure 6-5 RTC Compensation Scheduling

This drift can be balanced to compensate for any inaccuracy of the 32-kHz oscillator. Software must calibrate the oscillator frequency, calculate the drift compensation versus one time hour period; and then load the compensation registers with the drift compensation value. Indeed, if the AUTO_COMP_EN bit in the RTC_CTRL_REG is enabled, the value of COMP_REG (in twos-complement) is added to the RTC 32-kHz counter at each hour and one second. When COMP_REG is added to the RTC 32-kHz counter, the duration of the current second becomes (32768 - COMP_REG)/32768s; so, the RTC can be compensated with a 1/32768 s/hour time unit accuracy.

NOTE

The compensation is considered once written into the registers.

6.6 Backup Battery Management

The device includes a back-up battery switch connecting the VRTC regulator input to a main battery (VCC7) or to a back-up battery (VBACKUP), depending on the batteries voltage value.

The VRTC supply can then be maintained during a BACKUP state as far as the input voltage is high enough (>VBNPR threshold). Below the VBNPR voltage threshold the digital core of the device is set under reset by internal signal POR (Power-on Reset).

The back-up domain functions which are always supplied from VRTC comprehend:

The internal 32-kHz oscillator
Backup registers

The back-up battery can be charged from the main battery through an embedded charger. The back-up battery charge voltage and enable is controlled through BBCH_REG register programming. This register content is maintained during the device Backup state.

Hence enabled the back-up battery charge is maintained as far as the main battery voltage is higher than the VMBLO threshold and the back-up battery voltage.

6.7 Backup Registers

As part of the RTC the device contains five 8-bit registers which can be used for storage by the application firmware when the external host is powered down. These registers retain their content as long as the VRTC is active.

6.8 I²C Interface

A general-purpose serial control interface (CTL-I²C) allows read and write access to the configuration registers of all resources of the system.

A second serial control interface (SR-I²C) is dedicated to SmartReflex applications such as DVFS or AVS.

Both control interfaces are compliant with HS-I²C specification.

These interfaces support the standard slave mode (100 Kbps), Fast mode (400 Kbps), and high-speed mode (3.4 Mbps). The general-purpose I²C module using one slave hard-coded address (ID1 = 2Dh). The SmartReflex I²C module uses one slave hard-coded address (ID0 = 12h). The master mode is not supported.

Addressing: Seven-bit mode addressing device

They do not support the following features:

10-bit addressing
General call

6.9 Thermal Monitoring and Shutdown

A thermal protection module monitors the junction temperature of the device versus two thresholds:

Hot-die temperature threshold
Thermal shutdown temperature threshold

When the hot-die temperature threshold is reached an interrupt is sent to software to close the noncritical running tasks.

When the thermal shutdown temperature threshold is reached, the TPS65910 device is set under reset and a transition to OFF state is initiated. Then the power-on enable conditions of the device is not considered until the die temperature has decreased below the hot-die threshold. An hysteresis is applied to the hot-die and shutdown threshold, when detecting a falling edge of temperature, and both detection are debounced to avoid any parasitic detection. The TPS65910 device allows programming of four hot-die temperature thresholds to increase the flexibility of the system.

By default, the thermal protection is enabled in ACTIVE state, but can be disabled through programming register THERM_REG. The thermal protection can be enabled in SLEEP state programming register SLEEP_KEEP_RES_ON. The thermal protection is automatically enabled during an OFF-to-ACTIVE state transition and is kept enabled in OFF state after a switch-off sequence caused by a thermal shutdown event. Transition to OFF state sequence caused by a thermal shutdown event is highlighted in the INT_STS_REG status register. Recovery from this OFF state is initiated (switch-on sequence) when the die temperature falls below the hot-die temperature threshold.

Hot-die and thermal shutdown temperature threshold detections state can be monitored or masked by reading or programming the THERM_REG register. Hot-die interrupt can be masked by programming the INT_MSK_REG register.

6.10 Interrupts

Table 6-2 Interrupt Sources

Interrupt	Description
RTC_ALARM_IT	RTC alarm event: Occurs at programmed determinate date and time
	(running in ACTIVE, OFF, and SLEEP state, default inactive)
RTC_PERIOD_IT	RTC periodic event: Occurs at programmed regular period of time (every second or minute) (running in ACTIVE, OFF, and SLEEP state, default inactive)
HOT_DIE_IT	The embedded thermal monitoring module has detected a die temperature above the hot-die detection threshold (running in ACTIVE and SLEEP state)
	Level sensitive interrupt.
PWRHOLD_IT	PWRHOLD signal rising edge
PWRON_LP_IT	PWRON is low during more than the long-press delay: t_dPWRONLP (can be disable though register programming).
PWRON_IT	PWRON is low while the device is on (running in ACTIVE and SLEEP state) or PWON was low while the device was off (causing a device turn-on). Level-sensitive interrupt
VMBHI_IT	The battery voltage rise above the VMBHI threshold: NOSUPPLY to Off or Backup-to-Off device states transition (first battery plug or battery voltage bounce detection). This interrupt source can be disabled through EEPROM programming (VMBHI_IT_DIS). Edge-sensitive interrupt
VMBDCH_IT	The battery voltage falls down below the VMBDCH threshold(running in ACTIVE and SLEEP state, if enabled programming VMBCH_VSEL). Edge-sensitive interrupt
GPIO0_R_IT	GPIO_CKSYNC rising-edge detection (available in ACTIVE and SLEEP state)
GPIO0_F_IT	GPIO_CKSYNC falling-edge detection (available in ACTIVE and SLEEP state)

INT1 signal (active low) warns the host processor of any event that occurred on the TPS65910 device. The host processor can then poll the interrupt from the interrupt status register via I²C to identify the interrupt source. Each interrupt source can be individually masked via the interrupt mask register.

6.11 Package Description

The following are the package descriptions of the TPS65910 PMU devices:

Package type:

Package	TPS65910
Type	RSL QFN-N48
Size (mm)	6x6
Substrate layers	1 layer
Pitch ball array (mm)	0.4 mm
ViP (via-in-pad)	No
Number of balls	48
Thickness (mm) (max height including balls)	1
Others	Green, ROHS-compliant

Moisture sensitivity level target: JEDEC MSL3 at 260°C

6.12 Functional Registers

6.12.1 TPS65910_FUNC_REG Registers Mapping Summary

Table 6-3 TPS65910_FUNC_REG Register Summary

Register Name	Type	Register Width (Bits)	Register Reset	Address Offset
SECONDS_REG	RW	8	0x00	0x00
MINUTES_REG	RW	8	0x00	0x01
HOURS_REG	RW	8	0x00	0x02
DAYS_REG	RW	8	0x01	0x03
MONTHS_REG	RW	8	0x01	0x04
YEARS_REG	RW	8	0x00	0x05
WEEKS_REG	RW	8	0x00	0x06
ALARM_SECONDS_REG	RW	8	0x00	0x08
ALARM_MINUTES_REG	RW	8	0x00	0x09
ALARM_HOURS_REG	RW	8	0x00	0x0A
ALARM_DAYS_REG	RW	8	0x01	0x0B
ALARM_MONTHS_REG	RW	8	0x01	0x0C
ALARM_YEARS_REG	RW	8	0x00	0x0D
RTC_CTRL_REG	RW	8	0x00	0x10
RTC_STATUS_REG	RW	8	0x80	0x11
RTC_INTERRUPTS_REG	RW	8	0x00	0x12
RTC_COMP_LSB_REG	RW	8	0x00	0x13
RTC_COMP_MSB_REG	RW	8	0x00	0x14
RTC_RES_PROG_REG	RW	8	0x27	0x15
RTC_RESET_STATUS_REG	RW	8	0x00	0x16
BCK1_REG	RW	8	0x00	0x17
BCK2_REG	RW	8	0x00	0x18
BCK3_REG	RW	8	0x00	0x19
BCK4_REG	RW	8	0x00	0x1A
BCK5_REG	RW	8	0x00	0x1B
PUADEN_REG	RW	8	0x9F	0x1C
REF_REG	RW	8	0x01	0x1D
VRTC_REG	RW	8	0x01	0x1E
VIO_REG	RW	8	0x00	0x20
VDD1_REG	RW	8	0x0C	0x21
VDD1_OP_REG	RW	8	0x00	0x22
VDD1_SR_REG	RW	8	0x00	0x23
VDD2_REG	RW	8	0x04	0x24
VDD2_OP_REG	RW	8	0x00	0x25
VDD2_SR_REG	RW	8	0x00	0x26
VDD3_REG	RW	8	0x04	0x27
VDIG1_REG	RW	8	0x00	0x30
VDIG2_REG	RW	8	0x00	0x31
VAUX1_REG	RW	8	0x00	0x32
VAUX2_REG	RW	8	0x00	0x33
VAUX33_REG	RW	8	0x00	0x34
VMMC_REG	RW	8	0x00	0x35
VPLL_REG	RW	8	0x00	0x36
VDAC_REG	RW	8	0x00	0x37
THERM_REG	RW	8	0x0D	0x38
BBCH_REG	RW	8	0x00	0x39
DCDCCTRL_REG	RW	8	0x3B	0x3E
DEVCTRL_REG	RW	8	0x40	0x3F
DEVCTRL2_REG	RW	8	0x34	0x40
SLEEP_KEEP_LDO_ON_REG	RW	8	0x00	0x41
SLEEP_KEEP_RES_ON_REG	RW	8	0x00	0x42
SLEEP_SET_LDO_OFF_REG	RW	8	0x00	0x43
SLEEP_SET_RES_OFF_REG	RW	8	0x00	0x44
EN1_LDO_ASS_REG	RW	8	0x00	0x45
EN1_SMPS_ASS_REG	RW	8	0x00	0x46
EN2_LDO_ASS_REG	RW	8	0x00	0x47
EN2_SMPS_ASS_REG	RW	8	0x00	0x48
RESERVED	RW	8	0x00	0x49
RESERVED	RW	8	0x00	0x4A
INT_STS_REG	RW	8	0x00	0x50
INT_MSK_REG	RW	8	0x02	0x51
INT_STS2_REG	RW	8	0x00	0x52
INT_MSK2_REG	RW	8	0x00	0x53
GPIO0_REG	RW	8	0x0A	0x60
JTAGVERNUM_REG	RO	8	0x00	0x80

