SLVSCY5F February   2016  – January 2023 TPS82130

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommend Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM and PSM Operation
      2. 7.3.2 Low Dropout Operation (100% Duty Cycle)
      3. 7.3.3 Switch Current Limit
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Disable (EN)
      2. 7.4.2 Soft Start-Up (SS/TR)
      3. 7.4.3 Voltage Tracking (SS/TR)
      4. 7.4.4 Power-Good Output (PG)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 1.8-V Output Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 8.2.1.2.2 Setting the Output Voltage
          3. 8.2.1.2.3 Input and Output Capacitor Selection
          4. 8.2.1.2.4 Soft Start-Up Capacitor Selection
        3. 8.2.1.3 Application Performance Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Thermal Consideration
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Third-Party Products Disclaimer
        2. 9.1.1.2 Custom Design with WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Glossary
    7. 9.7 Electrostatic Discharge Caution
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • SIL|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TPS82130
(JEDEC 51-5)		TPS82130EVM-720UNIT
RθJAJunction-to-ambient thermal resistance58.246.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance9.49.4°C/W
RθJBJunction-to-board thermal resistance14.414.4°C/W
ψJTJunction-to-top characterization parameter0.90.9°C/W
ψJBJunction-to-board characterization parameter14.214.0°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance21.321.3°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Theta-JA can be improved with a custom PCB design containing thermal vias where possible.