SWCS037I May   2008  – January 2015 TPS65920 , TPS65930

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Attributes
    3. 3.3 Signal Descriptions
  4. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Characteristics for ZCH Package
    5. 4.5 Minimum Voltages and Associated Currents
    6. 4.6 Digital I/O Electrical Characteristics
    7. 4.7 Timing Requirements and Switching Characteristics
      1. 4.7.1 Timing Parameters
      2. 4.7.2 Target Frequencies
      3. 4.7.3 I2C Timing
      4. 4.7.4 Audio Interface: TDM/I2S Protocol
        1. 4.7.4.1 I2S Right- and Left-Justified Data Format
        2. 4.7.4.2 TDM Data Format
      5. 4.7.5 JTAG Interfaces
  5. 5Detailed Description
    1. 5.1 Power Module
      1. 5.1.1 Power Providers
        1. 5.1.1.1  VDD1 DC-DC Regulator
          1. 5.1.1.1.1 VDD1 DC-DC Regulator Characteristics
          2. 5.1.1.1.2 External Components and Application Schematics
        2. 5.1.1.2  VDD2 DC-DC Regulator
          1. 5.1.1.2.1 VDD2 DC-DC Regulator Characteristics
          2. 5.1.1.2.2 External Components and Application Schematics
        3. 5.1.1.3  VIO DC-DC Regulator
          1. 5.1.1.3.1 VIO DC-DC Regulator Characteristics
          2. 5.1.1.3.2 External Components and Application Schematics
        4. 5.1.1.4  VDAC LDO Regulator
        5. 5.1.1.5  VPLL1 LDO Regulator
        6. 5.1.1.6  VMMC1 LDO Regulator
        7. 5.1.1.7  VAUX2 LDO Regulator
        8. 5.1.1.8  Output Load Conditions
        9. 5.1.1.9  Charge Pump
        10. 5.1.1.10 USB LDO Short-Circuit Protection Scheme
      2. 5.1.2 Power References
      3. 5.1.3 Power Control
        1. 5.1.3.1 Backup Battery Charger
        2. 5.1.3.2 Battery Monitoring and Threshold Detection
          1. 5.1.3.2.1 Power On/Power Off and Backup Conditions
        3. 5.1.3.3 VRRTC LDO Regulator
      4. 5.1.4 Power Consumption
      5. 5.1.5 Power Management
        1. 5.1.5.1 Boot Modes
        2. 5.1.5.2 Process Modes
          1. 5.1.5.2.1 MC021 Mode
        3. 5.1.5.3 Power-On Sequence
          1. 5.1.5.3.1 Timing Before Sequence_Start
          2. 5.1.5.3.2 Power-On Sequence
          3. 5.1.5.3.3 Power On in Slave_C021 Mode
        4. 5.1.5.4 Power-Off Sequence
          1. 5.1.5.4.1 Power-Off Sequence
    2. 5.2 Real-Time Clock and Embedded Power Controller
      1. 5.2.1 RTC
        1. 5.2.1.1 Backup Battery
      2. 5.2.2 EPC
    3. 5.3 USB Transceiver
      1. 5.3.1 Features
      2. 5.3.2 HS USB Port Timing
      3. 5.3.3 USB-CEA Carkit Port Timing
      4. 5.3.4 PHY Electrical Characteristics
        1. 5.3.4.1 HS Differential Receiver
        2. 5.3.4.2 HS Differential Transmitter
        3. 5.3.4.3 CEA/UART Driver
        4. 5.3.4.4 Pullup/Pulldown Resistors
      5. 5.3.5 OTG Electrical Characteristics
        1. 5.3.5.1 OTG VBUS Electrical Characteristics
        2. 5.3.5.2 OTG ID Electrical Characteristics
    4. 5.4 MADC
      1. 5.4.1 General Description
      2. 5.4.2 MADC Electrical Characteristics
      3. 5.4.3 Channel Voltage Input Range
        1. 5.4.3.1 Sequence Conversion Time (Real-Time or Nonaborted Asynchronous)
    5. 5.5 LED Drivers
      1. 5.5.1 General Description
    6. 5.6 Keyboard
      1. 5.6.1 Keyboard Connection
    7. 5.7 Clock Specifications
      1. 5.7.1 Clock Features
      2. 5.7.2 Input Clock Specifications
        1. 5.7.2.1 Clock Source Requirements
        2. 5.7.2.2 HFCLKIN
        3. 5.7.2.3 32-kHz Input Clock
          1. 5.7.2.3.1 External Crystal Description
          2. 5.7.2.3.2 External Clock Description
      3. 5.7.3 Output Clock Specifications
        1. 5.7.3.1 32KCLKOUT Output Clock
        2. 5.7.3.2 HFCLKOUT Output Clock
        3. 5.7.3.3 Output Clock Stabilization Time
    8. 5.8 Debouncing Time
    9. 5.9 External Components
  6. 6Audio/Voice Module (TPS65930 Device Only)
    1. 6.1 Audio/Voice Downlink (RX) Module
      1. 6.1.1 Predriver for External Class-D Amplifier
        1. 6.1.1.1 Predriver Output Characteristics
        2. 6.1.1.2 External Components and Application Schematics
      2. 6.1.2 Vibrator H-Bridge
        1. 6.1.2.1 Vibrator H-Bridge Output Characteristics
        2. 6.1.2.2 External Components and Application Schematics
      3. 6.1.3 Carkit Output
      4. 6.1.4 Digital Audio Filter Module
      5. 6.1.5 Boost Stage
    2. 6.2 Audio Uplink (TX) Module
      1. 6.2.1 Microphone Bias Module
        1. 6.2.1.1 Analog Microphone Bias Module Characteristics
        2. 6.2.1.2 Silicon Microphone Module Characteristics
      2. 6.2.2 FM Radio/Auxiliary Input
        1. 6.2.2.1 External Components
      3. 6.2.3 Uplink Characteristics
      4. 6.2.4 Microphone Amplification Stage
      5. 6.2.5 Carkit Input
      6. 6.2.6 Digital Audio Filter Module
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
      2. 7.1.2 Device Nomenclature
    2. 7.2 Community Resources
    3. 7.3 Related Links
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Export Control Notice
    7. 7.7 Glossary
    8. 7.8 Additional Acronyms
  8. 8Mechanical, Packaging, and Orderable Information
    1. 8.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products

Applications

TI E2E Community : e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright© 2014, Texas Instruments Incorporated