6.12.2 TPS65910_FUNC_REG Register Descriptions

Table 6-4 SECONDS_REG

Address Offset	0x00
Physical Address		Instance
Description	RTC register for seconds
Type	RW

7	6	5	4	3	2	1	0
Reserved	SEC1			SEC0

Bits	Field Name	Description	Type	Reset
7	Reserved	Reserved bit	RO R returns 0s	0
6:4	SEC1	Second digit of seconds (range is 0 up to 5)	RW	0x0
3:0	SEC0	First digit of seconds (range is 0 up to 9)	RW	0x0

Table 6-5 MINUTES_REG

Address Offset	0x01
Physical Address		Instance
Description	RTC register for minutes
Type	RW

7	6	5	4	3	2	1	0
Reserved	MIN1			MIN0

Bits	Field Name	Description	Type	Reset
7	Reserved	Reserved bit	RO R returns 0s	0
6:4	MIN1	Second digit of minutes (range is 0 up to 5)	RW	0x0
3:0	MIN0	First digit of minutes (range is 0 up to 9)	RW	0x0

Table 6-6 HOURS_REG

Address Offset	0x02
Physical Address		Instance
Description	RTC register for hours
Type	RW

7	6	5	4	3	2	1	0
PM_NAM	Reserved	HOUR1		HOUR0

Bits	Field Name	Description	Type	Reset
7	PM_NAM	Only used in PM_AM mode (otherwise it is set to 0) 0 is AM 1 is PM	RW	0
6	Reserved	Reserved bit	RO R returns 0s	0
5:4	HOUR1	Second digit of hours (range is 0 up to 2)	RW	0x0
3:0	HOUR0	First digit of hours (range is 0 up to 9)	RW	0x0

Table 6-7 DAYS_REG

Address Offset	0x03
Physical Address		Instance
Description	RTC register for days
Type	RW

7	6	5	4	3	2	1	0
Reserved		DAY1		DAY0

Bits	Field Name	Description	Type	Reset
7:6	Reserved	Reserved bit	RO R returns 0s	0x0
5:4	DAY1	Second digit of days (range is 0 up to 3)	RW	0x0
3:0	DAY0	First digit of days (range is 0 up to 9)	RW	0x1

Table 6-8 MONTHS_REG

Address Offset	0x04
Physical Address		Instance
Description	RTC register for months
Type	RW

7	6	5	4	3	2	1	0
Reserved			MONTH1	MONTH0

Bits	Field Name	Description	Type	Reset
7:5	Reserved	Reserved bit	RO R returns 0s	0x0
4	MONTH1	Second digit of months (range is 0 up to 1)	RW	0
3:0	MONTH0	First digit of months (range is 0 up to 9)	RW	0x1

Table 6-9 YEARS_REG

Address Offset	0x05
Physical Address		Instance
Description	RTC register for day of the week
Type	RW

7	6	5	4	3	2	1	0
YEAR1				YEAR0

Bits	Field Name	Description	Type	Reset
7:4	YEAR1	Second digit of years (range is 0 up to 9)	RW	0x0
3:0	YEAR0	First digit of years (range is 0 up to 9)	RW	0x0

Table 6-10 WEEKS_REG

Address Offset	0x06
Physical Address		Instance
Description	RTC register for day of the week
Type	RW

7	6	5	4	3	2	1	0
Reserved					WEEK

Bits	Field Name	Description	Type	Reset
7:3	Reserved	Reserved bit	RO R returns 0s	0x00
2:0	WEEK	First digit of day of the week (range is 0 up to 6)	RW	0

Table 6-11 ALARM_SECONDS_REG

Address Offset	0x08
Physical Address		Instance
Description	RTC register for alarm programming for seconds
Type	RW

7	6	5	4	3	2	1	0
Reserved	ALARM_SEC1			ALARM_SEC0

Bits	Field Name	Description	Type	Reset
7	Reserved	Reserved bit	RO R returns 0s	0
6:4	ALARM_SEC1	Second digit of alarm programming for seconds (range is 0 up to 5)	RW	0x0
3:0	ALARM_SEC0	First digit of alarm programming for seconds (range is 0 up to 9)	RW	0x0

Table 6-12 ALARM_MINUTES_REG

Address Offset	0x09
Physical Address		Instance
Description	RTC register for alarm programming for minutes
Type	RW

7	6	5	4	3	2	1	0
Reserved	ALARM_MIN1			ALARM_MIN0

Bits	Field Name	Description	Type	Reset
7	Reserved	Reserved bit	RO R returns 0s	0
6:4	ALARM_MIN1	Second digit of alarm programming for minutes (range is 0 up to 5)	RW	0x0
3:0	ALARM_MIN0	First digit of alarm programming for minutes (range is 0 up to 9)	RW	0x0

Table 6-13 ALARM_HOURS_REG

Address Offset	0x0A
Physical Address		Instance
Description	RTC register for alarm programming for hours
Type	RW

7	6	5	4	3	2	1	0
ALARM_PM_NAM	Reserved	ALARM_HOUR1		ALARM_HOUR0

Bits	Field Name	Description	Type	Reset
7	ALARM_PM_NAM	Only used in PM_AM mode for alarm programming (otherwise it is set to 0) 0 is AM 1 is PM	RW	0
6	Reserved	Reserved bit	RO R returns 0s	0
5:4	ALARM_HOUR1	Second digit of alarm programming for hours (range is 0 up to 2)	RW	0x0
3:0	ALARM_HOUR0	First digit of alarm programming for hours (range is 0 up to 9)	RW	0x0

Table 6-14 ALARM_DAYS_REG

Address Offset	0x0B
Physical Address		Instance
Description	RTC register for alarm programming for days
Type	RW

7	6	5	4	3	2	1	0
Reserved		ALARM_DAY1		ALARM_DAY0

Bits	Field Name	Description	Type	Reset
7:6	Reserved	Reserved bit	RO R Special	0x0
5:4	ALARM_DAY1	Second digit of alarm programming for days (range is 0 up to 3)	RW	0x0
3:0	ALARM_DAY0	First digit of alarm programming for days (range is 0 up to 9)	RW	0x1

Table 6-15 ALARM_MONTHS_REG

Address Offset	0x0C
Physical Address		Instance
Description	RTC register for alarm programming for months
Type	RW

7	6	5	4	3	2	1	0
Reserved			ALARM_MONTH1	ALARM_MONTH0

Bits	Field Name	Description	Type	Reset
7:5	Reserved	Reserved bit	RO R returns 0s	0x0
4	ALARM_MONTH1	Second digit of alarm programming for months (range is 0 up to 1)	RW	0
3:0	ALARM_MONTH0	First digit of alarm programming for months (range is 0 up to 9)	RW	0x1

Table 6-16 ALARM_YEARS_REG

Address Offset	0x0D
Physical Address		Instance
Description	RTC register for alarm programming for years
Type	RW

7	6	5	4	3	2	1	0
ALARM_YEAR1				ALARM_YEAR0

Bits	Field Name	Description	Type	Reset
7:4	ALARM_YEAR1	Second digit of alarm programming for years (range is 0 up to 9)	RW	0x0
3:0	ALARM_YEAR0	First digit of alarm programming for years (range is 0 up to 9)	RW	0x0

Table 6-17 RTC_CTRL_REG

Address Offset	0x10
Physical Address		Instance
Description	RTC control register: NOTES: A dummy read of this register is necessary before each I²C read in order to update the ROUND_30S bit value.
Type	RW

7	6	5	4	3	2	1	0
RTC_V_OPT	GET_TIME	SET_32_COUNTER	TEST_MODE	MODE_12_24	AUTO_COMP	ROUND_30S	STOP_RTC

Bits	Field Name	Description	Type
7	RTC_V_OPT	RTC date / time register selection: 0: Read access directly to dynamic registers (SECONDS_REG, MINUTES_REG, HOURS_REG, DAYS_REG, MONTHS_REG, YEAR_REG, WEEKS_REG) 1: Read access to static shadowed registers: (see GET_TIME bit).	RW
6	GET_TIME	When writing a 1 into this register, the content of the dynamic registers (SECONDS_REG, MINUTES_REG, HOURS_REG, DAYS_REG, MONTHS_REG, YEAR_REG and WEEKS_REG) is transferred into static shadowed registers. Each update of the shadowed registers needs to be done by re-asserting GET_TIME bit to 1 (that is, reset it to 0 and then re-write it to 1)	RW
5	SET_32_COUNTER	0: No action 1: set the 32-kHz counter with COMP_REG value. It must only be used when the RTC is frozen.	RW
4	TEST_MODE	0: functional mode 1: test mode (Auto compensation is enable when the 32kHz counter reaches at its end)	RW
3	MODE_12_24	0: 24 hours mode 1: 12 hours mode (PM-AM mode) It is possible to switch between the two modes at any time without disturbed the RTC, read or write are always performed with the current mode.	RW
2	AUTO_COMP	0: No auto compensation 1: Auto compensation enabled	RW
1	ROUND_30S	0: No update 1: When a one is written, the time is rounded to the closest minute. This bit is a toggle bit, the micro-controller can only write one and RTC clears it. If the micro-controller sets the ROUND_30S bit and then read it, the micro-controller will read one until the rounded to the closet.	RW
0	STOP_RTC	0: RTC is frozen 1: RTC is running	RW

Table 6-18 RTC_STATUS_REG

Address Offset	0x11
Physical Address		Instance
Description	RTC status register: NOTES: A dummy read of this register is necessary before each I²C read in order to update the status register value.
Type	RW

