SLVSHB8 august   2023 TPS92621-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Supply (SUPPLY)
        1. 7.3.1.1 Power-On Reset (POR)
        2. 7.3.1.2 Suppply Current in Fault Mode
      2. 7.3.2  Enable and Shutdown(EN)
      3. 7.3.3  Constant-Current Output and Setting (IN)
      4. 7.3.4  Thermal Sharing Resistor (OUT and RES)
      5. 7.3.5  PWM Control (PWM)
      6. 7.3.6  Supply Control
      7. 7.3.7  Diagnostics
        1. 7.3.7.1 LED Short-to-GND Detection
        2. 7.3.7.2 LED Open-Circuit Detection
        3. 7.3.7.3 LED Open-Circuit Detection Enable (DIAGEN)
        4. 7.3.7.4 Overtemperature Protection
        5. 7.3.7.5 Low Dropout Operation
      8. 7.3.8  FAULT Bus Output With One-Fails-All-Fail
      9. 7.3.9  FAULT Table
      10. 7.3.10 LED Fault Summary
      11. 7.3.11 IO Pins Inner Connection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Undervoltage Lockout, V(SUPPLY) < V(POR_rising)
      2. 7.4.2 Normal Operation V(SUPPLY) ≥ 4.5 V
      3. 7.4.3 Low-Voltage Dropout Operation
      4. 7.4.4 Fault Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 BCM Controlled Rear Lamp With One-Fails-All-Fail Setup
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Independent PWM Controlled Rear Lamp By MCU
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS92621-Q1 UNIT
DGN(HVSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 60 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58.7 °C/W
RθJB Junction-to-board thermal resistance 25.6 °C/W
ψJT Junction-to-top characterization parameter 1.7 °C/W
ψJB Junction-to-board characterization parameter 25.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 11.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.