SLVSE83B December   2020  – September 2023 TPS6593-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
    1.     5
  5. Revision History
  6. Description (continued)
  7. Pin Configuration and Functions
    1. 6.1 Digital Signal Descriptions
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  General Purpose Low Drop-Out Regulators (LDO1, LDO2, LDO3)
    6. 7.6  Low Noise Low Drop-Out Regulator (LDO4)
    7. 7.7  Internal Low Drop-Out Regulators (LDOVRTC, LDOVINT)
    8. 7.8  BUCK1, BUCK2, BUCK3, BUCK4 and BUCK5 Regulators
    9. 7.9  Reference Generator (BandGap)
    10. 7.10 Monitoring Functions
    11. 7.11 Clocks, Oscillators, and PLL
    12. 7.12 Thermal Monitoring and Shutdown
    13. 7.13 System Control Thresholds
    14. 7.14 Current Consumption
    15. 7.15 Backup Battery Charger
    16. 7.16 Digital Input Signal Parameters
    17. 7.17 Digital Output Signal Parameters
    18. 7.18 I/O Pullup and Pulldown Resistance
    19. 7.19 I2C Interface
    20. 7.20 Serial Peripheral Interface (SPI)
    21. 7.21 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  System Supply Voltage Monitor
      2. 8.3.2  Power Resources (Bucks and LDOs)
        1. 8.3.2.1 Buck Regulators
          1. 8.3.2.1.1  BUCK Regulator Overview
          2. 8.3.2.1.2  Multi-Phase Operation and Phase-Adding or Shedding
          3. 8.3.2.1.3  Transition Between PWM and PFM Modes
          4. 8.3.2.1.4  Multi-Phase BUCK Regulator Configurations
          5. 8.3.2.1.5  Spread-Spectrum Mode
          6. 8.3.2.1.6  Adaptive Voltage Scaling (AVS) and Dynamic Voltage Scaling (DVS) Support
          7. 8.3.2.1.7  BUCK Output Voltage Setting
          8. 8.3.2.1.8  BUCK Regulator Current Limit
          9. 8.3.2.1.9  SW_Bx Short-to-Ground Detection
          10. 8.3.2.1.10 Sync Clock Functionality
          11.        49
        2. 8.3.2.2 Low Dropout Regulators (LDOs)
          1. 8.3.2.2.1 LDOVINT
          2. 8.3.2.2.2 LDOVRTC
          3. 8.3.2.2.3 LDO1, LDO2, and LDO3
          4. 8.3.2.2.4 Low-Noise LDO (LDO4)
      3. 8.3.3  Output Voltage Monitor and PGOOD Generation
      4. 8.3.4  Thermal Monitoring
        1. 8.3.4.1 Thermal Warning Function
        2. 8.3.4.2 Thermal Shutdown
      5. 8.3.5  Backup Supply Power-Path
      6. 8.3.6  General-Purpose I/Os (GPIO Pins)
      7. 8.3.7  nINT, EN_DRV, and nRSTOUT Pins
      8. 8.3.8  Interrupts
      9. 8.3.9  RTC
        1. 8.3.9.1 General Description
        2. 8.3.9.2 Time Calendar Registers
          1. 8.3.9.2.1 TC Registers Read Access
          2. 8.3.9.2.2 TC Registers Write Access
        3. 8.3.9.3 RTC Alarm
        4. 8.3.9.4 RTC Interrupts
        5. 8.3.9.5 RTC 32-kHz Oscillator Drift Compensation
      10. 8.3.10 Watchdog (WDOG)
        1. 8.3.10.1 Watchdog Fail Counter and Status
        2. 8.3.10.2 Watchdog Start-Up and Configuration
        3. 8.3.10.3 MCU to Watchdog Synchronization
        4. 8.3.10.4 Watchdog Disable Function
        5. 8.3.10.5 Watchdog Sequence
        6. 8.3.10.6 Watchdog Trigger Mode
        7. 8.3.10.7 WatchDog Flow Chart and Timing Diagrams in Trigger Mode
        8.       79
        9. 8.3.10.8 Watchdog Question-Answer Mode
          1. 8.3.10.8.1 Watchdog Q&A Related Definitions
          2. 8.3.10.8.2 Question Generation
          3. 8.3.10.8.3 Answer Comparison
            1. 8.3.10.8.3.1 Sequence of the 2-bit Watchdog Answer Counter
            2. 8.3.10.8.3.2 Watchdog Sequence Events and Status Updates
            3. 8.3.10.8.3.3 Watchdog Q&A Sequence Scenarios
      11. 8.3.11 Error Signal Monitor (ESM)
        1. 8.3.11.1 ESM Error-Handling Procedure
          1. 8.3.11.1.1 Level Mode
          2.        90
          3. 8.3.11.1.2 PWM Mode
            1. 8.3.11.1.2.1 Good-Events and Bad-Events
            2. 8.3.11.1.2.2 ESM Error-Counter
            3. 8.3.11.1.2.3 ESM Start-Up in PWM Mode
            4. 8.3.11.1.2.4 ESM Flow Chart and Timing Diagrams in PWM Mode
            5.         96