7	6	5	4	3	2	1	0
POWER_UP	ALARM	EVENT_1D	EVENT_1H	EVENT_1M	EVENT_1S	RUN	Reserved

Bits	Field Name	Description	Type	Reset
7	POWER_UP	Indicates that a reset occurred (bit cleared to 0 by writing 1). POWER_UP is set by a reset, is cleared by writing one in this bit.	RW	1
6	ALARM	Indicates that an alarm interrupt has been generated (bit clear by writing 1). The alarm interrupt keeps its low level, until the micro-controller write 1 in the ALARM bit of the RTC_STATUS_REG register. The timer interrupt is a low-level pulse (15 µs duration).	RW	0
5	EVENT_1D	One day has occurred	RO	0
4	EVENT_1H	One hour has occurred	RO	0
3	EVENT_1M	One minute has occurred	RO	0
2	EVENT_1S	One second has occurred	RO	0
1	RUN	0: RTC is frozen 1: RTC is running This bit shows the real state of the RTC, indeed because of STOP_RTC signal was resynchronized on 32-kHz clock, the action of this bit is delayed.	RO	0
0	Reserved	Reserved bit	RO R returns 0s	0

Table 6-19 RTC_INTERRUPTS_REG

Address Offset	0x12
Physical Address		Instance
Description	RTC interrupt control register
Type	RW

7	6	5	4	3	2	1	0
Reserved			IT_SLEEP_MASK_EN	IT_ALARM	IT_TIMER	EVERY

Bits	Field Name	Description	Type	Reset
7:5	Reserved	Reserved bit	RO R returns 0s	0x0
4	IT_SLEEP_MASK_EN	1: Mask periodic interrupt while the TPS65910 device is in SLEEP mode. Interrupt event is back up in a register and occurred as soon as the TPS65910 device is no more in SLEEP mode. 0: Normal mode, no interrupt masked	RW	0
3	IT_ALARM	Enable one interrupt when the alarm value is reached (TC ALARM registers) by the TC registers	RW	0
2	IT_TIMER	Enable periodic interrupt 0: interrupt disabled 1: interrupt enabled	RW	0
1:0	EVERY	Interrupt period 00: every second 01: every minute 10: every hour 11: every day	RW	0x0

Table 6-20 RTC_COMP_LSB_REG

Address Offset	0x13
Physical Address		Instance
Description	RTC compensation register (LSB) Notes: This register must be written in 2-complement. This means that to add one 32kHz oscillator period every hour, micro-controller needs to write FFFF into RTC_COMP_MSB_REG & RTC_COMP_LSB_REG. To remove one 32-kHz oscillator period every hour, micro-controller needs to write 0001 into RTC_COMP_MSB_REG & RTC_COMP_LSB_REG. The 7FFF value is forbidden.
Type	RW

7	6	5	4	3	2	1	0
RTC_COMP_LSB

Bits	Field Name	Description	Type	Reset
7:0	RTC_COMP_LSB	This register contains the number of 32-kHz periods to be added into the 32-kHz counter every hour [LSB]	RW	0x00

Table 6-21 RTC_COMP_MSB_REG

Address Offset	0x14
Physical Address		Instance
Description	RTC compensation register (MSB) Notes: See RTC_COMP_LSB_REG Notes.
Type	RW

7	6	5	4	3	2	1	0
RTC_COMP_MSB

Bits	Field Name	Description	Type	Reset
7:0	RTC_COMP_MSB	This register contains the number of 32-kHz periods to be added into the 32-kHz counter every hour [MSB]	RW	0x00

Table 6-22 RTC_RES_PROG_REG

Address Offset	0x15
Physical Address		Instance
Description	RTC register containing oscillator resistance value
Type	RW

7	6	5	4	3	2	1	0
Reserved		SW_RES_PROG

Bits	Field Name	Description	Type	Reset
7:6	Reserved	Reserved bit	RO R returns 0s	0x0
5:0	SW_RES_PROG	Value of the oscillator resistance	RW	0x27

Table 6-23 RTC_RESET_STATUS_REG

Address Offset	0x16
Physical Address		Instance
Description	RTC register for reset status
Type	RW

7	6	5	4	3	2	1	0
Reserved							RESET_STATUS

Bits	Field Name	Description	Type	Reset
7:1	Reserved	Reserved bit	RO R returns 0s	0x0
0	RESET_STATUS		RW	0x0

Table 6-24 BCK1_REG

Address Offset	0x17
Physical Address		Instance
Description	Backup register which can be used for storage by the application firmware when the external host is powered down. These registers will retain their content as long as the VRTC is active.
Type	RW

7	6	5	4	3	2	1	0
BCKUP

Bits	Field Name	Description	Type	Reset
7:0	BCKUP	Backup bit	RW	0x00

Table 6-25 BCK2_REG

Address Offset	0x18
Physical Address		Instance
Description	Backup register which can be used for storage by the application firmware when the external host is powered down. These registers will retain their content as long as the VRTC is active.
Type	RW

7	6	5	4	3	2	1	0
BCKUP

Bits	Field Name	Description	Type	Reset
7:0	BCKUP	Backup bit	RW	0x00

Table 6-26 BCK3_REG

Address Offset	0x19
Physical Address		Instance
Description	Backup register which can be used for storage by the application firmware when the external host is powered down. These registers will retain their content as long as the VRTC is active.
Type	RW

7	6	5	4	3	2	1	0
BCKUP

Bits	Field Name	Description	Type	Reset
7:0	BCKUP	Backup bit	RW	0x00

Table 6-27 BCK4_REG

Address Offset	0x1A
Physical Address		Instance
Description	Backup register which can be used for storage by the application firmware when the external host is powered down. These registers will retain their content as long as the VRTC is active.
Type	RW

7	6	5	4	3	2	1	0
BCKUP

Bits	Field Name	Description	Type	Reset
7:0	BCKUP	Backup bit	RW	0x00

Table 6-28 BCK5_REG

Address Offset	0x1B
Physical Address		Instance
Description	Backup register which can be used for storage by the application firmware when the external host is powered down. These registers will retain their content as long as the VRTC is active.
Type	RW

7	6	5	4	3	2	1	0
BCKUP

Bits	Field Name	Description	Type	Reset
7:0	BCKUP	Backup bit	RW	0x00

Table 6-29 PUADEN_REG

Address Offset	0x1C
Physical Address		Instance
Description	Pull-up/pull-down control register.
Type	RW

7	6	5	4	3	2	1	0
RESERVED	I2CCTLP	I2CSRP	PWRONP	SLEEPP	PWRHOLDP	BOOT1P	BOOT0P

Bits	Field Name	Description	Type	Reset
7	RESERVED	Reserved bit	RW	1
6	I2CCTLP	SDACTL and SCLCTL pull-up control: 1: Pull-up is enabled 0: Pull-up is disabled	RW	0
5	I2CSRP	SDASR and SCLSR pull-up control: 1: Pull-up is enabled 0: Pull-up is disabled	RW	0
4	PWRONP	PWRON pad pull-up control: 1: Pull-up is enabled 0: Pull-up is disabled	RW	1
3	SLEEPP	SLEEP pad pull-down control: 1: Pull-down is enabled 0: Pull-down is disabled	RW	1
2	PWRHOLDP	PWRHOLD pad pull-down control: 1: Pull-down is enabled 0: Pull-down is disabled	RW	1
1	BOOT1P	BOOT1 pad control: 1: Pull-down is enabled 0: Pull-down is disabled	RW	1
0	BOOT0P	BOOT0 pad control: 1: Pull-down is enabled 0: Pull-down is disabled	RW	1

Table 6-30 REF_REG

Address Offset	0x1D
Physical Address		Instance
Description	Reference control register
Type	RW

7	6	5	4	3	2	1	0
Reserved				VMBCH_SEL		ST

Bits	Field Name	Description	Type	Reset
7:4	Reserved	Reserved bit	RO R returns 0s	0x0
3:2	VMBCH_SEL	Main Battery comparator VMBCH programmable threshold (EEPROM bits): VMBCH_SEL[1:0] = 00 : bypass VMBCH_SEL[1:0] = 01 : VMBCH = 2.8 V VMBCH_SEL[1:0] = 10 : VMBCH = 2.9 V VMBCH_SEL[1:0] = 11 : VMBCH = 3.0 V	RW	0x0
1:0	ST	Reference state: ST[1:0] = 00 : Off ST[1:0] = 01 : On high power (ACTIVE) ST[1:0] = 10 : Reserved ST[1:0] = 11 : On low power (SLEEP) (Write access available in test mode only)	RO	0x1

Table 6-31 VRTC_REG

Address Offset	0x1E
Physical Address		Instance
Description	VRTC internal regulator control register
Type	RW

7	6	5	4	3	2	1	0
Reserved				VRTC_OFFMASK	Reserved	ST

Bits	Field Name	Description	Type	Reset
7:4	Reserved	Reserved bit	RO R returns 0s	0x0
3	VRTC_OFFMASK	VRTC internal regulator off mask signal: when 1, the regulator keeps its full-load capability during device OFF state. when 0, the regulator will enter in low-power mode during device OFF state.(EEPROM bit)	RW	0
2	Reserved	Reserved bit	RO R returns 0s	0
1:0	ST	Reference state: ST[1:0] = 00 : Reserved ST[1:0] = 01 : On high power (ACTIVE) ST[1:0] = 10 : Reserved ST[1:0] = 11 : On low power (SLEEP) (Write access available in test mode only)	RO	0x1

Table 6-32 VIO_REG

Address Offset	0x20
Physical Address		Instance
Description	VIO control register
Type	RW

7	6	5	4	3	2	1	0
ILMAX		Reserved		SEL		ST

Bits	Field Name	Description	Type	Reset
7:6	ILMAX	Select maximum load current: when 00: 0.5 A when 01: 1.0 A when 10: 1.0 A when 11: 1.0 A	RW	0x0
5:4	Reserved	Reserved bit	RO R returns 0s	0x0
3:2	SEL	Output voltage selection (EEPROM bits): SEL[1:0] = 00 : 1.5 V SEL[1:0] = 01 : 1.8 V SEL[1:0] = 10 : 2.5 V SEL[1:0] = 11 : 3.3 V	RW	See ⁽¹⁾
1:0	ST	Supply state (EEPROM bits): ST[1:0] = 00 : Off ST[1:0] = 01 : On high power (ACTIVE) ST[1:0] = 10 : Off ST[1:0] = 11 : On low power (SLEEP) (Write access available in test mode only)	RW	0x0

(1) The reset value for this field varies with boot mode selection and the processor support. Please refer to the corresponding processor user guide to find the correct default value.

