SNVSC83B
September 2022 – February 2023
TPSM365R3
,
TPSM365R6
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Description (continued)
6
Device Comparison Table
7
Pin Configuration and Functions
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Thermal Information
8.5
Electrical Characteristics
8.6
System Characteristics
8.7
Typical Characteristics
8.8
Typical Characteristics: VIN = 12 V
8.9
Typical Characteristics: VIN = 24 V
8.10
Typical Characteristics: VIN = 48 V
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Input Voltage Range
9.3.2
Output Voltage Selection
9.3.3
Input Capacitors
9.3.4
Output Capacitors
9.3.5
Enable, Start-Up, and Shutdown
9.3.6
External CLK SYNC (with MODE/SYNC)
9.3.6.1
Pulse-Dependent MODE/SYNC Pin Control
9.3.7
Switching Frequency (RT)
9.3.8
Power-Good Output Operation
9.3.9
Internal LDO, VCC UVLO, and BIAS Input
9.3.10
Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
9.3.11
Spread Spectrum
9.3.12
Soft Start and Recovery from Dropout
9.3.12.1
Recovery from Dropout
9.3.13
Overcurrent Protection (OCP)
9.3.14
Thermal Shutdown
9.4
Device Functional Modes
9.4.1
Shutdown Mode
9.4.2
Standby Mode
9.4.3
Active Mode
9.4.3.1
CCM Mode
9.4.3.2
AUTO Mode - Light Load Operation
9.4.3.2.1
Diode Emulation
9.4.3.2.2
Frequency Reduction
9.4.3.3
FPWM Mode - Light Load Operation
9.4.3.4
Minimum On-time (High Input Voltage) Operation
9.4.4
Dropout
10
Application and Implementation
10.1
Application Information
10.2
Typical Application
10.2.1
600-mA and 300-mA Synchronous Buck Regulator for Industrial Applications
10.2.1.1
Design Requirements
10.2.1.2
Detailed Design Procedure
10.2.1.2.1
Custom Design With WEBENCH® Tools
10.2.1.2.2
Output Voltage Setpoint
10.2.1.2.3
Switching Frequency Selection
10.2.1.2.4
Input Capacitor Selection
10.2.1.2.5
Output Capacitor Selection
10.2.1.2.6
VCC
10.2.1.2.7
CFF Selection
10.2.1.2.8
Power-Good Signal
10.2.1.2.9
Maximum Ambient Temperature
10.2.1.2.10
Other Connections
10.2.1.3
Application Curves
10.3
Power Supply Recommendations
10.4
Layout
10.4.1
Layout Guidelines
10.4.1.1
Ground and Thermal Considerations
10.4.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Third-Party Products Disclaimer
11.1.2
Device Nomenclature
11.1.3
Development Support
11.1.3.1
Custom Design With WEBENCH® Tools
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Receiving Notification of Documentation Updates
11.4
Support Resources
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RDN|11
MPQF642B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
snvsc83b_oa
snvsc83b_pm
11.1.3
Development Support