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device State Machine
        1. 8.4.1.1 Fixed Device Power FSM
          1. 8.4.1.1.1 Register Resets and NVM Read at INIT State
        2. 8.4.1.2 Pre-Configurable Mission States
          1. 8.4.1.2.1 PFSM Commands
            1. 8.4.1.2.1.1  REG_WRITE_IMM Command
            2. 8.4.1.2.1.2  REG_WRITE_MASK_IMM Command
            3. 8.4.1.2.1.3  REG_WRITE_MASK_PAGE0_IMM Command
            4. 8.4.1.2.1.4  REG_WRITE_BIT_PAGE0_IMM Command
            5. 8.4.1.2.1.5  REG_WRITE_WIN_PAGE0_IMM Command
            6. 8.4.1.2.1.6  REG_WRITE_VOUT_IMM Command
            7. 8.4.1.2.1.7  REG_WRITE_VCTRL_IMM Command
            8. 8.4.1.2.1.8  REG_WRITE_MASK_SREG Command
            9. 8.4.1.2.1.9  SREG_READ_REG Command
            10. 8.4.1.2.1.10 SREG_WRITE_IMM Command
            11. 8.4.1.2.1.11 WAIT Command
            12. 8.4.1.2.1.12 DELAY_IMM Command
            13. 8.4.1.2.1.13 DELAY_SREG Command
            14. 8.4.1.2.1.14 TRIG_SET Command
            15. 8.4.1.2.1.15 TRIG_MASK Command
            16. 8.4.1.2.1.16 END Command
          2. 8.4.1.2.2 Configuration Memory Organization and Sequence Execution
          3. 8.4.1.2.3 Mission State Configuration
          4. 8.4.1.2.4 Pre-Configured Hardware Transitions
            1. 8.4.1.2.4.1 ON Requests
            2. 8.4.1.2.4.2 OFF Requests
            3. 8.4.1.2.4.3 NSLEEP1 and NSLEEP2 Functions
            4. 8.4.1.2.4.4 WKUP1 and WKUP2 Functions
            5. 8.4.1.2.4.5 LP_WKUP Pins for Waking Up from LP STANDBY
        3. 8.4.1.3 Error Handling Operations
          1. 8.4.1.3.1 Power Rail Output Error
          2. 8.4.1.3.2 Catastrophic Error
          3. 8.4.1.3.3 Watchdog (WDOG) Error
          4. 8.4.1.3.4 Warnings
        4. 8.4.1.4 Device Start-up Timing
        5. 8.4.1.5 Power Sequences
        6. 8.4.1.6 First Supply Detection
        7. 8.4.1.7 Register Power Domains and Reset Levels
      2. 8.4.2 Multi-PMIC Synchronization
        1. 8.4.2.1 SPMI Interface System Setup
        2. 8.4.2.2 Transmission Protocol and CRC
          1. 8.4.2.2.1 Operation with Transmission Errors
          2. 8.4.2.2.2 Transmitted Information
        3. 8.4.2.3 SPMI Target Device Communication to SPMI Controller Device
          1. 8.4.2.3.1 Incomplete Communication from SPMI Target Device to SPMI Controller Device
        4. 8.4.2.4 SPMI-BIST Overview
          1. 8.4.2.4.1 SPMI Bus during Boot BIST and RUNTIME BIST
          2. 8.4.2.4.2 Periodic Checking of the SPMI
          3. 8.4.2.4.3 SPMI Message Priorities
    5. 8.5 Control Interfaces
      1. 8.5.1 CRC Calculation for I2C and SPI Interface Protocols
      2. 8.5.2 I2C-Compatible Interface
        1. 8.5.2.1 Data Validity
        2. 8.5.2.2 Start and Stop Conditions
        3. 8.5.2.3 Transferring Data
        4. 8.5.2.4 Auto-Increment Feature
      3. 8.5.3 Serial Peripheral Interface (SPI)
    6. 8.6 Configurable Registers
      1. 8.6.1 Register Page Partitioning
      2. 8.6.2 CRC Protection for Configuration, Control, and Test Registers
      3. 8.6.3 CRC Protection for User Registers
      4. 8.6.4 Register Write Protection
        1. 8.6.4.1 Watchdog and ESM Configuration Registers
        2. 8.6.4.2 User Registers
    7. 8.7 Register Maps
      1. 8.7.1 TPS6593-Q1 Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Powering a Processor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 VCCA
          2. 9.2.1.2.2 Internal LDOs
          3. 9.2.1.2.3 Crystal Oscillator
          4. 9.2.1.2.4 Buck Input Capacitors
          5. 9.2.1.2.5 Buck Output Capacitors
          6. 9.2.1.2.6 Buck Inductors
          7. 9.2.1.2.7 LDO Input Capacitors
          8. 9.2.1.2.8 LDO Output Capacitors
          9. 9.2.1.2.9 Digital Signal Connections
      2. 9.2.2 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Device Nomenclature
    3. 10.3 Documentation Support
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
Power Rail Output Error

