SNVSBZ5 March 2021 TPS92360
PRODUCTION DATA
When TPS92360 drives heavy load for large size panel applications, the power dissipation increases a lot and the device junction temperature may reach a very high value, affecting the device function and reliability. In order to lower the thermal stress, the TPS92360 features a thermal foldback function. When the junction temperature is higher than 100°C, the switch current limit ILIM is reduced automatically as Figure 6-2 shows. This thermal foldback mechanism controls the power dissipation and keeps the junction temperature from rising to a very high value. If the typical junction temperature of 160°C is exceeded, an internal thermal shutdown turns off the device. The device is released from shutdown automatically when the junction temperature decreases by 15°C.