SLVSEW6F August   2021  – March 2024 TPS7H2211-SEP , TPS7H2211-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Related Products
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: All Devices
    6. 7.6  Electrical Characteristics: CFP and KGD Options
    7. 7.7  Electrical Characteristics: HTSSOP Option
    8. 7.8  Switching Characteristics: All Devices
    9. 7.9  Quality Conformance Inspection
    10. 7.10 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Enable and Overvoltage Protection
      2. 9.3.2 Current Limit
      3. 9.3.3 Soft Start (Adjustable Rise Time)
      4. 9.3.4 Parallel Operation
      5. 9.3.5 Reverse Current Protection
      6. 9.3.6 Forward Leakage Current
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Application 1: Cold Sparing
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Capacitance
          2. 10.2.1.2.2 Enable Control
          3. 10.2.1.2.3 Overvoltage Protection
          4. 10.2.1.2.4 Soft Start Time
          5. 10.2.1.2.5 Summary
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Application 2: Protection
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Capacitance
          2. 10.2.2.2.2 Enable Control
          3. 10.2.2.2.3 Overvoltage Protection
          4. 10.2.2.2.4 Soft Start Time
          5. 10.2.2.2.5 Summary
        3. 10.2.2.3 Application Curve
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DAP|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics: All Devices

over operating ambient temperature range TA = –55°C to 125°C, VIN = 4.5 to 14 V, COUT = 10 µF, and all voltages referenced to GND (unless otherwise noted); includes group E radiation testing at TA = 25°C for RHA devices(1)
PARAMETER TEST CONDITIONS SUB-
GROUP(2)		 MIN TYP MAX UNIT
POWER SUPPLIES AND CURRENTS
VINUVLOR Internal VIN UVLO rising 1, 2, 3 3.2 3.4 3.8 V
VINUVLOF Internal VIN UVLO falling 1, 2, 3 2.6 2.9 3.2 V
HYSTVIN-UVLO Internal VIN UVLO hysteresis 1, 2, 3 0.55 0.75 V
IQ Quiescent current IOUT = 0 mA, EN = 7 V 1, 2, 3 5 10 mA
IF VIN to VOUT forward leakage current EN = 0 V, VOUT = 0 V, measured VOUT current VIN = 14 V 1, 2, 3 1 1.3 mA
VIN = 12 V 1, 2, 3 0.65 0.94
VIN = 9 V 1, 2, 3 0.15 0.49
VIN = 4.5 V 1, 2, 3 0.04 0.23
ISD VIN VIN off-state supply current EN = 0 V, VOUT = 0 V, measured VIN current VIN = 14 V 1, 2, 3 6.9 10 mA
VIN = 12 V 1, 2, 3 5.9 9.5
VIN = 9 V 1, 2, 3 4.4 8
VIN = 4.5 V 1, 2, 3 3.7 7
VRCP_ENTER Reverse current protection enter voltage(3) EN = 7 V, see Figure 8-1 VIN = 4.5 V 1 390 mV
VIN = 14 V 1 363
VRCP_EXIT Reverse current protection exit voltage(3) EN = 7 V, see Figure 8-2 VIN = 4.5 V 1 264 mV
VIN = 14 V 1 249
tRCP Reverse current protection response time EN = 7 V, see Figure 8-1 VIN = 4.5 V 9 208 µs
VIN = 14 V 9 247
IRCP Reverse current protection leakage current EN = 0 V, VOUT = 0 to 14 V and VOUT > VIN 1, 2, 3 44 250 µA
EN = 7 V, VIN = 0 V, VOUT = 0 to 14 V 1, 2, 3 37 240
SOFT START
ISS Soft start charge current 1, 2, 3 65 83 µA
ENABLE (EN) INPUT
VINEN VIN percentage for enable (4) 1, 2, 3 75%
IEN EN pin input leakage current EN = 7 V, VIN = 14 V 1, 2, 3 2 12 nA
OVERVOLTAGE PROTECTION (OVP)
IOVP OVP pin input leakage current OVP = 7 V 1, 2, 3 1.5 12 nA
CURRENT LIMIT
IL_trip Internal current limit trip point VIN = 12 V, CSS = 2 nF 1 8 A
IL_peak Fast trip off current limit peak VIN = 12 V, 10 Ω to 10 mΩ short in 1 µs,
switch inductance = 270 nH		 1 25 A
tftr Fast trip off response time 9 2.3 µs
tfto Fast trip off off-time VIN = 12 V, CSS = 2 nF 9 51 µs
THERMAL SHUTDOWN
Thermal shutdown 155 °C
Thermal shutdown hysteresis 20 °C
(1) See the 5962-18220 SMD (standard microcircuit drawing) for additional information on the RHA devices.
(2) For subgroup definitions, see the Quality Conformance Inspection table
(3) This parameter is not referenced to GND; it is referenced from VOUT to VIN.
(4) VIN must be ≥ 75% of its final value before EN is asserted only if VINSR > VOUTSR.