Table 6-33 VDD1_REG

Address Offset	0x21
Physical Address		Instance
Description	VDD1 control register
Type	RW

7	6	5	4	3	2	1	0
VGAIN_SEL		ILMAX	TSTEP			ST

Bits	Field Name	Description	Type	Reset
7:6	VGAIN_SEL	Select output voltage multiplication factor: G (EEPROM bits): when 00: x1 when 01: x1 when 10: x2 when 11: x3	RW	0x0
5	ILMAX	Select maximum load current: when 0: 1.0 A when 1: 1.5 A	RW	0
4:2	TSTEP	Time step: when changing the output voltage, the new value is reached through successive 12.5 mV voltage steps (if not bypassed). The equivalent programmable slew rate of the output voltage is then: TSTEP[2:0] = 000 : step duration is 0, step function is bypassed TSTEP[2:0] = 001 : 12.5 mV/µs (sampling 3 MHz) TSTEP[2:0] = 010 : 9.4 mV/µs (sampling 3 MHz × 3/4) TSTEP[2:0] = 011 : 7.5 mV/µs (sampling 3 MHz × 3/5) (default) TSTEP[2:0] = 100 : 6.25 mV/µs (sampling 3 MHz/2) TSTEP[2:0] = 101 : 4.7 mV/µs (sampling 3 MHz/3) TSTEP[2:0] = 110 : 3.12 mV/µs (sampling 3 MHz/4) TSTEP[2:0] = 111 : 2.5 mV/µs (sampling 3 MHz/5)	RW	0x3
1:0	ST	Supply state (EEPROM bits): ST[1:0] = 00 : Off ST[1:0] = 01 : On, high power mode ST[1:0] = 10 : Off ST[1:0] = 11 : On, low power mode	RW	0x0

Table 6-34 VDD1_OP_REG

Address Offset	0x22
Physical Address		Instance
Description	VDD1 voltage selection register. This register can be accessed by both control and smartreflex I²C interfaces depending on SR_CTL_I2C_SEL register bit value.
Type	RW

7	6	5	4	3	2	1	0
CMD	SEL

Bits	Field Name	Description	Type	Reset
7	CMD	Smart-Reflex command: when 0: VDD1_OP_REG voltage is applied when 1: VDD1_SR_REG voltage is applied	RW	0
6:0	SEL	Output voltage (EEPROM bits) selection with GAIN_SEL = 00 (G = 1, 12.5 mV per LSB): SEL[6:0] = 1001011 to 1111111 : 1.5 V ... SEL[6:0] = 0111111 : 1.35 V ... SEL[6:0] = 0110011 : 1.2 V ... SEL[6:0] = 0000001 to 0000011 : 0.6 V SEL[6:0] = 0000000 : Off (0.0 V) Note: from SEL[6:0] = 3 to 75 (dec) Vout = (SEL[6:0] × 12.5 mV + 0.5625 V) × G	RW	See ⁽¹⁾

(1) The reset value for this field varies with boot mode selection and the processor support. Please refer to the corresponding processor user guide to find the correct default value.

Table 6-35 VDD1_SR_REG

Address Offset	0x23
Physical Address		Instance
Description	VDD1 voltage selection register for smartreflex. This register can be accessed by both control and smartreflex I²C interfaces depending on SR_CTL_I2C_SEL register bit value.
Type	RW

7	6	5	4	3	2	1	0
Reserved	SEL

Bits	Field Name	Description	Type	Reset
7	Reserved	Reserved bit	RO R returns 0s	0
6:0	SEL	Output voltage (EEPROM bits) selection with GAIN_SEL = 00 (G = 1, 12.5 mV per LSB): SEL[6:0] = 1001011 to 1111111 : 1.5V ... SEL[6:0] = 0111111 : 1.35V ... SEL[6:0] = 0110011 : 1.2V ... SEL[6:0] = 0000001 to 0000011 : 0.6V SEL[6:0] = 0000000 : Off (0.0V) Note: from SEL[6:0] = 3 to 75 (dec) Vout = (SEL[6:0] × 12.5 mV + 0.5625 V) × G	RW	See ⁽¹⁾

(1) The reset value for this field varies with boot mode selection and the processor support. Please refer to the corresponding processor user guide to find the correct default value.

Table 6-36 VDD2_REG

Address Offset	0x24
Physical Address		Instance
Description	VDD2 control register
Type	RW

7	6	5	4	3	2	1	0
VGAIN_SEL		ILMAX	TSTEP			ST

Bits	Field Name	Description	Type	Reset
7:6	VGAIN_SEL	Select output voltage multiplication factor: G (EEPROM bits): when 00: x1 when 01: x1 when 10: x2 when 11: x3	RW	0x0
5:4	ILMAX	Select maximum load current: when 0: 1.0 A when 1: 1.5 A	RW	0
3:2	TSTEP	Time step: when changing the output voltage, the new value is reached through successive 12.5 mV voltage steps (if not bypassed). The equivalent programmable slew rate of the output voltage is then: TSTEP[2:0] = 000: step duration is 0, step function is bypassed TSTEP[2:0] = 001: 12.5 mV/µs (sampling 3 MHz) TSTEP[2:0] = 010: 9.4 mV/µs (sampling 3 MHz × 3/4) TSTEP[2:0] = 011: 7.5 mV/µs (sampling 3 MHz × 3/5) (default) TSTEP[2:0] = 100: 6.25 mV/µs(sampling 3 MHz/2) TSTEP[2:0] = 101: 4.7 mV/µs(sampling 3 MHz/3) TSTEP[2:0] = 110: 3.12 mV/µs(sampling 3 MHz/4) TSTEP[2:0] = 111: 2.5 mV/µs(sampling 3 MHz/5)	RW	0x1
1:0	ST	Supply state (EEPROM bits): ST[1:0] = 00 : Off ST[1:0] = 01 : On, high power mode ST[1:0] = 10 : Off ST[1:0] = 11 : On, low power mode	RW	0x0

Table 6-37 VDD2_OP_REG

Address Offset	0x25
Physical Address		Instance
Description	VDD2 voltage selection register. This register can be accessed by both control and smartreflex I²C interfaces depending on SR_CTL_I2C_SEL register bit value.
Type	RW

7	6	5	4	3	2	1	0
CMD	SEL

Bits	Field Name	Description	Type	Reset
7	CMD	Smart-Reflex command: when 0: VDD2_OP_REG voltage is applied when 1: VDD2_SR_REG voltage is applied	RW	0
6:0	SEL	Output voltage (EEPROM bits) selection with GAIN_SEL = 00 (G = 1, 12.5 mV per LSB): SEL[6:0] = 1001011 to 1111111 : 1.5 V ... SEL[6:0] = 0111111 : 1.35 V ... SEL[6:0] = 0110011 : 1.2 V ... SEL[6:0] = 0000001 to 0000011 : 0.6 V SEL[6:0] = 0000000 : Off (0.0 V) Note: from SEL[6:0] = 3 to 75 (dec) Vout= (SEL[6:0] × 12.5 mV + 0.5625 V) × G	RW	See ⁽¹⁾

(1) The reset value for this field varies with boot mode selection and the processor support. Please refer to the corresponding processor user guide to find the correct default value.

Table 6-38 VDD2_SR_REG

Address Offset	0x26
Physical Address		Instance
Description	VDD2 voltage selection register for smartreflex. This register can be accessed by both control and smartreflex I²C interfaces depending on SR_CTL_I2C_SEL register bit value.
Type	RW

7	6	5	4	3	2	1	0
Reserved	SEL

Bits	Field Name	Description	Type	Reset
7	Reserved	Reserved bit	RO R returns 0s	0
6:0	SEL	Output voltage (EEPROM bits) selection with GAIN_SEL = 00 (G = 1, 12.5 mV per LSB): SEL[6:0] = 1001011 to 1111111: 1.5 V ... SEL[6:0] = 0111111: 1.35V ... SEL[6:0] = 0110011: 1.2V ... SEL[6:0] = 0000001 to 0000011: 0.6V SEL[6:0] = 0000000: Off (0.0V) Note: from SEL[6:0] = 3 to 75 (dec) Vout= (SEL[6:0] × 12.5 mV + 0.5625 V) ×G	RW	See ⁽¹⁾

(1) The reset value for this field varies with boot mode selection and the processor support. Please refer to the corresponding processor user guide to find the correct default value.

Table 6-39 VDD3_REG

Address Offset	0x27
Physical Address		Instance
Description	VDD2 voltage selection register for smartreflex. This register can be accessed by both control and smartreflex I²C interfaces depending on SR_CTL_I2C_SEL register bit value.
Type	RW

7	6	5	4	3	2	1	0
Reserved					CKINEN	ST

Bits	Field Name	Description	Type	Reset
7:3	Reserved	Reserved bit	RO R returns 0s	0x00
2	CKINEN	Enable 1MHz clock synchronization	RW	1
1:0	ST	Supply state (EEPROM bits): ST[1:0] = 00 : Off ST[1:0] = 01 : On high power (ACTIVE) ST[1:0] = 10 : Off ST[1:0] = 11 : On low power (SLEEP)	RW	0x0

Table 6-40 VDIG1_REG

Address Offset	0x30
Physical Address		Instance
Description	VDIG1 regulator control register
Type	RW

7	6	5	4	3	2	1	0
Reserved				SEL		ST

Bits	Field Name	Description	Type	Reset
7:4	Reserved	Reserved bit	RO R returns 0s	0x0
3:2	SEL	Supply voltage (EEPROM bits): SEL[1:0] = 00 : 1.2 V SEL[1:0] = 01 : 1.5 V SEL[1:0] = 10 : 1.8 V SEL[1:0] = 11 : 2.7 V	RW	See ⁽¹⁾
1:0	ST	Supply state (EEPROM bits): ST[1:0] = 00 : Off ST[1:0] = 01 : On high power (ACTIVE) ST[1:0] = 10 : Off ST[1:0] = 11 : On low power (SLEEP)	RW	0x0

(1) The reset value for this field varies with boot mode selection and the processor support. Please refer to the corresponding processor user guide to find the correct default value.

