SLVSE83B December   2020  – September 2023 TPS6593-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1.     5
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
    1. 6.1 Digital Signal Descriptions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  General Purpose Low Drop-Out Regulators (LDO1, LDO2, LDO3)
    6. 7.6  Low Noise Low Drop-Out Regulator (LDO4)
    7. 7.7  Internal Low Drop-Out Regulators (LDOVRTC, LDOVINT)
    8. 7.8  BUCK1, BUCK2, BUCK3, BUCK4 and BUCK5 Regulators
    9. 7.9  Reference Generator (BandGap)
    10. 7.10 Monitoring Functions
    11. 7.11 Clocks, Oscillators, and PLL
    12. 7.12 Thermal Monitoring and Shutdown
    13. 7.13 System Control Thresholds
    14. 7.14 Current Consumption
    15. 7.15 Backup Battery Charger
    16. 7.16 Digital Input Signal Parameters
    17. 7.17 Digital Output Signal Parameters
    18. 7.18 I/O Pullup and Pulldown Resistance
    19. 7.19 I2C Interface
    20. 7.20 Serial Peripheral Interface (SPI)
    21. 7.21 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  System Supply Voltage Monitor
      2. 8.3.2  Power Resources (Bucks and LDOs)
        1. 8.3.2.1 Buck Regulators
          1. 8.3.2.1.1  BUCK Regulator Overview
          2. 8.3.2.1.2  Multi-Phase Operation and Phase-Adding or Shedding
          3. 8.3.2.1.3  Transition Between PWM and PFM Modes
          4. 8.3.2.1.4  Multi-Phase BUCK Regulator Configurations
          5. 8.3.2.1.5  Spread-Spectrum Mode
          6. 8.3.2.1.6  Adaptive Voltage Scaling (AVS) and Dynamic Voltage Scaling (DVS) Support
          7. 8.3.2.1.7  BUCK Output Voltage Setting
          8. 8.3.2.1.8  BUCK Regulator Current Limit
          9. 8.3.2.1.9  SW_Bx Short-to-Ground Detection
          10. 8.3.2.1.10 Sync Clock Functionality
          11.        49
        2. 8.3.2.2 Low Dropout Regulators (LDOs)
          1. 8.3.2.2.1 LDOVINT
          2. 8.3.2.2.2 LDOVRTC
          3. 8.3.2.2.3 LDO1, LDO2, and LDO3
          4. 8.3.2.2.4 Low-Noise LDO (LDO4)
      3. 8.3.3  Output Voltage Monitor and PGOOD Generation
      4. 8.3.4  Thermal Monitoring
        1. 8.3.4.1 Thermal Warning Function
        2. 8.3.4.2 Thermal Shutdown
      5. 8.3.5  Backup Supply Power-Path
      6. 8.3.6  General-Purpose I/Os (GPIO Pins)
      7. 8.3.7  nINT, EN_DRV, and nRSTOUT Pins
      8. 8.3.8  Interrupts
      9. 8.3.9  RTC
        1. 8.3.9.1 General Description
        2. 8.3.9.2 Time Calendar Registers
          1. 8.3.9.2.1 TC Registers Read Access
          2. 8.3.9.2.2 TC Registers Write Access
        3. 8.3.9.3 RTC Alarm
        4. 8.3.9.4 RTC Interrupts
        5. 8.3.9.5 RTC 32-kHz Oscillator Drift Compensation
      10. 8.3.10 Watchdog (WDOG)
        1. 8.3.10.1 Watchdog Fail Counter and Status
        2. 8.3.10.2 Watchdog Start-Up and Configuration
        3. 8.3.10.3 MCU to Watchdog Synchronization
        4. 8.3.10.4 Watchdog Disable Function
        5. 8.3.10.5 Watchdog Sequence
        6. 8.3.10.6 Watchdog Trigger Mode
        7. 8.3.10.7 WatchDog Flow Chart and Timing Diagrams in Trigger Mode
        8.       79
        9. 8.3.10.8 Watchdog Question-Answer Mode
          1. 8.3.10.8.1 Watchdog Q&A Related Definitions
          2. 8.3.10.8.2 Question Generation
          3. 8.3.10.8.3 Answer Comparison
            1. 8.3.10.8.3.1 Sequence of the 2-bit Watchdog Answer Counter
            2. 8.3.10.8.3.2 Watchdog Sequence Events and Status Updates
            3. 8.3.10.8.3.3 Watchdog Q&A Sequence Scenarios
      11. 8.3.11 Error Signal Monitor (ESM)
        1. 8.3.11.1 ESM Error-Handling Procedure