A power rail output error occurs when an error condition is detected on the output rails of the device that are used to power the attached MCU or SoC. These errors include the following:

  • Rails not reaching or maintaining within the power good voltage level threshold.
  • A short condition that is detected at a regulator output.
  • The load current that exceeds the forward current limit.

The BUCKx_GRP_SEL, LDOn_GRP_SEL and VCCA_GRP_SEL registers are used to configure the rail group for all of the Bucks, LDOs, and the voltage monitors that are available for external rails. The selectable rail groups are MCU rail group, SoC rail group, or OTHER rail group. The TPS6593-Q1 device is designed to react differently when an error is detected from a power resource assigned to the different rail groups.

Figure 8-37 shows how the SOC_RAIL_TRIG[1:0], MCU_RAIL_TRIG[1:0], and OTHER_RAIL_TRIG[1:0] register bits are used as the Immediate Shutdown Trigger Mask, Orderly Shutdown Trigger Mask, MCU Power Error Trigger Mask, or the SoC Power Error Trigger Mask. The settings of these register bits determine the error handling sequence that the assigned groups of rails perform in case of an output error. The PFSM engine can be configured to execute the appropriate error handling sequence for the following error handling sequence options: immediate shutdown, orderly shutdown, MCU power error, or SOC power error. For example, if an immediate shutdown sequence is assigned to the MCU rail group through the MCU_RAIL_TRIG[1:0] register bits, any failure detected in this group of rails causes the IMMEDIATE_SHUTDOWN trigger to be executed. This trigger is expected to start the immediate shutdown sequence and cause the device to enter the SAFE RECOVERY state. The device immediately resets the attached MCU and SoC by driving the nRSTOUT and nRSTOUT_SoC (GPO1 or GPIO11) pins low. All of the power resources assigned to the MCU and SOC shut down immediately without a sequencing order. The nINT pin signals that an MCU_PWR_ERR_INT interrupt event has occurred and the EN_DRV pin is forced low. If the error is recoverable within the recovery time interval, the device increments the recovery count, returns to INIT state, and reattempts the power up sequence (if the recovery count has not exceeded the counter threshold). If the recovery count has already exceeded the threshold, the device stays in the SAFE RECOVERY state until VCCA voltage is below the VCCA_UVLO threshold and the device is power-cycled.

The power resources assigned to the SoC rail group are typically assigned to the SOC power error handling sequence. In this PFSM example depicted in Figure 8-39, when a power resource in this group is detected, the PFSM typically causes the device to execute the shutdown of all the resources assigned to the SoC rail group, and the device enters the MCU ONLY state. The device immediately resets the attached SoC by toggling the nRSTOUT_SoC (GPO1 or GPIO11) pin. The reset output to the MCU and the resources assigned to the MCU rail group remain unchanged. The EN_DRV pin also remains unchanged, and the nINT pin signals that an SOC_PWR_ERR_INT interrupt event has occurred. To recover from the MCU_ONLY state after a SOC power error, the MCU software must set NSLEEP1 signal to '0' while NSLEEP2 signal remains '1'. This action signals TPS6593-Q1 that MCU has acknowledged the SOC power error, and is ready to return to normal operation. MCU can then set the NSLEEP1 signal back to '1' for the device to return to ACTIVE state and reattempt the SoC power up. Refer to Section 8.4.1.2.4.3 for information regarding the setting of the NSLEEP1 and NSLEEP2 signals.

The power resources used for peripheral devices in the system, for which no error-handling action is required, the rail mapping needs to be selected as "no group assigned".