SLVSF07F July   2021  – August 2024 TPS7H5001-SP , TPS7H5002-SP , TPS7H5003-SP , TPS7H5004-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Device Options
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: All Devices
    6. 7.6  Electrical Characteristics: TPS7H5001-SP
    7. 7.7  Electrical Characteristics: TPS7H5002-SP
    8. 7.8  Electrical Characteristics: TPS7H5003-SP
    9. 7.9  Electrical Characteristics: TPS7H5004-SP
    10. 7.10 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VIN and VLDO
      2. 8.3.2  Start-Up
      3. 8.3.3  Enable and Undervoltage Lockout (UVLO)
      4. 8.3.4  Voltage Reference
      5. 8.3.5  Error Amplifier
      6. 8.3.6  Output Voltage Programming
      7. 8.3.7  Soft Start (SS)
      8. 8.3.8  Switching Frequency and External Synchronization
        1. 8.3.8.1 Internal Oscillator Mode
        2. 8.3.8.2 External Synchronization Mode
        3. 8.3.8.3 Primary-Secondary Mode
      9. 8.3.9  Primary Switching Outputs (OUTA/OUTB)
      10. 8.3.10 Synchronous Rectifier Outputs (SRA and SRB)
      11. 8.3.11 Dead Time and Leading Edge Blank Time Programmability (PS, SP, and LEB)
      12. 8.3.12 Pulse Skipping
      13. 8.3.13 Duty Cycle Programmability
      14. 8.3.14 Current Sense and PWM Generation (CS_ILIM)
      15. 8.3.15 Hiccup Mode Operation (HICC)
      16. 8.3.16 External Fault Protection (FAULT)
      17. 8.3.17 Slope Compensation (RSC)
      18. 8.3.18 Frequency Compensation
      19. 8.3.19 Thermal Shutdown
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Switching Frequency
        2. 9.2.2.2  Output Voltage Programming Resistors
        3. 9.2.2.3  Dead Time
        4. 9.2.2.4  Leading Edge Blank Time
        5. 9.2.2.5  Soft-Start Capacitor
        6. 9.2.2.6  Transformer
        7. 9.2.2.7  Main Switching FETs
        8. 9.2.2.8  Synchronous Rectificier FETs
        9. 9.2.2.9  RCD Clamp
        10. 9.2.2.10 Output Inductor
        11. 9.2.2.11 Output Capacitance and Filter
        12. 9.2.2.12 Sense Resistor
        13. 9.2.2.13 Hiccup Capacitor
        14. 9.2.2.14 Frequency Compensation Components
        15. 9.2.2.15 Slope Compensation Resistor
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • HFT|22
  • KGD|0
  • PW|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

Figure 6-1 TPS7H5001-SP HFT Package
22-Pin CFP With Thermal Pad
(Top View)
Figure 6-3 TPS7H5003-SP HFT Package
22-Pin CFP With Thermal Pad
(Top View)
Figure 6-5 TPS7H5001-SP PW Package
24-Pin TSSOP
(Top View)
Figure 6-7 TPS7H5003-SP PW Package
24-Pin TSSOP
(Top View)
Figure 6-2 TPS7H5002-SP HFT Package
22-Pin CFP With Thermal Pad
(Top View)
Figure 6-4 TPS7H5004-SP HFT Package
22-Pin CFP With Thermal Pad
(Top View)
Figure 6-6 TPS7H5002-SP PW Package
24-Pin TSSOP
(Top View)
Figure 6-8 TPS7H5004-SP PW Package
24-Pin TSSOP
(Top View)
Table 6-1 Pin Functions
PIN I/O DESCRIPTION
NAME TPS7H5001-SP TPS7H5002-SP TPS7H5003-SP TPS7H5004-SP
CFP TSSOP CFP TSSOP CFP TSSOP CFP TSSOP
RT 1 1 1 1 1 1 1 1 I/O In internal oscillation mode, the RT pin must be populated with a resistor to AVSS. When the RT pin is floating, a 200-kHz to 4-MHz external clock is required at the SYNC pin. The frequency of the external clock must be twice the desired switching frequency.