          1. 8.3.11.1.1 Level Mode
          2.        90
          3. 8.3.11.1.2 PWM Mode
            1. 8.3.11.1.2.1 Good-Events and Bad-Events
            2. 8.3.11.1.2.2 ESM Error-Counter
            3. 8.3.11.1.2.3 ESM Start-Up in PWM Mode
            4. 8.3.11.1.2.4 ESM Flow Chart and Timing Diagrams in PWM Mode
            5.         96
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device State Machine
        1. 8.4.1.1 Fixed Device Power FSM
          1. 8.4.1.1.1 Register Resets and NVM Read at INIT State
        2. 8.4.1.2 Pre-Configurable Mission States
          1. 8.4.1.2.1 PFSM Commands
            1. 8.4.1.2.1.1  REG_WRITE_IMM Command
            2. 8.4.1.2.1.2  REG_WRITE_MASK_IMM Command
            3. 8.4.1.2.1.3  REG_WRITE_MASK_PAGE0_IMM Command
            4. 8.4.1.2.1.4  REG_WRITE_BIT_PAGE0_IMM Command
            5. 8.4.1.2.1.5  REG_WRITE_WIN_PAGE0_IMM Command
            6. 8.4.1.2.1.6  REG_WRITE_VOUT_IMM Command
            7. 8.4.1.2.1.7  REG_WRITE_VCTRL_IMM Command
            8. 8.4.1.2.1.8  REG_WRITE_MASK_SREG Command
            9. 8.4.1.2.1.9  SREG_READ_REG Command
            10. 8.4.1.2.1.10 SREG_WRITE_IMM Command
            11. 8.4.1.2.1.11 WAIT Command
            12. 8.4.1.2.1.12 DELAY_IMM Command
            13. 8.4.1.2.1.13 DELAY_SREG Command
            14. 8.4.1.2.1.14 TRIG_SET Command
            15. 8.4.1.2.1.15 TRIG_MASK Command
            16. 8.4.1.2.1.16 END Command
          2. 8.4.1.2.2 Configuration Memory Organization and Sequence Execution
          3. 8.4.1.2.3 Mission State Configuration
          4. 8.4.1.2.4 Pre-Configured Hardware Transitions
            1. 8.4.1.2.4.1 ON Requests
            2. 8.4.1.2.4.2 OFF Requests
            3. 8.4.1.2.4.3 NSLEEP1 and NSLEEP2 Functions
            4. 8.4.1.2.4.4 WKUP1 and WKUP2 Functions
            5. 8.4.1.2.4.5 LP_WKUP Pins for Waking Up from LP STANDBY
        3. 8.4.1.3 Error Handling Operations
          1. 8.4.1.3.1 Power Rail Output Error
          2. 8.4.1.3.2 Catastrophic Error
          3. 8.4.1.3.3 Watchdog (WDOG) Error
          4. 8.4.1.3.4 Warnings
        4. 8.4.1.4 Device Start-up Timing
        5. 8.4.1.5 Power Sequences
        6. 8.4.1.6 First Supply Detection
        7. 8.4.1.7 Register Power Domains and Reset Levels
      2. 8.4.2 Multi-PMIC Synchronization
        1. 8.4.2.1 SPMI Interface System Setup
        2. 8.4.2.2 Transmission Protocol and CRC
          1. 8.4.2.2.1 Operation with Transmission Errors
          2. 8.4.2.2.2 Transmitted Information
        3. 8.4.2.3 SPMI Target Device Communication to SPMI Controller Device
          1. 8.4.2.3.1 Incomplete Communication from SPMI Target Device to SPMI Controller Device
        4. 8.4.2.4 SPMI-BIST Overview
          1. 8.4.2.4.1 SPMI Bus during Boot BIST and RUNTIME BIST
          2. 8.4.2.4.2 Periodic Checking of the SPMI
          3. 8.4.2.4.3 SPMI Message Priorities
    5. 8.5 Control Interfaces
      1. 8.5.1 CRC Calculation for I2C and SPI Interface Protocols
      2. 8.5.2 I2C-Compatible Interface
        1. 8.5.2.1 Data Validity
        2. 8.5.2.2 Start and Stop Conditions
        3. 8.5.2.3 Transferring Data
        4. 8.5.2.4 Auto-Increment Feature
      3. 8.5.3 Serial Peripheral Interface (SPI)
    6. 8.6 Configurable Registers
      1. 8.6.1 Register Page Partitioning
      2. 8.6.2 CRC Protection for Configuration, Control, and Test Registers
      3. 8.6.3 CRC Protection for User Registers
      4. 8.6.4 Register Write Protection
