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TPS65910

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Integrated Power Management IC (PMIC) w/ 4 DC/DCs, 8 LDOs and RTC in 6x6mm QFN family

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Data sheet
Errata

TPS65910

ACTIVE
Data sheet Order now

Product details

Regulated outputs (#) 12 Configurability Factory programmable, Software configurable Vin (min) (V) 1.7 Vin (max) (V) 5.5 Vout (min) (V) 0.6 Vout (max) (V) 3.3 Iout (max) (A) 1.5 Features Comm control, Dynamic voltage scaling, Enable, I2C control, Overcurrent protection, Power sequencing, Synchronous rectification, Thermal shutdown Step-up DC/DC converter 1 Step-down DC/DC converter 3 Step-down DC/DC controller 0 Step-up DC/DC controller 0 LDO 8 Iq (typ) (mA) 0.36 Rating Catalog Switching frequency (max) (kHz) 3000 Operating temperature range (°C) -40 to 85 Processor supplier NXP/Freescale, Samsung, Texas Instruments Processor name DM64x, OMAP, S5Px, Sitara AM335x, Sitara AM35x, i.MX27, i.MX37, i.MX51 Switching frequency (typ) (kHz) 3000 Product type Processor and FPGA
Regulated outputs (#) 12 Configurability Factory programmable, Software configurable Vin (min) (V) 1.7 Vin (max) (V) 5.5 Vout (min) (V) 0.6 Vout (max) (V) 3.3 Iout (max) (A) 1.5 Features Comm control, Dynamic voltage scaling, Enable, I2C control, Overcurrent protection, Power sequencing, Synchronous rectification, Thermal shutdown Step-up DC/DC converter 1 Step-down DC/DC converter 3 Step-down DC/DC controller 0 Step-up DC/DC controller 0 LDO 8 Iq (typ) (mA) 0.36 Rating Catalog Switching frequency (max) (kHz) 3000 Operating temperature range (°C) -40 to 85 Processor supplier NXP/Freescale, Samsung, Texas Instruments Processor name DM64x, OMAP, S5Px, Sitara AM335x, Sitara AM35x, i.MX27, i.MX37, i.MX51 Switching frequency (typ) (kHz) 3000 Product type Processor and FPGA
VQFN (RSL) 48 36 mm² 6 x 6
  • Embedded Power Controller
  • Two Efficient Step-Down DC-DC Converters for Processor Cores
  • One Efficient Step-Down DC-DC Converter for I/O Power
  • One Efficient Step-Up 5-V DC-DC Converter
  • SmartReflex Compliant Dynamic Voltage Management for Processor Cores
  • 8 LDO Voltage Regulators and One Real-Time Clock (RTC) LDO (Internal Purpose)
  • One High-Speed I2C Interface for General-Purpose Control Commands (CTL-I2C)
  • One High-Speed I2C Interface for SmartReflex Class 3 Control and Command (SR-I2C)
  • Two Enable Signals Multiplexed with SR-I2C, Configurable to Control any Supply State and Processor Cores Supply Voltage
  • Thermal Shutdown Protection and Hot-Die Detection
  • An RTC Resource With:
    • Oscillator for 32.768-kHz Crystal or 32-kHz Built-in RC Oscillator
    • Date, Time, and Calendar
    • Alarm Capability
  • One Configurable GPIO
  • DC-DC Switching Synchronization Through Internal or External 3-MHz Clock
  • Embedded Power Controller
  • Two Efficient Step-Down DC-DC Converters for Processor Cores
  • One Efficient Step-Down DC-DC Converter for I/O Power
  • One Efficient Step-Up 5-V DC-DC Converter
  • SmartReflex Compliant Dynamic Voltage Management for Processor Cores
  • 8 LDO Voltage Regulators and One Real-Time Clock (RTC) LDO (Internal Purpose)
  • One High-Speed I2C Interface for General-Purpose Control Commands (CTL-I2C)
  • One High-Speed I2C Interface for SmartReflex Class 3 Control and Command (SR-I2C)
  • Two Enable Signals Multiplexed with SR-I2C, Configurable to Control any Supply State and Processor Cores Supply Voltage
  • Thermal Shutdown Protection and Hot-Die Detection
  • An RTC Resource With:
    • Oscillator for 32.768-kHz Crystal or 32-kHz Built-in RC Oscillator
    • Date, Time, and Calendar
    • Alarm Capability
  • One Configurable GPIO
  • DC-DC Switching Synchronization Through Internal or External 3-MHz Clock

The TPS65910 device is an integrated power-management IC available in 48-QFN package and dedicated to applications powered by one Li-Ion or Li-Ion polymer battery cell or 3-series Ni-MH cells, or by a 5-V input; it requires multiple power rails. The device provides three step-down converters, one step-up converter, and eight LDOs and is designed to support the specific power requirements of OMAP-based applications.