PS 2 2 2 2 — — — — I/O Primary off to synchronous rectifier on dead-time set. Programmable through an external resistor to AVSS.
SP 3 3 3 3 — — — — I/O Synchronous rectifier off to primary on dead-time set. Programmable through an external resistor to AVSS.
LEB 4 4 4 4 — — 4 4 I/O Leading edge blank time set. Programmable through an external resistor to AVSS.
HICC 5 5 5 5 5 5 5 5 I/O Cycle-by-cycle current limit time delay and hiccup time setting. Delay time and hiccup time determined by capacitor from HICC to AVSS. Connecting this pin to AVSS disables hiccup mode.
SYNC 6 6 6 6 6 6 6 6 I/O When the RT pin is floating, SYNC is configured as an input for a 200-kHz to 4-MHz external clock. In this case, the external clock input gets inverted and the system clock will run at half the frequency of the external clock input. When the RT pin is populated with a resistor to AVSS, SYNC outputs a 200-kHz to 4-MHz clock signal at twice the device switching frequency in phase with the switching of the device.
DCL 7 7 7 7 7 7 7 7 I/O Duty cycle limit configurability. For TPS7H5001-SP, connect to AVSS for 50% duty cycle limit, floating for 75%, and VLDO for 100%. For TPS7H5002-SP and TPS7H5003-SP, the DCL pin can be left floating or connected to VLDO to set the maximum duty cycle to 75% or 100%, respectively. For TPS7H5004-SP, this pin must be connected to AVSS in order to obtain the 50% maximum duty cycle.
EN 8 8 8 8 8 8 8 8 I Connecting the EN pin to the VLDO pin or external source greater than 0.6 V enables the device. In addition, input undervoltage lockout (UVLO) can be adjusted with two resistors.
VIN 9 9 9 9 9 9 9 9 I Input supply to the device. Input voltage range is from 4 V to 14 V.
OUTA 10 10 10 10 10 10 10 10 O Primary switching output A.
OUTB 11 11 — — — — 11 11 O Primary switching output B. Active only when DCL = AVSS.
SRB 12 14 — — — — — — O Synchronous rectifier output B. Active only when DCL = AVSS.
SRA 13 15 13 15 13 15 — — O Synchronous rectifier output A.
AVSS 14 16 14 16 14 16 14 16 — Ground of the device. The thermal pad, lid, and seal ring of the device are internally connected to ground for the ceramic package (CFP).
VLDO 15 17 15 17 15 17 15 17 O Output of internal regulator. Requires at least 1-μF external capacitor to AVSS.
CS_ILIM 16 18 16 18 16 18 16 18 I/O Current sense for PWM control and cycle-by-cycle overcurrent protection. An input voltage over 1.05 V on CS_ILIM will trigger an overcurrent in the PWM controller. The sensed waveform on CS_ILIM contains a 150-mV offset when compared to the COMP/2 voltage at the input of the PWM comparator.
FAULT 17 19 17 19 17 19 17 19 I Fault protection pin. When the rising threshold of the FAULT pin is exceeded, the outputs will stop switching. After the external voltage drops below the falling threshold, the device will restart after a set delay. Connect this pin to AVSS to disable FAULT.
REFCAP 18 20 18 20 18 20 18 20 O 1.2-V internal reference. Requires a 470-nF external capacitor to AVSS.
RSC 19 21 19 21 19 21 19 21 I/O A resistor from RSC to AVSS sets the desired slope compensation.
SS 20 22 20 22 20 22 20 22 I/O Soft start. An external capacitor connected to this pin sets the internal voltage reference rise time. The voltage on this pin overrides the internal reference. It can be used for tracking and sequencing.
VSENSE 21 23 21 23 21 23 21 23 I Inverting input of the error amplifier.
COMP 22 24 22 24 22 24 22 24 I/O Error amplifier output. Connect frequency compensation to this pin.