        1. 8.6.4.1 Watchdog and ESM Configuration Registers
        2. 8.6.4.2 User Registers
    7. 8.7 Register Maps
      1. 8.7.1 TPS6593-Q1 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Powering a Processor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 VCCA
          2. 9.2.1.2.2 Internal LDOs
          3. 9.2.1.2.3 Crystal Oscillator
          4. 9.2.1.2.4 Buck Input Capacitors
          5. 9.2.1.2.5 Buck Output Capacitors
          6. 9.2.1.2.6 Buck Inductors
          7. 9.2.1.2.7 LDO Input Capacitors
          8. 9.2.1.2.8 LDO Output Capacitors
          9. 9.2.1.2.9 Digital Signal Connections
      2. 9.2.2 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Device Nomenclature
    3. 10.3 Documentation Support
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device operates from 3 V to 5.5 V input supply
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature range
    • Device HBM classification level 2
    • Device CDM classification level C4A
  • Functional Safety-Compliant
    • Developed for functional safety applications
    • Documentation to aid ISO26262 and IEC61508 system design available upon product release
    • Systematic capability up to ASIL-D and SIL-3
    • Hardware integrity up to ASIL-B and SIL-2
    • Input supply voltage monitor
    • Under/overvoltage monitors and over-current monitors on all output supply rails
    • Watchdog with selectable trigger / Q&A mode
    • Two error signal monitors (ESMs) with selectable level / PWM mode
    • Thermal monitoring with high temperature warning and thermal shutdown
    • Bit-integrity (CRC) error detection on internal configuration registers and non-volatile memory (NVM)
  • Low-power consumption
    • 2 μA typical shutdown current
    • 7 μA typical in back up supply only mode
    • 20 μA typical in low power standby mode
  • Five step-down switched-mode power supply (BUCK) regulators:
    • 0.3 V to 3.34 V output voltage range in 5, 10, or 20-mV steps
    • One with 4 A, three with 3.5 A, and one with 2 A output current capability
    • Flexible multi-phase capability for four BUCKs: up to 14 A output current from a single rail
    • Short-circuit and over-current protection
    • Internal soft-start for in-rush current limitation
    • 2.2 MHz / 4.4 MHz switching frequency
    • Ability to synchronize to external clock input
  • Three low-dropout (LDO) linear regulators with configurable bypass mode
    • 0.6 V to 3.3 V output voltage range with 50-mV steps in linear regulation mode
    • 1.7 V to 3.3 V output voltage range in bypass mode
    • 500 mA output current capability with short-circuit and over-current protection
  • One low-dropout (LDO) linear regulator with low-noise performance
    • 1.2 V to 3.3 V output voltage range in 25-mV steps
    • 300 mA output current capability with short-circuit and over-current protection
  • Configurable power sequence control in non-volatile memory (NVM):
    • Configurable power-up and power-down sequences between power states
    • Digital output signals can be included in the power sequences
    • Digital input signals can be used to trigger power sequence transitions
    • Configurable handling of safety-relevant errors
  • 32-kHz crystal oscillator with option to output a buffered 32-kHz clock output
  • Real-time clock (RTC) with alarm and periodic wake-up mechanism
  • One SPI or two I2C control interfaces, with second I2C interface dedicated for Q&A watchdog communication
  • Package option:
    • 8-mm × 8-mm 56-pin VQFNP with 0.5-mm pitch