SLVSER3A November   2018  – April 2020 TPS65982BB

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Characteristics
    6. 6.6  Power Supervisor Characteristics
    7. 6.7  Power Consumption Characteristics
    8. 6.8  Port-Power Switch Characteristics
    9. 6.9  Port-Data Multiplexer Characteristics
    10. 6.10 Port-Data Multiplexer Clamp Characteristics
    11. 6.11 Port-Data Multiplexer Signal Monitoring Pullup and Pulldown Characteristics
    12. 6.12 USB Endpoint Characteristics
    13. 6.13 Input/Output (I/O) Characteristics
    14. 6.14 I2C Slave Characteristics
    15. 6.15 Thermal Shutdown Characteristics
    16. 6.16 Oscillator Characteristics
    17. 6.17 SPI Master Switching Characteristics
    18. 6.18 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Port-Power Switches
        1. 8.3.1.1 5-V Power Delivery
        2. 8.3.1.2 5-V Power Switch
        3. 8.3.1.3 PP_5V0 Current Limit
        4. 8.3.1.4 VBUS Transition to VSAFE0V
      2. 8.3.2  USB Port-Data Multiplexer
        1. 8.3.2.1 Port Multiplexer Clamp
        2. 8.3.2.2 USB2.0 Low-Speed Endpoint
      3. 8.3.3  Power Management
        1. 8.3.3.1 Power-On and Supervisory Functions
      4. 8.3.4  Digital Core
      5. 8.3.5  Power Reset-Control Module (PRCM)
      6. 8.3.6  Interrupt Monitor
      7. 8.3.7  I2C Slave
      8. 8.3.8  SPI Master
      9. 8.3.9  Thermal Shutdown
      10. 8.3.10 Oscillators
    4. 8.4 Device Functional Modes
      1. 8.4.1 SPI Master Interface
      2. 8.4.2 I2C Slave Interface
        1. 8.4.2.1 I2C Interface Description
        2. 8.4.2.2 I2C Clock Stretching
        3. 8.4.2.3 I2C Address Setting
        4. 8.4.2.4 Unique-Address Interface
        5. 8.4.2.5 I2C Pin Address Setting
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 VBUS Load Switch
      2. 9.2.2 HRESET
      3. 9.2.3 Dual Port Billboard Support
  10. 10Power Supply Recommendations
    1. 10.1 3.3-V Power
      1. 10.1.1 1VIN_3V3 Input Switch
      2. 10.1.2 VOUT_3V3 Output Switch
    2. 10.2 1.8-V Core Power
      1. 10.2.1 1.8-V Digital LDO
      2. 10.2.2 1.8-V Analog LDO
    3. 10.3 VDDIO
      1. 10.3.1 Recommended Supply Load Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Component Placement
      2. 11.2.2 Recommended Via Size and Trace Widths
      3. 11.2.3 USB2 Routing
      4. 11.2.4 Oval Pad for BGA Fanout
      5. 11.2.5 Top and Bottom Layer Complete Routing
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.14 I2C Slave Characteristics

Recommended operating conditions; TA = –10 to +85°C unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SDA and SCL COMMON CHARACTERISTICS
ILEAK Input leakage current Voltage on pin = LDO_3V3 -3 3 μA
VOL SDA output low voltage IOL = 3 mA, LDO_3V3 = 3.3 V 0.4 V
IOL = 3 mA, VDDIO = 1.8 V 0.36
IOL SDA maximum output-low current VOL = 0.4 V 3 mA
VOL = 0.6 V 6
VIL Input low signal LDO_3V3 = 3.3 V 0.99 V
VDDIO = 1.8 V 0.54
VIH Input high signal LDO_3V3 = 3.3 V 2.31 V
VDDIO = 1.8 V 1.26
VHYS Input hysteresis LDO_3V3 = 3.3 V 0.17 V
VDDIO = 1.8 V 0.09
TSP I2C pulse width suppressed 50 ns
CI Pin Capacitance 10 pF
SDA and SCL STANDARD MODE CHARACTERISTICS
FSCL I2C clock frequency 0 100 kHz
THIGH I2C clock high time 4 μs
TLOW I2C clock low time 4.7 μs
TSUDAT I2C serial data-setup time 250 ns
THDDAT I2C serial data-hold time 0 ns
TVDDAT I2C valid data time SCL low to SDA output valid 3.4 μs
TVDACK I2C valid data time of ACK condition ACK signal from SCL low to SDA (out) low 3.4 μs
TOCF I2C output fall time 10 pF to 400 pF bus 250 ns
TBUF I2C bus free time between stop and start 4.7 μs
TSTS I2C start or repeated start condition setup time 4.7 μs
TSTH I2C start or repeated start condition hold time 4 μs
TSPS I2C stop-condition setup time 4 μs
SDA and SCL FAST MODE CHARACTERISTICS
FSCL I2C clock frequency 0 400 kHz
THIGH I2C clock high time 0.6 μs
TLOW I2C clock low time 1.3 μs
TSUDAT I2C serial data-setup time 100 ns
THDDAT I2C serial data-hold time 0 ns
TVDDAT I2C valid data time SCL low to SDA output valid 0.9 μs
TVDACK I2C valid data time of ACK condition ACK signal from SCL low to SDA (out) low 0.9 μs
TOCF I2C output fall time 10 pF to 400 pF bus, VDD = 3.3 V 12 250 ns
10 pF to 400 pF bus, VDD = 1.8 V 6.5 250
TBUF I2C bus free time between stop and start 1.3 μs
TSTS I2C start or repeated start condition setup time 0.6 μs
TSTH I2C start or repeated start condition hold time 0.6 μs
TSPS I2C stop-condition setup time 0.6 μs