NC N/A 12, 13 11, 12 11, 12, 13, 14 2, 3, 4, 11, 12 2, 3, 4, 11, 12, 13, 14 2, 3, 12, 13 2, 3,12, 13, 14, 15 — No connect. Can be connected to AVSS to avoid floating metal if desired.
Table 6-2 TPS7H500x-SP Bare Die Information - Applicable for All Devices
DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS
15 mils Silicon with backgrind GND Al (0.5% Cu) 3000 nm
TPS7H5001-SP TPS7H5002-SP TPS7H5003-SP TPS7H5004-SP TPS7H500x-SP Bare Die Diagram - Applicable for All Devices Figure 6-9 TPS7H500x-SP Bare Die Diagram - Applicable for All Devices
Table 6-3 TPS7H5001-SP Bond Pad Coordinates in Microns
DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX
RT 1 21.33 3775.77 111.33 3865.77
PS 2 21.33 3392.37 111.33 3482.37
SP 3 21.33 3233.115 111.33 3323.115
LEB 4 21.33 2955.015 111.33 3045.015
HICC 5 21.33 2695.905 111.33 2785.905
SYNC 6 32.13 2427.705 122.13 2517.705
DCL 7 32.13 2149.515 122.13 2239.515
NC 8 32.175 1923.165 122.175 2013.165
EN 9 32.13 1660.275 122.13 1750.275
VIN 10 28.665 1432.53 118.665 1522.53
VIN 11 28.665 1325.475 118.665 1415.475
OUTA 12 32.13 586.755 122.13 676.755
OUTB 13 32.13 433.35 122.13 523.35
SRB 14 2224.62 132.93 2314.62 222.93
SRA 15 2224.62 586.755 2314.62 676.755
AVSS 16 2235.42 1053.315 2325.42 1143.315
AVSS 17 2235.42 1221.435 2325.42 1311.435
AVSS 18 2235.42 1330.425 2325.42 1420.425
VLDO 19 2224.62 1803.51 2314.62 1893.51
VLDO 20 2224.62 1912.545 2314.62 2002.545
VLDO 21 2224.62 2021.58 2314.62 2111.58
CS_ILM 22 2224.62 2274.3 2314.62 2364.3
FAULT 23 2224.62 2513.16 2314.62 2603.16
REFCAP 24 2235.42 2766.285 2325.42 2856.285
RSC 25 2235.42 3033.36 2325.42 3123.36
SS 26 2235.42 3296.655 2325.42 3386.655
VSENSE 27 2235.42 3563.64 2325.42 3653.64
COMP 28 2235.42 3905.55 2325.42 3995.55
Table 6-4 TPS7H5002-SP Bond Pad Coordinates in Microns
DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX
RT 1 21.33 3775.77 111.33 3865.77
PS 2 21.33 3392.37 111.33 3482.37
SP 3 21.33 3233.115 111.33 3323.115
LEB 4 21.33 2955.015 111.33 3045.015
HICC 5 21.33 2695.905 111.33 2785.905
SYNC 6 32.13 2427.705 122.13 2517.705
DCL 7 32.13 2149.515 122.13 2239.515
NC 8 32.175 1923.165 122.175 2013.165
EN 9 32.13 1660.275 122.13 1750.275
VIN 10 28.665 1432.53 118.665 1522.53
VIN 11 28.665 1325.475 118.665 1415.475
OUTA 12 32.13 586.755 122.13 676.755
NC 13 32.13 433.35 122.13 523.35
NC 14 2224.62 132.93 2314.62 222.93
SRA 15 2224.62 586.755 2314.62 676.755
AVSS 16 2235.42 1053.315 2325.42 1143.315
AVSS 17 2235.42 1221.435 2325.42 1311.435
AVSS 18 2235.42 1330.425 2325.42 1420.425
VLDO 19 2224.62 1803.51 2314.62 1893.51
VLDO 20 2224.62 1912.545 2314.62 2002.545
VLDO 21 2224.62 2021.58 2314.62 2111.58