Two of the step-down converters provide power for dual processor cores and are controllable by a dedicated class-3 SmartReflex interface for optimum power savings. The third converter provides power for the I/Os and memory in the system.

The device includes eight general-purpose LDOs providing a wide range of voltage and current capabilities. The LDOs are fully controllable by the I2C interface. The use of the LDOs is flexible; they are intended to be used as follows: Two LDOs are designated to power the PLL and video DAC supply rails on the OMAP-based processors, four general-purpose auxiliary LDOs are available to provide power to other devices in the system, and two LDOs are provided to power DDR memory supplies in applications requiring these memories.

In addition to the power resources, the device contains an embedded power controller (EPC) to manage the power sequencing requirements of the OMAP systems and an RTC.

The TPS65910 device is an integrated power-management IC available in 48-QFN package and dedicated to applications powered by one Li-Ion or Li-Ion polymer battery cell or 3-series Ni-MH cells, or by a 5-V input; it requires multiple power rails. The device provides three step-down converters, one step-up converter, and eight LDOs and is designed to support the specific power requirements of OMAP-based applications.

Two of the step-down converters provide power for dual processor cores and are controllable by a dedicated class-3 SmartReflex interface for optimum power savings. The third converter provides power for the I/Os and memory in the system.

The device includes eight general-purpose LDOs providing a wide range of voltage and current capabilities. The LDOs are fully controllable by the I2C interface. The use of the LDOs is flexible; they are intended to be used as follows: Two LDOs are designated to power the PLL and video DAC supply rails on the OMAP-based processors, four general-purpose auxiliary LDOs are available to provide power to other devices in the system, and two LDOs are provided to power DDR memory supplies in applications requiring these memories.

In addition to the power resources, the device contains an embedded power controller (EPC) to manage the power sequencing requirements of the OMAP systems and an RTC.
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Technical documentation

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Type Title Date
* Data sheet TPS65910x Integrated Power-Management Unit Top Specification datasheet (Rev. U) PDF | HTML 19 Jun 2014
* Errata TPS65910 Silicon Errata (Rev. A) 27 Jan 2014
Application note How to Design Flexible Processor Power Systems Using PMICs (Rev. B) 27 Jan 2020
Application note AM335x PMIC Selection Guide (Rev. A) 19 Sep 2019
User guide TPS65910Ax User's Guide for AM335x Processors (Rev. F) 08 Dec 2017
Technical article Five simple steps to power an SoC with a PMIC PDF | HTML 03 Aug 2016
User guide TPS65910 User Guide for AM3517/AM3505 Processor (Rev. B) 24 Oct 2015
User guide TPS65910 User Guide for OMAPL137, OMAPL138, and C674x (Rev. B) 24 Oct 2015
User guide TPS659109 User Guide for i.MX51 and i.MX37 Processor (Rev. A) 24 Oct 2015
User guide TPS659101 User Guide for S5PV210, S5PC110 (Rev. B) 03 Oct 2015
User guide TPS659104 User Guide for S5P6440x (Rev. B) 03 Oct 2015
Application note Basic Calculation of a Buck Converter's Power Stage (Rev. B) 17 Aug 2015
Application note TPS65910x Power Sequencing Configurations 14 Jul 2015
White paper Advantages of PMIC converters with enhanced hysteretic-mode control 30 Mar 2015
User guide TPS659102 User's Guide 31 May 2013
EVM User's guide TPS65910 EVM User's Guide (Rev. F) 12 Apr 2013
Application note TPS65910x Schematic Checklist (Rev. B) 11 Oct 2012
User guide TPS659106 User's Guide for i.MX53 Processor (Rev. A) 07 Jun 2012
User guide TPS659108 User Guide for i.MX508 Freescale 09 Aug 2011
Application note TPS65910 User Guide for OMAP3 Family of Processors (Rev. A) 08 Jul 2011
User guide TPS659103 User Guide for S5PC100 18 Oct 2010
User guide TPS659105 User Guide for DaVinci Family Processors 06 Jul 2010

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