SLUSDG2 October 2018 TPS92515AHV-Q1
PRODUCTION DATA.
The dominant power loss factors predict the junction temperature. These equations offer an estimate of device temperature for the use of considering different conversion scenarios. By adding the losses and using the device thermal impedance, a temperature can be predicted. In this case we consider losses internal to the device: Conduction loss in the MOSFET, an estimate of switching losses and Icq losses.
By expanding the terms an estimate can be calculated using Equation 12. Equation 12 is a good prediction in a design and layout similar to the orderable EVM. If other sources of heat rise are located near the TPS92515AHV-Q1 the device temperature also rises accordingly.