SLVSEW6F August   2021  – March 2024 TPS7H2211-SEP , TPS7H2211-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Related Products
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: All Devices
    6. 7.6  Electrical Characteristics: CFP and KGD Options
    7. 7.7  Electrical Characteristics: HTSSOP Option
    8. 7.8  Switching Characteristics: All Devices
    9. 7.9  Quality Conformance Inspection
    10. 7.10 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Enable and Overvoltage Protection
      2. 9.3.2 Current Limit
      3. 9.3.3 Soft Start (Adjustable Rise Time)
      4. 9.3.4 Parallel Operation
      5. 9.3.5 Reverse Current Protection
      6. 9.3.6 Forward Leakage Current
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Application 1: Cold Sparing
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Capacitance
          2. 10.2.1.2.2 Enable Control
          3. 10.2.1.2.3 Overvoltage Protection
          4. 10.2.1.2.4 Soft Start Time
          5. 10.2.1.2.5 Summary
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Application 2: Protection
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Capacitance
          2. 10.2.2.2.2 Enable Control
          3. 10.2.2.2.3 Overvoltage Protection
          4. 10.2.2.2.4 Soft Start Time
          5. 10.2.2.2.5 Summary
        3. 10.2.2.3 Application Curve
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DAP|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Electrical Characteristics: HTSSOP Option

over operating ambient temperature range TA = –55°C to 125°C, VIN = 4.5 to 14 V, COUT = 10 µF, and all voltages referenced to GND (unless otherwise noted); includes group E radiation testing at TA = 25°C for RHA devices(1)
PARAMETER TEST CONDITIONS SUB-
GROUP(2)		 MIN TYP MAX UNIT
ENABLE (EN) INPUT
VIHEN EN threshold voltage, rising 1, 2, 3 0.59 0.63 0.67 V
VILEN EN threshold voltage, falling 1, 2, 3 0.49 0.52 0.55
HYSTEN EN hysteresis voltage 1, 2, 3 95 106 116
tLOW_OFF EN signal low time during cycling  VOUT falls to < 90%, see RTIMER = 0 V,  see Figure 8-3 9, 10, 11 47 µs
OVERVOLTAGE PROTECTION (OVP)
VOVPR OVP threshold voltage, rising 1, 2, 3 1.07 1.15 1.22 V
VOVPF OVP threshold voltage, falling 1, 2, 3 1.04 1.12 1.19
HYSTOVP OVP hysteresis voltage 4.6 V < VIN < 14 V 1, 2, 3 24 28 33 mV
RESISTANCE CHARACTERISTICS
RON On-state resistance,
lead length ≈ 2.5 mm		 VIN = 14 V, IOUT = 3.5 A –55°C 3 35.6 37 mΩ
–40°C 37.5
25°C 1 44.3 46
85°C 53.7
125°C 2 56.3 60
VIN = 12 V, IOUT = 3.5 A –55°C 3 35.3 37
–40°C 37.3
25°C 1 44 46
85°C 53.4
125°C 2 56 59
VIN = 9 V, IOUT = 3.5 A –55°C 3 35 36
–40°C 37
25°C 1 43.6 45
85°C 53
125°C 2 55 58
VIN = 6 V, IOUT = 3.5 A –55°C 3 34.8 36
–40°C 37
25°C 1 43.5 45
85°C 53
125°C 2 55.3 58
VIN = 4.5 V, IOUT = 3.5 A –55°C 3 37.7 39
–40°C 40
25°C 1 47.6 49
85°C 58
125°C 2 61 63
(1) See the 5962-18220 SMD (standard microcircuit drawing) for additional information on the RHA devices.
(2) For subgroup definitions, see the Quality Conformance Inspection table