SNVSC83B September   2022  – February 2023 TPSM365R3 , TPSM365R6

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  System Characteristics
    7. 8.7  Typical Characteristics
    8. 8.8  Typical Characteristics: VIN = 12 V
    9. 8.9  Typical Characteristics: VIN = 24 V
    10. 8.10 Typical Characteristics: VIN = 48 V
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Input Voltage Range
      2. 9.3.2  Output Voltage Selection
      3. 9.3.3  Input Capacitors
      4. 9.3.4  Output Capacitors
      5. 9.3.5  Enable, Start-Up, and Shutdown
      6. 9.3.6  External CLK SYNC (with MODE/SYNC)
        1. 9.3.6.1 Pulse-Dependent MODE/SYNC Pin Control
      7. 9.3.7  Switching Frequency (RT)
      8. 9.3.8  Power-Good Output Operation
      9. 9.3.9  Internal LDO, VCC UVLO, and BIAS Input
      10. 9.3.10 Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
      11. 9.3.11 Spread Spectrum
      12. 9.3.12 Soft Start and Recovery from Dropout
        1. 9.3.12.1 Recovery from Dropout
      13. 9.3.13 Overcurrent Protection (OCP)
      14. 9.3.14 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
      2. 9.4.2 Standby Mode
      3. 9.4.3 Active Mode
        1. 9.4.3.1 CCM Mode
        2. 9.4.3.2 AUTO Mode - Light Load Operation
          1. 9.4.3.2.1 Diode Emulation
          2. 9.4.3.2.2 Frequency Reduction
        3. 9.4.3.3 FPWM Mode - Light Load Operation
        4. 9.4.3.4 Minimum On-time (High Input Voltage) Operation
      4. 9.4.4 Dropout
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 600-mA and 300-mA Synchronous Buck Regulator for Industrial Applications
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 10.2.1.2.2  Output Voltage Setpoint
          3. 10.2.1.2.3  Switching Frequency Selection
          4. 10.2.1.2.4  Input Capacitor Selection
          5. 10.2.1.2.5  Output Capacitor Selection
          6. 10.2.1.2.6  VCC
          7. 10.2.1.2.7  CFF Selection
          8. 10.2.1.2.8  Power-Good Signal
          9. 10.2.1.2.9  Maximum Ambient Temperature
          10. 10.2.1.2.10 Other Connections
        3. 10.2.1.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 Ground and Thermal Considerations
      2. 10.4.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Development Support
        1. 11.1.3.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
10.2.1.2.1 Custom Design With WEBENCH® Tools

To create a custom design using the TPSM365Rx device with the WEBENCH Power Designer.

  1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
  2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
  3. Compare the generated design with other possible solutions from Texas Instruments.

The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability.

In most cases, these actions are available:

  • Run electrical simulations to see important waveforms and circuit performance.
  • Run thermal simulations to understand board thermal performance.
  • Export customized schematic and layout into popular CAD formats.
  • Print PDF reports for the design, and share the design with colleagues.

Get more information about WEBENCH tools at www.ti.com/WEBENCH.