Table 6-41 VDIG2_REG

Address Offset	0x31
Physical Address		Instance
Description	VDIG2 regulator control register
Type	RW

7	6	5	4	3	2	1	0
Reserved				SEL		ST

Bits	Field Name	Description	Type	Reset
7:4	Reserved	Reserved bit	RO R returns 0s	0x0
3:2	SEL	Supply voltage (EEPROM bits): SEL[1:0] = 00 : 1.0 V SEL[1:0] = 01 : 1.1 V SEL[1:0] = 10 : 1.2 V SEL[1:0] = 11 : 1.8 V	RW	See ⁽¹⁾
1:0	ST	Supply state (EEPROM bits): ST[1:0] = 00 : Off ST[1:0] = 01 : On high power (ACTIVE) ST[1:0] = 10 : Off ST[1:0] = 11 : On low power (SLEEP)	RW	0x0

(1) The reset value for this field varies with boot mode selection and the processor support. Please refer to the corresponding processor user guide to find the correct default value.

Table 6-42 VAUX1_REG

Address Offset	0x32
Physical Address		Instance
Description	VAUX1 regulator control register
Type	RW

7	6	5	4	3	2	1	0
Reserved				SEL		ST

Bits	Field Name	Description	Type	Reset
7:4	Reserved	Reserved bit	RO R returns 0s	0x0
3:2	SEL	Supply voltage (EEPROM bits): SEL[1:0] = 00 : 1.8 V SEL[1:0] = 01 : 2.5 V SEL[1:0] = 10 : 2.8 V SEL[1:0] = 11 : 2.85 V	RW	See ⁽¹⁾
1:0	ST	Supply state (EEPROM bits): ST[1:0] = 00 : Off ST[1:0] = 01 : On high power (ACTIVE) ST[1:0] = 10 : Off ST[1:0] = 11 : On low power (SLEEP)	RW	0x0

(1) The reset value for this field varies with boot mode selection and the processor support. Please refer to the corresponding processor user guide to find the correct default value.

Table 6-43 VAUX2_REG

Address Offset	0x33
Physical Address		Instance
Description	VAUX2 regulator control register
Type	RW

7	6	5	4	3	2	1	0
Reserved				SEL		ST

Bits	Field Name	Description	Type	Reset
7:4	Reserved	Reserved bit	RO R returns 0s	0x0
3:2	SEL	Supply voltage (EEPROM bits): SEL[1:0] = 00 : 1.8 V SEL[1:0] = 01 : 2.8 V SEL[1:0] = 10 : 2.9 V SEL[1:0] = 11 : 3.3 V	RW	See ⁽¹⁾
1:0	ST	Supply state (EEPROM bits): ST[1:0] = 00 : Off ST[1:0] = 01 : On high power (ACTIVE) ST[1:0] = 10 : Off ST[1:0] = 11 : On low power (SLEEP)	RW	0x0

(1) The reset value for this field varies with boot mode selection and the processor support. Please refer to the corresponding processor user guide to find the correct default value.

Table 6-44 VAUX33_REG

Address Offset	0x34
Physical Address		Instance
Description	VAUX33 regulator control register
Type	RW

7	6	5	4	3	2	1	0
Reserved				SEL		ST

Bits	Field Name	Description	Type	Reset
7:4	Reserved	Reserved bit	RO R returns 0s	0x0
3:2	SEL	Supply voltage (EEPROM bits): SEL[1:0] = 00 : 1.8 V SEL[1:0] = 01 : 2.0 V SEL[1:0] = 10 : 2.8 V SEL[1:0] = 11 : 3.3 V	RW	See ⁽¹⁾
1:0	ST	Supply state (EEPROM bits): ST[1:0] = 00 : Off ST[1:0] = 01 : On high power (ACTIVE) ST[1:0] = 10 : Off ST[1:0] = 11 : On low power (SLEEP)	RW	0x0

(1) The reset value for this field varies with boot mode selection and the processor support. Please refer to the corresponding processor user guide to find the correct default value.

Table 6-45 VMMC_REG

Address Offset	0x35
Physical Address		Instance
Description	VMMC regulator control register
Type	RW

7	6	5	4	3	2	1	0
Reserved				SEL		ST

Bits	Field Name	Description	Type	Reset
7:4	Reserved	Reserved bit	RO R returns 0s	0x0
3:2	SEL	Supply voltage (EEPROM bits): SEL[1:0] = 00 : 1.8 V SEL[1:0] = 01 : 2.8 V SEL[1:0] = 10 : 3.0 V SEL[1:0] = 11 : 3.3 V	RW	See ⁽¹⁾
1:0	ST	Supply state (EEPROM bits): ST[1:0] = 00: Off ST[1:0] = 01: On high power (ACTIVE) ST[1:0] = 10: Off ST[1:0] = 11: On low power (SLEEP)	RW	0x0

(1) The reset value for this field varies with boot mode selection and the processor support. Please refer to the corresponding processor user guide to find the correct default value.

Table 6-46 VPLL_REG

Address Offset	0x36
Physical Address		Instance
Description	VPLL regulator control register
Type	RW

7	6	5	4	3	2	1	0
Reserved				SEL		ST

Bits	Field Name	Description	Type	Reset
7:4	Reserved	Reserved bit	RO R returns 0s	0x0
3:2	SEL	Supply voltage (EEPROM bits): SEL[1:0] = 00 : 1.0 V SEL[1:0] = 01 : 1.1 V SEL[1:0] = 10 : 1.8 V SEL[1:0] = 11 : 2.5 V	RW	See ⁽¹⁾
1:0	ST	Supply state (EEPROM bits): ST[1:0] = 00 : Off ST[1:0] = 01 : On high power (ACTIVE) ST[1:0] = 10 : Off ST[1:0] = 11 : On low power (SLEEP)	RW	0x0

(1) The reset value for this field varies with boot mode selection and the processor support. Please refer to the corresponding processor user guide to find the correct default value.

Table 6-47 VDAC_REG

Address Offset	0x37
Physical Address		Instance
Description	VDAC regulator control register
Type	RW

7	6	5	4	3	2	1	0
Reserved				SEL		ST

Bits	Field Name	Description	Type	Reset
7:4	Reserved	Reserved bit	RO R returns 0s	0x0
3:2	SEL	Supply voltage (EEPROM bits): SEL[1:0] = 00 : 1.8 V SEL[1:0] = 01 : 2.6 V SEL[1:0] = 10 : 2.8 V SEL[1:0] = 11 : 2.85 V	RW	See ⁽¹⁾
1:0	ST	Supply state (EEPROM bits): ST[1:0] = 00 : Off ST[1:0] = 01 : On high power (ACTIVE) ST[1:0] = 10 : Off ST[1:0] = 11 : On low power (SLEEP)	RW	0x0

(1) The reset value for this field varies with boot mode selection and the processor support. Please refer to the corresponding processor user guide to find the correct default value.

Table 6-48 Therm_REG

Address Offset	0x38
Physical Address		Instance
Description	Thermal control register
Type	RW

7	6	5	4	3	2	1	0
Reserved		THERM_HD	THERM_TS	THERM_HDSEL		RSVD1	THERM_STATE

Bits	Field Name	Description	Type	Reset
7:6	Reserved	Reserved bit	RO R returns 0s	0x0
5	THERM_HD	Hot die detector output: when 0: the hot die threshold is not reached when 1: the hot die threshold is reached	RO	0
4	THERM_TS	Thermal shutdown detector output: when 0: the thermal shutdown threshold is not reached when 1: the thermal shutdown threshold is reached	RO	0
3:2	THERM_HDSEL	Temperature selection for Hot Die detector: when 00: Low temperature threshold … when 11: High temperature threshold	RW	0x3
1	RSVD1	Reserved bit	RW	0
0	THERM_STATE	Thermal shutdown module enable signal: when 0: thermal shutdown module is disable when 1: thermal shutdown module is enable	RW	1

Table 6-49 BBCH_REG

Address Offset	0x39
Physical Address		Instance
Description	Back-up battery charger control register
Type	RW

7	6	5	4	3	2	1	0
Reserved					BBSEL		BBCHEN

Bits	Field Name	Description	Type	Reset
7:4	Reserved	Reserved bit	RO R returns 0s	0x00
2:1	BBSEL	Back up battery charge voltage selection: BBSEL[1:0] = 00 : 3.0 V BBSEL[1:0] = 01 : 2.52 V BBSEL[1:0] = 10 : 3.15 V BBSEL[1:0] = 11 : VBAT	RW	0x0
0	BBCHEN	Back up battery charge enable	RW	0

Table 6-50 DCDCCTRL_REG

Address Offset	0x3E
Physical Address		Instance
Description	DCDC control register
Type	RW

7	6	5	4	3	2	1	0
Reserved		VDD2_PSKIP	VDD1_PSKIP	VIO_PSKIP	DCDCCKEXT	DCDCCKSYNC

Bits	Field Name	Description	Type	Reset
7:6	Reserved	Reserved bit	RO R returns 0s	0x0
5	VDD2_PSKIP	VDD2 pulse skip mode enable (EEPROM bit)	RW	1
4	VDD1_PSKIP	VDD1 pulse skip mode enable (EEPROM bit)	RW	1
3	VIO_PSKIP	VIO pulse skip mode enable (EEPROM bit)	RW	1
2	DCDCCKEXT	This signal control the muxing of the GPIO0 pad: When 0: this pad is a GPIO When 1: this pad is used as input for an external clock used for the synchronisation of the DCDCs	RW	0
1:0	DCDCCKSYNC	DCDC clock configuration: DCDCCKSYNC[1:0] = 00 : no synchronization of DCDC clocks DCDCCKSYNC[1:0] = 01 : DCDC synchronous clock with phase shift DCDCCKSYNC[1:0] = 10 : no synchronization of DCDC clocks DCDCCKSYNC[1:0] = 11 : DCDC synchronous clock	RW	0x3

