SLVSHK8A December   2023  – June 2024 TPSM64404 , TPSM64406 , TPSM64406E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range (VIN1, VIN2)
      2. 7.3.2  Enable EN Pin and Use as VIN UVLO
      3. 7.3.3  CONFIG Device Configuration Pin
      4. 7.3.4  Adjustable Switching Frequency
      5. 7.3.5  Spread Spectrum
      6. 7.3.6  Adjustable Output Voltage (FB)
      7. 7.3.7  Input Capacitors
      8. 7.3.8  Output Capacitors
      9. 7.3.9  SYNC Allows Clock Synchronization and Mode Selection
      10. 7.3.10 Power-Good Output Voltage Monitoring
      11. 7.3.11 Bias Supply Regulator (VCC, VOSNS)
      12. 7.3.12 Overcurrent Protection (OCP)
      13. 7.3.13 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1 – High-efficiency Dual Output 5 V at 3 A, 3.3 V at 3 A, Synchronous Buck Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Output Voltage Setpoint
          3. 8.2.1.2.3 Switching Frequency Selection
          4. 8.2.1.2.4 Input Capacitor Selection
          5. 8.2.1.2.5 Output Capacitor Selection
          6. 8.2.1.2.6 Other Considerations
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Design 1 – High-efficiency 8-A (10-A peak) Synchronous Buck Regulator for Industrial Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Output Voltage Setpoint
          2. 8.2.2.2.2 Switching Frequency Selection
          3. 8.2.2.2.3 Input Capacitor Selection
          4. 8.2.2.2.4 Output Capacitor Selection
          5. 8.2.2.2.5 Other Connections
        3. 8.2.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermal Design and Layout
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.13 Thermal Shutdown

Thermal shutdown is an integrated self-protection used to limit junction temperature and prevent damage related to overheating. Thermal shutdown turns off the device when the junction temperature exceeds 168°C (typical) to prevent further power dissipation and temperature rise. Junction temperature decreases after shutdown, and the TPSM64406 attempts to restart when the junction temperature falls to 159°C (typical).