SLVSCY5F February   2016  – January 2023 TPS82130

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommend Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM and PSM Operation
      2. 7.3.2 Low Dropout Operation (100% Duty Cycle)
      3. 7.3.3 Switch Current Limit
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Disable (EN)
      2. 7.4.2 Soft Start-Up (SS/TR)
      3. 7.4.3 Voltage Tracking (SS/TR)
      4. 7.4.4 Power-Good Output (PG)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 1.8-V Output Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 8.2.1.2.2 Setting the Output Voltage
          3. 8.2.1.2.3 Input and Output Capacitor Selection
          4. 8.2.1.2.4 Soft Start-Up Capacitor Selection
        3. 8.2.1.3 Application Performance Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Thermal Consideration
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Third-Party Products Disclaimer
        2. 9.1.1.2 Custom Design with WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Glossary
    7. 9.7 Electrostatic Discharge Caution
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • SIL|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

  • TI recommends placing all components as close as possible to the IC. The input capacitor placement specifically must be closest to the VIN and GND pins of the device.
  • Use wide and short traces for the main current paths to reduce the parasitic inductance and resistance.
  • To enhance heat dissipation of the device, the exposed thermal pad must be connected to bottom or internal layer ground planes using vias.
  • Refer to Figure 8-25 for an example of component placement, routing, and thermal design.