SNVSC83B September   2022  – February 2023 TPSM365R3 , TPSM365R6

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  System Characteristics
    7. 8.7  Typical Characteristics
    8. 8.8  Typical Characteristics: VIN = 12 V
    9. 8.9  Typical Characteristics: VIN = 24 V
    10. 8.10 Typical Characteristics: VIN = 48 V
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Input Voltage Range
      2. 9.3.2  Output Voltage Selection
      3. 9.3.3  Input Capacitors
      4. 9.3.4  Output Capacitors
      5. 9.3.5  Enable, Start-Up, and Shutdown
      6. 9.3.6  External CLK SYNC (with MODE/SYNC)
        1. 9.3.6.1 Pulse-Dependent MODE/SYNC Pin Control
      7. 9.3.7  Switching Frequency (RT)
      8. 9.3.8  Power-Good Output Operation
      9. 9.3.9  Internal LDO, VCC UVLO, and BIAS Input
      10. 9.3.10 Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
      11. 9.3.11 Spread Spectrum
      12. 9.3.12 Soft Start and Recovery from Dropout
        1. 9.3.12.1 Recovery from Dropout
      13. 9.3.13 Overcurrent Protection (OCP)
      14. 9.3.14 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
      2. 9.4.2 Standby Mode
      3. 9.4.3 Active Mode
        1. 9.4.3.1 CCM Mode
        2. 9.4.3.2 AUTO Mode - Light Load Operation
          1. 9.4.3.2.1 Diode Emulation
          2. 9.4.3.2.2 Frequency Reduction
        3. 9.4.3.3 FPWM Mode - Light Load Operation
        4. 9.4.3.4 Minimum On-time (High Input Voltage) Operation
      4. 9.4.4 Dropout
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 600-mA and 300-mA Synchronous Buck Regulator for Industrial Applications
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 10.2.1.2.2  Output Voltage Setpoint
          3. 10.2.1.2.3  Switching Frequency Selection
          4. 10.2.1.2.4  Input Capacitor Selection
          5. 10.2.1.2.5  Output Capacitor Selection
          6. 10.2.1.2.6  VCC
          7. 10.2.1.2.7  CFF Selection
          8. 10.2.1.2.8  Power-Good Signal
          9. 10.2.1.2.9  Maximum Ambient Temperature
          10. 10.2.1.2.10 Other Connections
        3. 10.2.1.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 Ground and Thermal Considerations
      2. 10.4.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Development Support
        1. 11.1.3.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Absolute Maximum Ratings

Over the recommended operating junction temperature range (unless otherwise noted) (1)
PARAMETER MIN MAX UNIT
Voltage VIN to GND –0.3 70 V
Voltage EN to GND –0.3 70 V
Voltage SW to GND –0.3 70.3 V
Voltage MODE/SYNC to GND (MODE/SYNC variant) –0.3 5.5 V
Voltage RT to GND (RT variant) –0.3 5.5 V
Voltage BIAS to GND (Fixed VOUT variant) –0.3 13 V
Voltage FB to GND (Adjustable VOUT variant) –0.3 13 V
Voltage PGOOD to GND 0 20 V
Voltage BOOT to SW –0.3 5.5 V
Voltage VCC to GND –0.3 5.5 V
TJ (2) Junction temperature –40 125 °C
Tstg Storage temperature –55 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves in the Typical Applications sections, ensures that the maximum junction temperature of any component inside the module is never exceeded.