Table 6-51 DEVCTRL_REG

Address Offset	0x3F
Physical Address		Instance
Description	Device control register
Type	RW

7	6	5	4	3	2	1	0
Reserved	RTC_PWDN	CK32K_CTRL	SR_CTL_I2C_SEL	DEV_OFF_RST	DEV_ON	DEV_SLP	DEV_OFF

Bits	Field Name	Description	Type	Reset
7	Reserved	Reserved bit	RO R returns 0s	0
6	RTC_PWDN	When 1, disable the RTC digital domain (clock gating and reset of RTC registers and logic). This register bit is not reset in BACKUP state (EEPROM bit)	RW	1
5	CK32K_CTRL	Internal 32-kHz clock source control bit (EEPROM bit): when 0, the internal 32-kHz clock source is the crystal oscillator or an external 32-kHz clock in case the crystal oscillator is used in bypass mode when 1, the internal 32-kHz clock source is the RC oscillator.	RW	1
4	SR_CTL_I2C_SEL	Smartreflex registers access control bit: when 0: access to smartreflex registers by smartreflex I2C when 1: access to smartreflex registers by control I2C The smartreflex registers are: VDD1_OP_REG, VDD1_SR_REG, VDD2_OP_REG and VDD2_SR_REG.	RW	0
3	DEV_OFF_RST	Write 1 will start an ACTIVE to OFF or SLEEP to OFF device state transition (switch-off event) and activate reset of the digital core.	RW	0
2	DEV_ON	Write 1 will maintain the device on (ACTIVE or SLEEP device state) (if DEV_OFF = 0 and DEV_OFF_RST = 0).	RW	0
1	DEV_SLP	Write 1 allows SLEEP device state (if DEV_OFF = 0 and DEV_OFF_RST = 0). Write ‘0’ will start an SLEEP to ACTIVE device state transition (wake-up event) (if DEV_OFF = 0 and DEV_OFF_RST = 0). This bit is cleared in OFF state.	RW	0
0	DEV_OFF	Write 1 will start an ACTIVE to OFF or SLEEP to OFF device state transition (switch-off event). This bit is cleared in OFF state.	RW	0

Table 6-52 DEVCTRL2_REG

Address Offset	0x40
Physical Address		Instance
Description	Device control register
Type	RW

7	6	5	4	3	2	1	0
Reserved		TSLOT_LENGTH		SLEEPSIG_POL	PWRON_LP_OFF	PWRON_LP_RST	IT_POL

Bits	Field Name	Description	Type	Reset
7:6	Reserved	Reserved bit	RO R returns 0s	0x0
5:4	TSLOT_LENGTH	Time slot duration programming (EEPROM bit): When 00 : 0 µs When 01 : 200 µs When 10 : 500 µs When 11 : 2 ms	RW	0x3
3	SLEEPSIG_POL	When 1, SLEEP signal active high When 0, SLEEP signal active low	RW	0
2	PWRON_LP_OFF	When 1, allows device turn-off after a PWRON long press (signal low).	RW	1
1	PWRON_LP_RST	When 1, allows digital core reset when the device is OFF after a PWRON long press (signal low).	RW	0
0	IT_POL	INT1 interrupt pad polarity control signal (EEPROM bit): When 0, active low When 1, active high	RW	0

Table 6-53 SLEEP_KEEP_LDO_ON_REG

Address Offset	0x41
Physical Address		Instance
Description	When corresponding control bit=0 in EN1/2_ LDO_ASS register (default setting): Configuration Register keeping the full load capability of LDO regulator (ACTIVE mode) during the SLEEP state of the device. When control bit=1, LDO regulator full load capability (ACTIVE mode) is maintained during device SLEEP state. When control bit=0, the LDO regulator is set or stay in low power mode during device SLEEP state(but then supply state can be overwritten programming ST[1:0]). Control bit value has no effect if the LDO regulator is off. When corresponding control bit=1 in EN1/2_ LDO_ASS register: Configuration Register setting the LDO regulator state driven by SCLSR_EN1/2 signal low level (when SCLSR_EN1/2 is high the regulator is on, full power): - The regulator is set off if its corresponding Control bit = 0 in SLEEP_KEEP_LDO_ON register (default) - The regulator is set in low power mode if its corresponding control bit = 1 in SLEEP_KEEP_LDO_ON register
Type	RW

7	6	5	4	3	2	1	0
VDAC_KEEPON	VPLL_KEEPON	VAUX33_KEEPON	VAUX2_KEEPON	VAUX1_KEEPON	VDIG2_KEEPON	VDIG1_KEEPON	VMMC_KEEPON

Bits	Field Name	Description	Type
7	VDAC_KEEPON	Setting supply state during device SLEEP state or when SCLSR_EN1/2 is low	RW
6	VPLL_KEEPON	Setting supply state during device SLEEP state or when SCLSR_EN1/2 is low	RW
5	VAUX33_KEEPON	Setting supply state during device SLEEP state or when SCLSR_EN1/2 is low	RW
4	VAUX2_KEEPON	Setting supply state during device SLEEP state or when SCLSR_EN1/2 is low	RW
3	VAUX1_KEEPON	Setting supply state during device SLEEP state or when SCLSR_EN1/2 is low	RW
2	VDIG2_KEEPON	Setting supply state during device SLEEP state or when SCLSR_EN1/2 is low	RW
1	VDIG1_KEEPON	Setting supply state during device SLEEP state or when SCLSR_EN1/2 is low	RW
0	VMMC_KEEPON	Setting supply state during device SLEEP state or when SCLSR_EN1/2 is low	RW

Table 6-54 SLEEP_KEEP_RES_ON_REG

Address Offset	0x42
Physical Address		Instance
Description	Configuration Register keeping, during the SLEEP state of the device (but then supply state can be overwritten programming ST[1:0]): - The full load capability of LDO regulator (ACTIVE mode), - The PWM mode of DCDC converter - 32KHz clock output - Register access though I2C interface (keeping the internal high speed clock on) - Die Thermal monitoring on Control bit value has no effect if the resource is off.
Type	RW

7	6	5	4	3	2	1	0
THERM_KEEPON	CLKOUT32K_KEEPON	VRTC_KEEPON	I2CHS_KEEPON	VDD3_KEEPON	VDD2_KEEPON	VDD1_KEEPON	VIO_KEEPON

Bits	Field Name	Description	Type
7	THERM_KEEPON	When 1, thermal monitoring is maintained during device SLEEP state. When 0, thermal monitoring is turned off during device SLEEP state.	RW
6	CLKOUT32K_KEEPON	When 1, CLK32KOUT output is maintained during device SLEEP state. When 0, CLK32KOUT output is set low during device SLEEP state.	RW
5	VRTC_KEEPON	When 1, LDO regulator full load capability (ACTIVE mode) is maintained during device SLEEP state. When 0, the LDO regulator is set or stays in low power mode during device SLEEP state.	RW
4	I2CHS_KEEPON	When 1, high speed internal clock is maintained during device SLEEP state. When 0, high speed internal clock is turned off during device SLEEP state.	RW
3	VDD3_KEEPON	When 1, VDD3 SMPS high power mode is maintained during device SLEEP state. No effect if VDD3 working mode is low power. When 0, VDD3 SMPS low power mode is set during device SLEEP state.	RW
2	VDD2_KEEPON	If VDD2_EN1&2 control bit = 0 (default setting): When 1, VDD2 SMPS PWM mode is maintained during device SLEEP state. No effect if VDD2 working mode is PFM. When 0, VDD2 SMPS PFM mode is set during device SLEEP state.	RW
1	VDD1_KEEPON	If VDD1_EN1&2 control bit=0 (default setting): When 1, VDD1 SMPS PWM mode is maintained during device SLEEP state. No effect if VDD1 working mode is PFM. When 0, VDD1 SMPS PFM mode is set during device SLEEP state.	RW
0	VIO_KEEPON	If VIO_EN1&2 control bit=0 (default setting): When 1, VIO SMPS PWM mode is maintained during device SLEEP state. No effect if VIO working mode is PFM. When 0, VIO SMPS PFM mode is set during device SLEEP state.	RW

Table 6-55 SLEEP_SET_LDO_OFF_REG

Address Offset	0x43
Physical Address		Instance
Description	Configuration Register turning-off LDO regulator during the SLEEP state of the device. Corresponding _KEEP_ON control bit in SLEEP_KEEP_RES_ON register should be 0 to make this _SET_OFF control bit effective
Type	RW

7	6	5	4	3	2	1	0
VDAC_SETOFF	VPLL_SETOFF	VAUX33_SETOFF	VAUX2_SETOFF	VAUX1_SETOFF	VDIG2_SETOFF	VDIG1_SETOFF	VMMC_SETOFF

Bits	Field Name	Description	Type
7	VDAC_SETOFF	When 1, LDO regulator is turned off during device SLEEP state. When 0, No effect	RW
6	VPLL_SETOFF	When 1, LDO regulator is turned off during device SLEEP state. When 0, No effect	RW
5	VAUX33_SETOFF	When 1, LDO regulator is turned off during device SLEEP state. When 0, No effect	RW
4	IVAUX2_SETOFF	When 1, LDO regulator is turned off during device SLEEP state. When 0, No effect	RW
3	VAUX1_SETOFF	When 1, LDO regulator is turned off during device SLEEP state. When 0, No effect	RW
2	VDIG2_SETOFF	When 1, LDO regulator is turned off during device SLEEP state. When 0, No effect	RW
1	VDIG1_SETOFF	When 1, LDO regulator is turned off during device SLEEP state. When 0, No effect	RW
0	VMMC_SETOFF	When 1, LDO regulator is turned off during device SLEEP state. When 0, No effect	RW

Table 6-56 SLEEP_SET_RES_OFF_REG

Address Offset	0x44
Physical Address		Instance
Description	Configuration Register turning-off SMPS regulator during the SLEEP state of the device. Corresponding _KEEP_ON control bit in SLEEP_KEEP_RES_ON2 register should be 0 to make this _SET_OFF control bit effective. Supplies voltage expected after their wake-up (SLEEP to ACTIVE state transition) can also be programmed.
Type	RW

