SBVS087M June   2008  – June 2018 TPS735

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application
  4. 4 Revision History
    1.     Pin Configuration and Functions
      1.      Pin Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Internal Current Limit
      2. 6.3.2 Shutdown
      3. 6.3.3 Dropout Voltage
      4. 6.3.4 Start-Up and Noise Reduction Capacitor
      5. 6.3.5 Transient Response
      6. 6.3.6 Undervoltage Lockout
      7. 6.3.7 Minimum Load
      8. 6.3.8 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Input and Output Capacitor Requirements
        2. 7.2.1.2 Feed-Forward Capacitor Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Output Noise
      3. 7.2.3 Application Curves
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
    2. 9.2 Layout Example
    3. 9.3 Power Dissipation
    4. 9.4 Estimating Junction Temperature
    5. 9.5 Package Mounting
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Evaluation Modules
      2. 10.1.2 Device Nomenclature
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

at –40°C ≤ TJ and TA ≤ +125°C (unless otherwise noted). All voltages are with respect to GND.(1)
MIN MAX UNIT
VIN Voltage –0.3 7 V
VEN –0.3 VIN + 0.3 V
VFB –0.3 1.6 V
VOUT –0.3 VIN + 0.3 V
IOUT Current Internally limited A
PD(tot) Continuous total power dissipation See Thermal Information
TJ Operating junction temperature –40 150 °C
Tstg Storage temperature –55 150 °C
(1) Stresses beyond those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated as Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.