SLVSG60A April   2023  – April 2024 TPS929160-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Device Bias and Power
        1. 6.3.1.1 Power Bias (VBAT)
        2. 6.3.1.2 Enable and Shutdown (EN)
        3. 6.3.1.3 5V Low-Drop-Out Linear Regulator (VLDO)
        4. 6.3.1.4 Undervoltage Lockout (UVLO) and Power-On-Reset (POR)
        5. 6.3.1.5 Power Supply (SUPPLY)
        6. 6.3.1.6 Programmable Low Supply Warning
      2. 6.3.2  Constant Current Output
        1. 6.3.2.1 Reference Current with External Resistor (REF)
        2. 6.3.2.2 64-Step Programmable High-Side Constant-Current Output
      3. 6.3.3  PWM Dimming
        1. 6.3.3.1 PWM Generator
        2. 6.3.3.2 PWM Dimming Frequency
        3. 6.3.3.3 Blank Time
        4. 6.3.3.4 Phase Shift PWM Dimming
        5. 6.3.3.5 Linear Brightness Control
        6. 6.3.3.6 Exponential Brightness Control
      4. 6.3.4  FAIL-SAFE State Operation
      5. 6.3.5  On-Chip, 8-Bit, Analog-to-Digital Converter (ADC)
        1. 6.3.5.1 Minimum On Time for ADC Measurement
        2. 6.3.5.2 ADC Auto Scan
        3. 6.3.5.3 ADC Error
      6. 6.3.6  NSTB Output
      7. 6.3.7  Diagnostic and Protection in NORMAL State
        1. 6.3.7.1  VBAT Undervoltage Lockout Diagnostics in NORMAL state
        2. 6.3.7.2  Low-Supply Warning Diagnostics in NORMAL State
        3. 6.3.7.3  Supply Undervoltage Diagnostics in NORMAL State
        4. 6.3.7.4  Reference Diagnostics in NORMAL state
        5. 6.3.7.5  Pre-Thermal Warning in NORMAL state
        6. 6.3.7.6  Overtemperature Protection in NORMAL state
        7. 6.3.7.7  Overtemperature Shutdown in NORMAL state
        8. 6.3.7.8  LED Open-Circuit Diagnostics in NORMAL state
        9. 6.3.7.9  LED Short-Circuit Diagnostics in NORMAL state
        10. 6.3.7.10 Single-LED Short-Circuit Detection in NORMAL state
        11. 6.3.7.11 EEPROM CRC Error in NORMAL state
        12. 6.3.7.12 Communication Loss Diagnostic in NORMAL state
        13. 6.3.7.13 Fault Masking in NORMAL state
        14.       55
      8. 6.3.8  Diagnostic and Protection in FAIL-SAFE states
        1. 6.3.8.1  Supply Undervoltage Lockout Diagnostics in FAIL-SAFE states
        2. 6.3.8.2  Low-Supply Warning Diagnostics in FAIL-SAFE states
        3. 6.3.8.3  Supply Undervoltage Diagnostics in FAIL-SAFE State
        4. 6.3.8.4  Reference Diagnostics in FAIL-SAFE states
        5. 6.3.8.5  Pre-Thermal Warning in FAIL-SAFE state
        6. 6.3.8.6  Overtemperature Protection in FAIL-SAFE state
        7. 6.3.8.7  Overtemperature Shutdown in FAIL-SAFE state
        8. 6.3.8.8  LED Open-Circuit Diagnostics in FAIL-SAFE state
        9. 6.3.8.9  LED Short-Circuit Diagnostics in FAIL-SAFE state
        10. 6.3.8.10 Single-LED Short-Circuit Detection in FAIL-SAFE state
        11. 6.3.8.11 EEPROM CRC Error in FAIL-SAFE state
        12. 6.3.8.12 Fault Masking in FAIL-SAFE state
        13.       69
      9. 6.3.9  OFAF Setup In FAIL-SAFE state
      10. 6.3.10 ERR Output
    4. 6.4 Device Functional Modes
      1. 6.4.1 POR State
      2. 6.4.2 INITIALIZATION state
      3. 6.4.3 NORMAL state
      4. 6.4.4 FAIL-SAFE state
      5. 6.4.5 PROGRAM state
    5. 6.5 Programming
      1. 6.5.1 FlexWire Protocol
        1. 6.5.1.1 Protocol Overview
        2. 6.5.1.2 UART Interface Address Setting
        3. 6.5.1.3 Status Response
        4. 6.5.1.4 Synchronization Byte
        5. 6.5.1.5 Device Address Byte
        6. 6.5.1.6 Register Address Byte
        7. 6.5.1.7 Data Frame
        8. 6.5.1.8 CRC Frame
        9. 6.5.1.9 Burst Mode
      2. 6.5.2 Registers Lock
      3. 6.5.3 Register Default Data
      4. 6.5.4 EEPROM Programming
        1. 6.5.4.1 Chip Selection by Pulling REF Pin High
        2. 6.5.4.2 Chip Selection by ADDR Pins Configuration
        3. 6.5.4.3 EEPROM Register Access and Burn
        4. 6.5.4.4 EEPROM PROGRAM state Exit
    6. 6.6 Register Maps
      1. 6.6.1 BRT Registers
      2. 6.6.2 IOUT Registers
      3. 6.6.3 CONF Registers
      4. 6.6.4 CTRL Registers
      5. 6.6.5 FLAG Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Smart Rear Lamp with Distributed LED Drivers
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCP|38
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-0021
HBM ESD classification level 1C		 ±2000 V
Charged device model (CDM), per AEC Q100-011
CDM ESD Classification Level C4B		 Corner pins (RX, ADDR3, OUTF0, OUTF1) ±750
Other pins ±500
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.