SLVSEW6F August   2021  – March 2024 TPS7H2211-SEP , TPS7H2211-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Related Products
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: All Devices
    6. 7.6  Electrical Characteristics: CFP and KGD Options
    7. 7.7  Electrical Characteristics: HTSSOP Option
    8. 7.8  Switching Characteristics: All Devices
    9. 7.9  Quality Conformance Inspection
    10. 7.10 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Enable and Overvoltage Protection
      2. 9.3.2 Current Limit
      3. 9.3.3 Soft Start (Adjustable Rise Time)
      4. 9.3.4 Parallel Operation
      5. 9.3.5 Reverse Current Protection
      6. 9.3.6 Forward Leakage Current
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Application 1: Cold Sparing
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Capacitance
          2. 10.2.1.2.2 Enable Control
          3. 10.2.1.2.3 Overvoltage Protection
          4. 10.2.1.2.4 Soft Start Time
          5. 10.2.1.2.5 Summary
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Application 2: Protection
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Capacitance
          2. 10.2.2.2.2 Enable Control
          3. 10.2.2.2.3 Overvoltage Protection
          4. 10.2.2.2.4 Soft Start Time
          5. 10.2.2.2.5 Summary
        3. 10.2.2.3 Application Curve
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DAP|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.10 Typical Characteristics

GUID-20210325-CA0I-KBXV-BZWH-HMG7PKXNDVXT-low.svgFigure 7-1 IQ vs Temperature Across VIN
GUID-20210325-CA0I-NMPF-PCMQ-B89B2DCMWDV6-low.svg
 
Figure 7-3 ISD vs Temperature Across VIN
GUID-20210325-CA0I-XC5K-P4SZ-DZRTQJ57KWWT-low.svg
VIN = 0 V
Figure 7-5 IRCP vs Temperature Across VOUT With EN = 0 V
GUID-20210325-CA0I-MZ67-9PF1-GZVK1QGWVKRJ-low.svg
No observed VIN dependency across measured values
Figure 7-7 VIHEN vs Temperature Across VIN
GUID-20210325-CA0I-J2XL-X7LW-3WK7QVKCXLWC-low.svg
No observed VIN dependency across measured values
Figure 7-9 VOVPR vs Temperature for CFP and KGD Across VIN
GUID-20230630-SS0I-7BRR-S05H-3RQJ6828VQSJ-low.svg
Figure 7-11 VOVPR vs Temperature for HTSSOP Across VIN
GUID-20210325-CA0I-ZZVV-1S4K-8RN88CXKFPW5-low.svg
Figure 7-13 On-Resistance vs Temperature Across Loads for CFP and KGD at VIN = 4.5 V
GUID-20210406-CA0I-K7TV-MVVJ-SXMRSRXRZRKL-low.svg
Figure 7-15 On-Resistance vs Temperature Across Loads for CFP and KGD at VIN = 9 V
GUID-20210406-CA0I-BFZL-MGFG-5SF2LNMN8Q1B-low.svg
Figure 7-17 On-Resistance vs Temperature Across Loads for CFP and KGD at VIN = 14 V
GUID-20230629-SS0I-D1GS-GLCW-GZHF8BQTJTDZ-low.svg
Figure 7-19 On-Resistance vs Temperature Across Loads for HTSSOP at VIN = 6 V
GUID-20230629-SS0I-WN5G-QNWH-6LHXJKH7GRRW-low.svg
Figure 7-21 On-Resistance vs Temperature Across Loads for HTSSOP at VIN = 12 V
GUID-20210325-CA0I-P2ZJ-B0GH-V2PDSXMDMHRL-low.svgFigure 7-2 IF vs Temperature Across VIN
GUID-20210325-CA0I-5SN0-BK45-WQMPT8PK46VQ-low.svg
VIN = 0 V
Figure 7-4 IRCP vs Temperature Across VOUT With EN = 7 V
GUID-20210325-CA0I-RRBS-HG7M-ZKQHGZGGX5TL-low.svg
 
Figure 7-6 ISS vs Temperature Across VIN
GUID-20210325-CA0I-6BTF-W4MS-Q0GBPZ3DNB6F-low.svg
No observed VIN dependency across measured values
Figure 7-8 VILEN vs Temperature Across VIN
GUID-20210325-CA0I-TN8K-2HN0-1G8QJCWBXRB9-low.svg
No observed VIN dependency across measured values
Figure 7-10 VOVPF vs Temperature for CFP and KGD Across VIN
GUID-20230630-SS0I-DTNW-MQJD-RZ8KTVSPTKS7-low.svg
Figure 7-12 VOVPF vs Temperature for HTSSOP Across VIN
GUID-20210406-CA0I-CPMS-BGZQ-KF2TQX27KXVH-low.svg
Figure 7-14 On-Resistance vs Temperature Across Loads for CFP and KGD at VIN = 6 V
GUID-20210406-CA0I-9JQC-G5V7-1K3CG4PV0GLF-low.svg
Figure 7-16 On-Resistance vs Temperature Across Loads for CFP and KGD at VIN = 12 V
GUID-20230629-SS0I-J273-NQZ7-STFSJ5GP128C-low.svg
Figure 7-18 On-Resistance vs Temperature Across Loads for HTSSOP at VIN = 4.5 V
GUID-20230629-SS0I-1JJG-SPXJ-PKPC74PCSHCX-low.svg
Figure 7-20 On-Resistance vs Temperature Across Loads for HTSSOP at VIN = 9 V
GUID-20230629-SS0I-M177-ZDQM-WBHPNJHSZNTH-low.svg
Figure 7-22 On-Resistance vs Temperature Across Loads for HTSSOP at VIN = 14 V