CS_ILM 22 2224.62 2274.3 2314.62 2364.3
FAULT 23 2224.62 2513.16 2314.62 2603.16
REFCAP 24 2235.42 2766.285 2325.42 2856.285
RSC 25 2235.42 3033.36 2325.42 3123.36
SS 26 2235.42 3296.655 2325.42 3386.655
VSENSE 27 2235.42 3563.64 2325.42 3653.64
COMP 28 2235.42 3905.55 2325.42 3995.55
Table 6-5 TPS7H5003-SP Bond Pad Coordinates in Microns
DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX
RT 1 21.33 3775.77 111.33 3865.77
NC 2 21.33 3392.37 111.33 3482.37
NC 3 21.33 3233.115 111.33 3323.115
NC 4 21.33 2955.015 111.33 3045.015
HICC 5 21.33 2695.905 111.33 2785.905
SYNC 6 32.13 2427.705 122.13 2517.705
DCL 7 32.13 2149.515 122.13 2239.515
NC 8 32.175 1923.165 122.175 2013.165
EN 9 32.13 1660.275 122.13 1750.275
VIN 10 28.665 1432.53 118.665 1522.53
VIN 11 28.665 1325.475 118.665 1415.475
OUTA 12 32.13 586.755 122.13 676.755
NC 13 32.13 433.35 122.13 523.35
NC 14 2224.62 132.93 2314.62 222.93
SRA 15 2224.62 586.755 2314.62 676.755
AVSS 16 2235.42 1053.315 2325.42 1143.315
AVSS 17 2235.42 1221.435 2325.42 1311.435
AVSS 18 2235.42 1330.425 2325.42 1420.425
VLDO 19 2224.62 1803.51 2314.62 1893.51
VLDO 20 2224.62 1912.545 2314.62 2002.545
VLDO 21 2224.62 2021.58 2314.62 2111.58
CS_ILM 22 2224.62 2274.3 2314.62 2364.3
FAULT 23 2224.62 2513.16 2314.62 2603.16
REFCAP 24 2235.42 2766.285 2325.42 2856.285
RSC 25 2235.42 3033.36 2325.42 3123.36
SS 26 2235.42 3296.655 2325.42 3386.655
VSENSE 27 2235.42 3563.64 2325.42 3653.64
COMP 28 2235.42 3905.55 2325.42 3995.55
Table 6-6 TPS7H5004-SP Bond Pad Coordinates in Microns
DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX
RT 1 21.33 3775.77 111.33 3865.77
NC 2 21.33 3392.37 111.33 3482.37
NC 3 21.33 3233.115 111.33 3323.115
LEB 4 21.33 2955.015 111.33 3045.015
HICC 5 21.33 2695.905 111.33 2785.905
SYNC 6 32.13 2427.705 122.13 2517.705
DCL 7 32.13 2149.515 122.13 2239.515
NC 8 32.175 1923.165 122.175 2013.165
EN 9 32.13 1660.275 122.13 1750.275
VIN 10 28.665 1432.53 118.665 1522.53
VIN 11 28.665 1325.475 118.665 1415.475
OUTA 12 32.13 586.755 122.13 676.755
OUTB 13 32.13 433.35 122.13 523.35
NC 14 2224.62 132.93 2314.62 222.93
NC 15 2224.62 586.755 2314.62 676.755
AVSS 16 2235.42 1053.315 2325.42 1143.315
AVSS 17 2235.42 1221.435 2325.42 1311.435
AVSS 18 2235.42 1330.425 2325.42 1420.425
VLDO 19 2224.62 1803.51 2314.62 1893.51
VLDO 20 2224.62 1912.545 2314.62 2002.545
VLDO 21 2224.62 2021.58 2314.62 2111.58
CS_ILM 22 2224.62 2274.3 2314.62 2364.3
FAULT 23 2224.62 2513.16 2314.62 2603.16
REFCAP 24 2235.42 2766.285 2325.42 2856.285
RSC 25 2235.42 3033.36 2325.42 3123.36
SS 26 2235.42 3296.655 2325.42 3386.655
VSENSE 27 2235.42 3563.64 2325.42 3653.64
COMP 28 2235.42 3905.55 2325.42 3995.55