SLUSDN6B
September 2019 – July 2024
TPSM82810
,
TPSM82813
PRODMIX
1
1
Features
2
Applications
3
Description
4
Device Comparison Table
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Typical Characteristics
7
Parameter Measurement Information
7.1
Schematic
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Precise Enable (EN)
8.3.2
Output Discharge
8.3.3
COMP/FSET
8.3.4
MODE/SYNC
8.3.5
Spread Spectrum Clocking (SSC) - TPSM8281xS
8.3.6
Undervoltage Lockout (UVLO)
8.3.7
Power-Good Output (PG)
8.3.8
Thermal Shutdown
8.4
Device Functional Modes
8.4.1
Pulse Width Modulation (PWM) Operation
8.4.2
Power Save Mode Operation (PFM/PWM)
8.4.3
100% Duty-Cycle Operation
8.4.4
Current Limit and Short Circuit Protection
8.4.5
Soft Start / Tracking (SS/TR)
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Custom Design With WEBENCH® Tools
9.2.2.2
Programming the Output Voltage
9.2.2.3
Feedforward capacitor
9.2.2.4
Input Capacitor
9.2.2.5
Output Capacitor
9.2.3
Application Curves
9.3
System Examples
9.3.1
Voltage Tracking
9.3.2
Synchronizing to an External Clock
9.4
Power Supply Recommendations
9.5
Layout
9.5.1
Layout Guidelines
9.5.2
Layout Example
9.5.2.1
Thermal Consideration
10
Device and Documentation Support
10.1
Device Support
10.1.1
Third-Party Products Disclaimer
10.1.2
Custom Design With WEBENCH® Tools
10.2
Documentation Support
10.2.1
Related Documentation
10.3
Receiving Notification of Documentation Updates
10.4
Support Resources
10.5
Trademarks
10.6
Electrostatic Discharge Caution
10.7
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
SIL|14
MPQS045E
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slusdn6b_oa
2
Applications
Optical modules, data center interconnect
Signal measurement, source generation, instrumentation
Patient monitoring and diagnostics
Wireless infrastructure
Ruggedized Communication: sensors, imaging, and radar