SLVSHB8 august 2023 TPS92621-Q1
PRODUCTION DATA
THERMAL METRIC(1) | TPS92621-Q1 | UNIT | |
---|---|---|---|
DGN(HVSSOP) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 60 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 58.7 | °C/W |
RθJB | Junction-to-board thermal resistance | 25.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 1.7 | °C/W |
ψJB | Junction-to-board characterization parameter | 25.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 11.3 | °C/W |