SLVSHS7 October   2024 TPSI31P1-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Insulation Characteristic Curves
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Transmission of the Enable State
      2. 6.3.2 Power Transmission
      3. 6.3.3 Gate Driver
      4. 6.3.4 Chip Enable (CE)
      5. 6.3.5 Comparators
      6. 6.3.6 VDDP, VDDH, and VDDM Under-voltage Lockout (UVLO)
      7. 6.3.7 Keep-off Circuitry
      8. 6.3.8 Thermal Shutdown
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 CDIV1, CDIV2 Capacitance
      3. 7.2.3 Application Curves
      4. 7.2.4 Insulation Lifetime
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • DVX|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Insulation Specifications

PARAMETER TEST CONDITIONS VALUE UNIT
CREEPAGE AND TRACKING
CLR External clearance(1) Shortest terminal-to-terminal distance through air ≥ 8 mm
CPG External creepage(1) Shortest terminal-to-terminal distance across the package surface ≥ 8 mm
DTI Distance through the insulation Minimum internal gap (internal clearance) > 120 µm
CTI Comparative tracking index DIN EN 60112 (VDE 0303-11); IEC 60112 > 600 V
Material group According to IEC 60664-1 I
Overvoltage category per IEC 60664-1 Rated mains voltage ≤ 600VRMS I-IV
Rated mains voltage ≤ 1000VRMS I-III
DIN EN IEC 60747-17 (VDE 0884-17)
VIORM Maximum repetitive peak isolation voltage AC voltage (bipolar) 1697 VPK
VIOWM Maximum isolation working voltage AC voltage (sine wave) 1200 VRMS
DC voltage 1697 VDC
VIOTM Maximum transient isolation voltage VTEST = VIOTM; t = 60s (qualification test) 7070 VPK
VTEST = 1.2 × VIOTM; t = 1s (100% production test) 8484 VPK
VIMP Maximum impulse voltage(2) Tested in air;
1.2/50µs waveform per IEC 62638-1		 9230 VPK
VIOSM Maximum surge isolation voltage(3) Tested in oil (qualification test);
1.2/50µs waveform per IEC 62638-1		 12000 VPK
qpd Apparent charge(4) Method a: After input-output safety test subgroup 2/3,
Vini = VIOTM, tini = 60s;
Vpd(m) = 1.2 × VIORM = 2036VPK, tm = 10s.		 ≤ 5 pC
Method a: After environmental tests subgroup 1,
Vini = VIOTM, tini = 60s;
Vpd(m) = 1.6 × VIORM = 2715VPK, tm = 10s.		 ≤ 5
Method b1: At routine test (100% production) and preconditioning (type test), Vini = VIOTM, tini = 1s;
Vpd(m) = 1.875 × VIORM = 3139VPK, tm = 1s.		 ≤ 5
CIO Barrier capacitance, input to output(5) VIO = 0.4 × sin (2πft), f = 1MHz 3 pF
RIO Insulation resistance, input to output(5) VIO = 500V, TA = 25°C > 1012 Ω
VIO = 500V, 100°C ≤ TA ≤ 125°C > 1011
VIO = 500V at TS =150°C > 109
Pollution degree 2
Climatic category 40/125/21
UL 1577
VISO Withstand isolation voltage VTEST = VISO = 5000VRMS, t = 60s (qualification), VTEST = 1.2 × VISO = 6000VRMS, t = 1s (100% production) 5000 VRMS
(1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance. Creepage and clearance on a printed-circuit board become equal in certain cases. Techniques such as inserting grooves, ribs, or both on a printed-circuit board are used to help increase these specifications.
(2) Testing is carried out in air to determine the intrinsic surge immunity of the package.
(3) Testing is carried out in oil to determine the intrinsic surge immunity of the isolation barrier.
(4) Apparent charge is electrical discharge caused by a partial discharge (pd).
(5) All pins on each side of the barrier tied together creating a two-pin device.