SLVSEW6F August   2021  – March 2024 TPS7H2211-SEP , TPS7H2211-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Related Products
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: All Devices
    6. 7.6  Electrical Characteristics: CFP and KGD Options
    7. 7.7  Electrical Characteristics: HTSSOP Option
    8. 7.8  Switching Characteristics: All Devices
    9. 7.9  Quality Conformance Inspection
    10. 7.10 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Enable and Overvoltage Protection
      2. 9.3.2 Current Limit
      3. 9.3.3 Soft Start (Adjustable Rise Time)
      4. 9.3.4 Parallel Operation
      5. 9.3.5 Reverse Current Protection
      6. 9.3.6 Forward Leakage Current
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Application 1: Cold Sparing
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Capacitance
          2. 10.2.1.2.2 Enable Control
          3. 10.2.1.2.3 Overvoltage Protection
          4. 10.2.1.2.4 Soft Start Time
          5. 10.2.1.2.5 Summary
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Application 2: Protection
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Capacitance
          2. 10.2.2.2.2 Enable Control
          3. 10.2.2.2.3 Overvoltage Protection
          4. 10.2.2.2.4 Soft Start Time
          5. 10.2.2.2.5 Summary
        3. 10.2.2.3 Application Curve
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DAP|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information
10.2.1.2.1 Capacitance

At least a 10-µF output capacitor is recommended on VOUT. Additionally, a capacitor on VIN is recommended in order to keep the input stable. However, it is generally advisable to use higher capacitance values to align with the TI EVM (evaluation module) and the radiation testing configuration (mostly relevant for SETs on VOUT as a higher capacitance generally reduces the SETs). A good higher capacitance value is 170.1 µF–specifically, 1 × 150-μF tantalum, 2 × 10-μF ceramic, and 1 × 0.1-μF ceramic capacitors. This is what is selected for this design for both the input and output capacitance.