SLVSGP5 may   2023 TPS92629-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Supply (SUPPLY)
        1. 7.3.1.1 Power-On Reset (POR)
        2. 7.3.1.2 Supply Current in Fault Mode
      2. 7.3.2  Enable and Shutdown
      3. 7.3.3  Constant-Current Output and Setting (IN)
      4. 7.3.4  Thermal Sharing Resistor (OUT and RES)
      5. 7.3.5  Brightness Control (EN/PWM and ADIM)
      6. 7.3.6  Diagnostics
        1. 7.3.6.1 LED Short-to-GND Detection
        2. 7.3.6.2 LED Open-Circuit and Short-to-Battery Detection
        3. 7.3.6.3 LED Open-Circuit and Short-to-Battery Detection Enable (DIAGEN)
        4. 7.3.6.4 Overtemperature Protection
        5. 7.3.6.5 Low Dropout Operation
      7. 7.3.7  Multi Fault Report
      8. 7.3.8  FAULT Table
      9. 7.3.9  LED Fault Summary
      10. 7.3.10 IO Pins Inner Connection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Undervoltage Lockout, V(SUPPLY) < V(POR_rising)
      2. 7.4.2 Normal Operation V(SUPPLY) ≥ 4.5 V
      3. 7.4.3 Low-Voltage Dropout Operation
      4. 7.4.4 Fault Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Using Analog Dimming Controlled By MCU for Blind Spot Detection
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS92629-Q1 UNIT
DGN
8 PINS
RθJA Junction-to-ambient thermal resistance 50.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 70.4 °C/W
RθJB Junction-to-board thermal resistance 23.8 °C/W
ψJT Junction-to-top characterization parameter 2.5 °C/W
ψJB Junction-to-board characterization parameter 23.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.