SLVSAI3A September 2010 – May 2016
PRODUCTION DATA.
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | ±2000 | V |
Charged-device model (CDM), per AEC Q100-011 | ±500 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
VI | Unregulated input voltage | 1.7 | 5.5 | V |
VO | Output voltage | 0 | 5.5 | V |
IOUT | Output current | 0 | 500 | mA |
THERMAL METRIC(1) | TPS73601-Q1, TPS73625-Q1, TPS73633-Q1 | UNIT | |
---|---|---|---|
DBV (SOT-23) | |||
5 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 221.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 74.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 51.9 | °C/W |
ψJT | Junction-to-top characterization parameter | 2.8 | °C/W |
ψJB | Junction-to-board characterization parameter | 51.1 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
VIN | Input voltage(1)(2) | 1.7 | 5.5 | V | |||
VFB | Internal reference (TPS73601) | TJ = 25°C | 1.198 | 1.2 | 1.21 | V | |
VOUT | Output voltage (TPS73601)(3) | VFB | 5.5 – VDO | V | |||
Accuracy(1)(4) | Nominal | TJ = 25°C | –0.5% | 0.5% | |||
over VIN, IOUT, and T | VOUT + 0.5 V ≤ VIN ≤ 5.5 V; 10 mA ≤ IOUT ≤ 400 mA |
–1% | ±0.5% | 1% | |||
ΔVOUT%/ΔVIN | Line regulation(1) | VO(nom) + 0.5 V ≤ VIN ≤ 5.5 V | 0.01 | %/V | |||
ΔVOUT%/ΔIOUT | Load regulation | 1 mA ≤ IOUT ≤ 400 mA | 0.002 | %/mA | |||
10 mA ≤ IOUT ≤ 400 mA | 0.0005 | ||||||
VDO | Dropout voltage(5)
(VIN = VOUT(nom) – 0.1 V) |
IOUT = 400 mA | 75 | 200 | mV | ||
ZO(DO) | Output impedance in dropout | 1.7 V ≤ VIN ≤ VOUT + VDO | 0.25 | Ω | |||
ICL | Output current limit | VOUT = 0.9 × VOUT(nom) | 400 | 650 | 800 | mA | |
3.6 V ≤ VIN ≤ 4.2 V, 0°C ≤ TJ ≤ 70°C | 500 | 800 | mA | ||||
ISC | Short-circuit current | VOUT = 0 V | 450 | mA | |||
IREV | Reverse leakage current(6) (–IIN) | VEN ≤ 0.5 V, 0 V ≤ VIN ≤ VOUT | 0.1 | 10 | μA | ||
IGND | GND pin current | IOUT = 10 mA (IQ) | 400 | 550 | μA | ||
IOUT = 400 mA | 800 | 1000 | |||||
ISHDN | Shutdown current (IGND) | VEN ≤ 0.5 V, VOUT ≤ VIN ≤ 5.5, –40°C ≤ TJ ≤ 100°C |
0.02 | 1.3 | μA | ||
IFB | FB pin current (TPS73601) | 0.1 | 0.45 | μA | |||
PSRR | Power-supply rejection ratio (ripple rejection) | f = 100 Hz, IOUT = 400 mA | 58 | dB | |||
f = 10 KHz, IOUT = 400 mA | 37 | ||||||
VN | Output noise voltage BW = 10 Hz – 100 KHz |
COUT = 10 μF, No CNR | 27 × VOUT | μVRMS | |||
COUT = 10 μF, CNR = 0.01 μF | 8.5 × VOUT | ||||||
tSTR | Start-up time | VOUT = 3 V, RL = 30 Ω COUT = 1 μF, CNR = 0.01 μF | 600 | μs | |||
VEN(HI) | EN pin high (enabled) | 1.7 | VIN | V | |||
VEN(LO) | EN pin low (shutdown) | 0 | 0.5 | V | |||
IEN(HI) | EN pin current (enabled) | VEN = 5.5 V | 0.02 | 0.1 | μA | ||
TSD | Thermal shutdown temperature | Shutdown, temperature increasing | 160 | °C | |||
Reset, temperature decreasing | 140 |