SBVS387C February   2020  – January 2022 TPS784-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Foldback Current Limit
      2. 7.3.2 Output Enable
      3. 7.3.3 Active Discharge
      4. 7.3.4 Undervoltage Lockout (UVLO) Operation
      5. 7.3.5 Dropout Voltage
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Adjustable Device Feedback Resistors
      4. 8.1.4 Load Transient Response
      5. 8.1.5 Exiting Dropout
      6. 8.1.6 Dropout Voltage
      7. 8.1.7 Reverse Current
      8. 8.1.8 Feed-Forward Capacitor (CFF)
      9. 8.1.9 Power Dissipation (PD)
        1. 8.1.9.1 Estimating Junction Temperature
        2. 8.1.9.2 Recommended Area for Continuous Operation
        3. 8.1.9.3 Power Dissipation versus Ambient Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Additional Layout Considerations
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

at operating temperature range (TJ = –40°C to +150°C), VIN = VOUT(nom) + 0.5 V or 1.65 V (whichever is greater), IOUT =
1 mA, VEN = VIN, and CIN = COUT = 1 µF, unless otherwise noted. All typical values at TJ = 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage 1.65 6.0 V
VOUT Output voltage Adjustable output 1.2 5.5 V
Fixed output 0.65 5.0
VOUT Output accuracy(1) 1 mA ≤ IOUT ≤ 300 mA,
VOUT(nom) + 0.5 V or 1.65 V (whichever is greater) ≤ VIN ≤ 6.0 V 		TJ = 25°C –0.5 0.5 %
–40°C ≤ TJ  ≤ 85°C –1 1
–40°C ≤ TJ  ≤ 150°C –1.7 1.7
VOUT Line regulation VOUT(nom) + 0.5 V or  1.65 V (whichever is greater) ≤ VIN ≤ 6.0 V 0.3 mV
VOUT Load regulation 0.1 mA ≤ IOUT ≤ 300 mA –40°C ≤ TJ  ≤ 85°C –5 5 mV
–40°C ≤ TJ  ≤ 150°C –5 10
ΔVOUT Load transient response settling time(2) (3) COUT = 10 µF 10 µs
Load transient response overshoot, undershoot (3) (5) tR = tF = 1 µs, COUT = 10 µF IOUT = 90 mA to
210 mA		 –2% %VOUT
IOUT = 210 mA to
90 mA		 10%
IOUT = 0 mA to
300 mA		 –10%
IGND Ground current IOUT = 0 mA
VOUT(nom) + 0.5 V or 1.65 V (whichever is greater) ≤ VIN ≤ 6.0 V		 TJ = 25°C 15 25 30 µA
–40°C ≤ TJ  ≤ 85°C 33
–40°C ≤ TJ  ≤ 150°C 40
IOUT = 500 µA
VOUT(nom) + 0.5 V or 1.65 V (whichever is greater) ≤ VIN ≤ 6.0 V		 TJ = 25°C 33 43
–40°C ≤ TJ  ≤ 85°C 45
–40°C ≤ TJ  ≤ 150°C 48
ISHDN Shutdown current VEN ≤ 0.3 V
VOUT(nom) + 0.5 V or 1.65 V (whichever is greater) ≤ VIN ≤ 6.0 V		 TJ = 25°C 0.01 0.05 µA
–40°C ≤ TJ  ≤ 85°C 0.25
–40°C ≤ TJ  ≤ 150°C 3
VFB Feedback voltage Adjustable output only 1.182 1.2 1.218 V
IFB Feedback pin current Adjustable output only –0.05 0.01 0.05 µA
ICL Output current limit VIN = VOUT(nom) + 1 V,
VOUT = 0.9 x VOUT(nom) (4) 		320 420 mA
ISC Short-circuit current limit VOUT = 0 V 162.5 mA
VDO Dropout voltage IOUT = 300 mA,
VOUT = 0.95 x VOUT(nom) 		0.65 V ≤ VOUT < 0.8 V 900 mV
0.8 V ≤ VOUT < 1.2 V 775
1.2 V ≤ VOUT < 1.5 V 300
1.5 V ≤ VOUT < 1.8 V 175
1.8 V ≤ VOUT < 2.5 V 140
2.5 V ≤ VOUT ≤ 5.0 V 115
1.2 V ≤ VOUT < 1.5 V,
DRB Package only 		320
PSRR Power-supply rejection ratio IOUT = 300 mA , VIN =
VOUT + 1 V		 f = 1 kHz 60 dB
f = 100 kHz 45
f = 1 MHz 30
Vn Output noise voltage BW = 10 Hz to 100 kHz, VOUT = 1.2 V 30 µVRMS
VUVLO UVLO threshold VIN rising 1.32 1.42 1.6 V
VIN falling 1.17 1.29 1.42
VUVLO(HYST) UVLO hysteresis VIN hysteresis 130 mV
tSTR Start-up time From EN low-to-high transition to VOUT = VOUT(nom) x 95% 280 500 780 µs
VEN(HI) EN pin logic high voltage 0.85 V
VEN(LOW) EN pin logic low voltage 0.425
IEN Enable pin current VIN = VEN = 6.0 V 10 nA
RPULLDOWN Pulldown resistance VIN = 3.3 V 120 Ω
TSD(shutdown) Thermal shutdown temperature Shutdown, temperature increasing 170 °C
TSD(reset) Thermal shutdown reset temperature Reset, temperature decreasing 155
(1) Resistor tolerance is not included in overall accuracy in the adjustable version.
(2) The settling time is measured from when IOUT is stepped from 90 mA to 210 mA to when the output voltage recovers to VOUT =
VOUT(nom) - 5 mV.
(3) This specification is verified by design.
(4) The output is being forced to 90% of the nominal VOUT value.
(5) This specification is in relation to the change from the nominal output voltage (VOUT(nom)).