7	6	5	4	3	2	1	0
DEFAULT_VOLT	RSVD		SPARE_SETOFF	VDD3_SETOFF	VDD2_SETOFF	VDD1_SETOFF	VIO_SETOFF

Bits	Field Name	Description	Type	Reset
7	DEFAULT_VOLT	When 1, default voltages (registers value after switch-on) will be used to turned-on supplies during SLEEP to ACTIVE state transition. When 0, voltages programmed before the ACTIVE to SLEEP state transition will be used to turned-on supplies during SLEEP to ACTIVE state transition.	RW	0
6:5	RSVD	Reserved bit	RO R returns 0s	0x0
4	SPARE_SETOFF	Spare bit	RW	0
3	VDD3_SETOFF	When 1, SMPS is turned off during device SLEEP state. When 0, No effect.	RW	0
2	VDD2_SETOFF	When 1, SMPS is turned off during device SLEEP state. When 0, No effect.	RW	0
1	VDD1_SETOFF	When 1, SMPS is turned off during device SLEEP state. When 0, No effect.	RW	0
0	VIO_SETOFF	When 1, SMPS is turned off during device SLEEP state. When 0, No effect.	RW	0

Table 6-57 EN1_LDO_ASS_REG

Address Offset	0x45
Physical Address		Instance
Description	Configuration Register setting the LDO regulators, driven by the multiplexed SCLSR_EN1 signal. When control bit = 1, LDO regulator state is driven by the SCLSR_EN1 control signal and is also defined though SLEEP_KEEP_LDO_ON register setting: When SCLSR_EN1 is high the regulator is on, When SCLSR_EN1 is low: - The regulator is off if its corresponding Control bit = 0 in SLEEP_KEEP_LDO_ON register - The regulator is working in low power mode if its corresponding control bit = 1 in SLEEP_KEEP_LDO_ON register When control bit = 0 no effect : LDO regulator state is driven though registers programming and the device state Any control bit of this register set to 1 will disable the I2C SR Interface functionality
Type	RW

7	6	5	4	3	2	1	0
VDAC_EN1	VPLL_EN1	VAUX33_EN1	VAUX2_EN1	VAUX1_EN1	VDIG2_EN1	VDIG1_EN1	VMMC_EN1

Bits	Field Name	Description	Type
7	VDAC_EN1	Setting supply state control though SCLSR_EN1 signal	RW
6	VPLL_EN1	Setting supply state control though SCLSR_EN1 signal	RW
5	VAUX33_EN1	Setting supply state control though SCLSR_EN1 signal	RW
4	VAUX2_EN1	Setting supply state control though SCLSR_EN1 signal	RW
3	VAUX1_EN1	Setting supply state control though SCLSR_EN1 signal	RW
2	VDIG2_EN1	Setting supply state control though SCLSR_EN1 signal	RW
1	VDIG1_EN1	Setting supply state control though SCLSR_EN1 signal	RW
0	VMMC_EN1	Setting supply state control though SCLSR_EN1 signal	RW

Table 6-58 EN1_SMPS_ASS_REG

Address Offset	0x46
Physical Address		Instance
Description	Configuration Register setting the SMPS Supplies driven by the multiplexed SCLSR_EN1 signal. When control bit = 1, SMPS Supply state and voltage is driven by the SCLSR_EN1 control signal and is also defined though SLEEP_KEEP_RES_ON register setting. When control bit = 0 no effect : SMPS Supply state is driven though registers programming and the device state. Any control bit of this register set to 1 will disable the I2C SR Interface functionality
Type	RW

7	6	5	4	3	2	1	0
RSVD			SPARE_EN1	VDD3_EN1	VDD2_EN1	VDD1_EN1	VIO_EN1

Bits	Field Name	Description	Type
7:5	RSVD	Reserved bit	RW
4	SPARE_EN1	Spare bit	Rw
3	VDD3_EN1	When 1: When SCLSR_EN1 is high the supply is on. When SCLSR_EN1 is low and SLEEP_KEEP_RES_ON = '0' the supply voltage is off. When SCLSR_EN1 is low and SLEEP_KEEP_RES_ON = '1' the SMPS is working in low power mode. When control bit = 0 no effect: supply state is driven though registers programming and the device state	RW
2	VDD2_EN1	When control bit = 1: When SCLSR_EN1 is high the supply voltage is programmed though VDD2_OP_REG register, and it can also be programmed off. When SCLSR_EN1 is low the supply voltage is programmed though VDD2_SR_REG register, and it can also be programmed off. When SCLSR_EN1 is low and VDD2_KEEPON = 1 the SMPS is working in low power mode, if not tuned off through VDD2_SR_REG register. When control bit = 0 no effect: supply state is driven though registers programming and the device state	RW
1	VDD1_EN1	When 1: When SCLSR_EN1 is high the supply voltage is programmed though VDD1_OP_REG register, and it can also be programmed off. When SCLSR_EN1 is low the supply voltage is programmed though VDD1_SR_REG register, and it can also be programmed off. When SCLSR_EN1 is low and VDD1_KEEPON = 1 the SMPS is working in low power mode, if not tuned off though VDD1_SR_REG register. When control bit = 0 no effect: supply state is driven though registers programming and the device state	RW
0	VIO_EN1	When control bit = 1, supply state is driven by the SCLSR_EN1 control signal and is also defined though SLEEP_KEEP_RES_ON register setting: When SCLSR_EN1 is high the supply is on, When SCLSR_EN1 is low: - the supply is off (default) or the SMPS is working in low power mode if VIO_KEEPON = 1 When control bit = 0 no effect: SMPS state is driven though registers programming and the device state	RW

Table 6-59 EN2_LDO_ASS_REG

Address Offset	0x47
Physical Address		Instance
Description	Configuration Register setting the LDO regulators, driven by the multiplexed SDASR_EN2 signal. When control bit = 1, LDO regulator state is driven by the SDASR_EN2 control signal and is also defined though SLEEP_KEEP_LDO_ON register setting: When SDASR_EN2 is high the regulator is on, When SCLSR_EN2 is low: - The regulator is off if its corresponding Control bit = 0 in SLEEP_KEEP_LDO_ON register - The regulator is working in low power mode if its corresponding control bit = 1 in SLEEP_KEEP_LDO_ON register When control bit = 0 no effect: LDO regulator state is driven though registers programming and the device state Any control bit of this register set to 1 will disable the I2C SR Interface functionality
Type	RW

7	6	5	4	3	2	1	0
VDAC_EN2	VPLL_EN2	VAUX33_EN2	VAUX2_EN2	VAUX1_EN2	VDIG2_EN2	VDIG1_EN2	VMMC_EN2

Bits	Field Name	Description	Type
7	VDAC_EN2	Setting supply state control though SDASR_EN2 signal	RW
6	VPLL_EN2	Setting supply state control though SDASR_EN2 signal	RW
5	VAUX33_EN2	Setting supply state control though SDASR_EN2 signal	RW
4	VAUX2_EN2	Setting supply state control though SDASR_EN2 signal	RW
3	VAUX1_EN2	Setting supply state control though SDASR_EN2 signal	RW
2	VDIG2_EN2	Setting supply state control though SDASR_EN2 signal	RW
1	VDIG1_EN2	Setting supply state control though SDASR_EN2 signal	RW
0	VMMC_EN2	Setting supply state control though SDASR_EN2 signal	RW

Table 6-60 EN2_SMPS_ASS_REG

Address Offset	0x48
Physical Address		Instance
Description	Configuration Register setting the SMPS Supplies driven by the multiplexed SDASR_EN2 signal. When control bit = 1, SMPS Supply state and voltage is driven by the SDASR_EN2 control signal and is also defined though SLEEP_KEEP_RES_ON register setting. When control bit = 0 no effect: SMPS Supply state is driven though registers programming and the device state Any control bit of this register set to 1 will disable the I2C SR Interface functionality
Type	RW

7	6	5	4	3	2	1	0
RSVD			SPARE_EN2	VDD3_EN2	VDD2_EN2	VDD1_EN2	VIO_EN2

Bits	Field Name	Description	Type	Reset
7:5	RSVD	Reserved bit	RO R returns 0s	0x0
4	SPARE_EN2	Spare bit	RW	0
3	VDD3_EN2	When 1: When SDASR_EN2 is high the supply is on. When SDASR_EN2 is low and SLEEP_KEEP_RES_ON = 0 the supply voltage is off. When SDASR_EN2 is low and SLEEP_KEEP_RES_ON = 1 the SMPS is working in low power mode. When control bit = 0 no effect: supply state is driven though registers programming and the device state	RW	0
2	VDD2_EN2	When control bit = 1: When SDASR_EN2 is high the supply voltage is programmed though VDD2_OP_REG register, and it can also be programmed off. When SDASR_EN2 is low the supply voltage is programmed though VDD2_SR_REG register, and it can also be programmed off. When SDASR_EN2 is low and and VDD2_KEEPON = 1 the SMPS is working in low power mode, if not tuned off though VDD2_SR_REG register. When control bit = 0 no effect: supply state is driven though registers programming and the device state	RW	0
1	VDD1_EN2	When control bit = 1: When SDASR_EN2 is high the supply voltage is programmed though VDD1_OP_REG register, and it can also be programmed off. When SDASR_EN2 is low the supply voltage is programmed though VDD1_SR_REG register, and it can also be programmed off. When SDASR_EN2 is low and and VDD1_KEEPON = 1 the SMPS is working in low power mode, if not tuned off though VDD1_SR_REG register. When control bit = 0 no effect: supply state is driven though registers programming and the device state	RW	0
0	VIO_EN2	When control bit = 1, supply state is driven by the SCLSR_EN2 control signal and is also defined though SLEEP_KEEP_RES_ON register setting: When SDASR _EN2 is high the supply is on, When SDASR _EN2 is low : - The supply is off (default) or the SMPS is working in low power mode if VIO_KEEPON = 1 When control bit = 0 no effect: SMPS state is driven though registers programming and the device state	RW	0

Table 6-61 RESERVED

Address Offset	0x49
Physical Address		Instance
Description	Reserved register
Type	RW

7	6	5	4	3	2	1	0
RESERVED

Bits	Field Name	Description	Type	Reset
7:0	RESERVED	Reserved bit	RW	0

Table 6-62 RESERVED

Address Offset	0x4A
Physical Address		Instance
Description	Reserved register
Type	RW

7	6	5	4	3	2	1	0
RESERVED

Bits	Field Name	Description	Type	Reset
7:0	RESERVED	Reserved bit	RW	0x00

Table 6-63 INT_STS_REG

Address Offset	0x50
Physical Address		Instance
Description	Interrupt status register: The interrupt status bit is set to 1 when the associated interrupt event is detected. Interrupt status bit is cleared by writing 1.
Type	RW

7	6	5	4	3	2	1	0
RTC_PERIOD_IT	RTC_ALARM_IT	HOTDIE_IT	PWRHOLD_IT	PWRON_LP_IT	PWRON_IT	VMBHI_IT	VMBDCH_IT

Bits	Field Name	Description	Type
7	RTC_PERIOD_IT	RTC period event interrupt status.	RW W1 to Clr
6	RTC_ALARM_IT	RTC alarm event interrupt status.	RW W1 to Clr
5	HOTDIE_IT	Hot die event interrupt status.	RW W1 to Clr
4	PWRHOLD_IT	PWRHOLD event interrupt status.	RW W1 to Clr
3	PWRON_LP_IT	PWRON Long Press event interrupt status.	RW W1 to Clr
2	PWRON_IT	PWRON event interrupt status.	RW W1 to Clr
1	VMBHI_IT	VBAT > VMBHI event interrupt status	RW W1 to Clr
0	VMBDCH_IT	VBAT > VMBDCH event interrupt status. Active only if Main Battery comparator VMBCH programmable threshold is not bypassed (VMBCH_SEL[1:0] ≠ 00)	RW W1 to Clr

Table 6-64 INT_MSK_REG

Address Offset	0x51
Physical Address		Instance
Description	Interrupt mask register: When _IT_MSK is set to 1, the associated interrupt is masked: INT1 signal is not activated, but _IT interrupt status bit is updated. When _IT_MSK is set to 0, the associated interrupt is enabled: INT1 signal is activated, _IT is updated.
Type	RW

7	6	5	4	3	2	1	0
RTC_PERIOD_IT_MSK	RTC_ALARM_IT_MSK	HOTDIE_IT_MSK	PWRHOLD_IT_MSK	PWRON_LP_IT_MSK	PWRON_IT_MSK	VMBHI_IT_MSK	VMBDCH_IT_MSK

Bits	Field Name	Description	Type	Reset
7	RTC_PERIOD_IT_MSK	RTC period event interrupt mask.	RW	0
6	RTC_ALARM_IT_MSK	RTC alarm event interrupt mask.	RW	0
5	HOTDIE_IT_MSK	Hot die event interrupt mask.	RW	0
4	PWRHOLD_IT_MSK	PWRHOLD rising edge event interrupt mask.	RW	0
3	PWRON_LP_IT_MSK	PWRON Long Press event interrupt mask.	RW	0
2	PWRON_IT_MSK	PWRON event interrupt mask.	RW	0
1	VMBHI_IT_MSK	VBAT > VMBHI event interrupt mask. When 0, enable the device automatic switch on at BACKUP to OFF or NOSUPPLY to OFF device state transition (EEPROM bit)	RW	1
0	VMBDCH_IT_MSK	VBAT < VMBDCH event interrupt status. Active only if the main battery comparator VMBCH programmable threshold is not bypassed (VMBCH_SEL[1:0] ≠ 00).	RW	0

Table 6-65 INT_STS2_REG

Address Offset	0x52
Physical Address		Instance
Description	Interrupt status register: The interrupt status bit is set to 1 when the associated interrupt event is detected. Interrupt status bit is cleared by writing 1.
Type	RW

7	6	5	4	3	2	1	0
Reserved						GPIO0_F_IT	GPIO0_R_IT

Bits	Field Name	Description	Type
7:2	Reserved	Reserved bit	RW W1 to Clr
1	GPIO0_F_IT	GPIO_CKSYNC falling edge detection interrupt status	RW W1 to Clr
0	GPIO0_R_IT	GPIO_CKSYNC rising edge detection interrupt status	RW W1 to Clr

Table 6-66 INT_MSK2_REG

Address Offset	0x53
Physical Address		Instance
Description	Interrupt mask register: When _IT_MSK is set to 1, the associated interrupt is masked: INT1 signal is not activated, but _IT interrupt status bit is updated. When _IT_MSK is set to 0, the associated interrupt is enabled: INT1 signal is activated, _IT is updated.
Type	RW

7	6	5	4	3	2	1	0
Reserved						GPIO0_F_IT_MSK	GPIO0_R_IT_MSK

Bits	Field Name	Description	Type
7:2	Reserved	Reserved bit	RW
1	GPIO0_F_IT_MSK	GPIO_CKSYNC falling edge detection interrupt mask.	RW
0	GPIO0_R_IT_MSK	GPIO_CKSYNC rising edge detection interrupt mask.	RW

Table 6-67 GPIO0_REG

Address Offset	0x60
Physical Address		Instance
Description	GPIO0 configuration register
Type	RW

7	6	5	4	3	2	1	0
Reserved			GPIO_DEB	GPIO_PUEN	GPIO_CFG	GPIO_STS	GPIO_SET

Bits	Field Name	Description	Type	Reset
7:5	Reserved	Reserved bit	RO R returns 0s	0x0
4	GPIO_DEB	GPIO_CKSYNC input debouncing time configuration: When 0, the debouncing is 91.5 µs using a 30.5 µs clock rate When 1, the debouncing is 150 ms using a 50 ms clock rate	RW	0
3	GPIO_PUEN	GPIO_CKSYNC pad pull-up control: 1: Pull-up is enabled 0: Pull-up is disabled	RW	1
2	GPIO_CFG	Configuration of the GPIO_CKSYNC pad direction: When 0, the pad is configured as an input When 1, the pad is configured as an output	RW	0
1	GPIO_STS	Status of the GPIO_CKSYNC pad	RO	1
0	GPIO_SET	Value set on the GPIO output when configured in output mode	RW	0

Table 6-68 JTAGVERNUM_REG

Address Offset	0x80
Physical Address		Instance
Description	Silicon version number
Type	RO

7	6	5	4	3	2	1	0
Reserved				VERNUM

Bits	Field Name	Description	Type	Reset
7:4	Reserved	Reserved bit	RO R returns 0s	0x0
3:0	VERNUM	Value depending on silicon version number 0000 - Revision 1.0	RO	0x0

Package Options

Mechanical Data (Package|Pins)

Thermal pad, mechanical data (Package|Pins)

Orderable Information

6 Detailed Description

6.1 Power Reference

6.2 Power Sources

Table 6-1 Power Sources

6.3 Embedded Power Controller

6.3.1 State-Machine

6.3.2 Switch-On/-Off Sequences

6.3.3 Control Signals

6.3.3.1 SLEEP

6.3.3.2 PWRHOLD

6.3.3.3 BOOT0/BOOT1

6.3.3.4 NRESPWRON

6.3.3.5 CLK32KOUT

6.3.3.6 PWRON

6.3.3.7 INT1

6.3.3.8 SDASR_EN2 and SCLSR_EN1

6.3.3.9 GPIO_CKSYNC

6.3.4 Dynamic Voltage Frequency Scaling and Adaptive Voltage Scaling Operation

6.4 32-kHz RTC Clock

6.5 RTC

6.5.1 Time Calendar Registers

6.5.2 General Registers

6.5.3 Compensation Registers

6.6 Backup Battery Management

6.7 Backup Registers

6.8 I2C Interface

6.9 Thermal Monitoring and Shutdown

6.10 Interrupts

Table 6-2 Interrupt Sources

6.11 Package Description

6.12 Functional Registers

6.12.1 TPS65910_FUNC_REG Registers Mapping Summary

Table 6-3 TPS65910_FUNC_REG Register Summary

6.12.2 TPS65910_FUNC_REG Register Descriptions

Table 6-4 SECONDS_REG

Table 6-5 MINUTES_REG

Table 6-6 HOURS_REG

Table 6-7 DAYS_REG

Table 6-8 MONTHS_REG

Table 6-9 YEARS_REG

Table 6-10 WEEKS_REG

Table 6-11 ALARM_SECONDS_REG

Table 6-12 ALARM_MINUTES_REG

Table 6-13 ALARM_HOURS_REG

Table 6-14 ALARM_DAYS_REG

Table 6-15 ALARM_MONTHS_REG

Table 6-16 ALARM_YEARS_REG

Table 6-17 RTC_CTRL_REG

Table 6-18 RTC_STATUS_REG

Table 6-19 RTC_INTERRUPTS_REG

Table 6-20 RTC_COMP_LSB_REG

Table 6-21 RTC_COMP_MSB_REG

Table 6-22 RTC_RES_PROG_REG

Table 6-23 RTC_RESET_STATUS_REG

Table 6-24 BCK1_REG

Table 6-25 BCK2_REG

Table 6-26 BCK3_REG

Table 6-27 BCK4_REG

Table 6-28 BCK5_REG

Table 6-29 PUADEN_REG

Table 6-30 REF_REG

Table 6-31 VRTC_REG

Table 6-32 VIO_REG

Table 6-33 VDD1_REG

Table 6-34 VDD1_OP_REG

Table 6-35 VDD1_SR_REG

Table 6-36 VDD2_REG

Table 6-37 VDD2_OP_REG

Table 6-38 VDD2_SR_REG

Table 6-39 VDD3_REG

Table 6-40 VDIG1_REG

Table 6-41 VDIG2_REG

Table 6-42 VAUX1_REG

Table 6-43 VAUX2_REG

Table 6-44 VAUX33_REG

Table 6-45 VMMC_REG

6.8 I²C Interface