SLUSDN6C September   2019  – December 2024 TPSM82810 , TPSM82813

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Schematic
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Precise Enable (EN)
      2. 8.3.2 Output Discharge
      3. 8.3.3 COMP/FSET
      4. 8.3.4 MODE/SYNC
      5. 8.3.5 Spread Spectrum Clocking (SSC) - TPSM8281xS
      6. 8.3.6 Undervoltage Lockout (UVLO)
      7. 8.3.7 Power-Good Output (PG)
      8. 8.3.8 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode Operation (PFM/PWM)
      3. 8.4.3 100% Duty-Cycle Operation
      4. 8.4.4 Current Limit and Short Circuit Protection
      5. 8.4.5 Soft Start / Tracking (SS/TR)
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Setting the Output Voltage
        3. 9.2.2.3 Feedforward capacitor
        4. 9.2.2.4 Input Capacitor
        5. 9.2.2.5 Output Capacitor
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Voltage Tracking
      2. 9.3.2 Synchronizing to an External Clock
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Examples
        1. 9.5.2.1 Thermal Consideration
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIL|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPSM8281x UNIT
VCA (13 PINS) μSIL (14 PINS)
EVM JEDEC 51-7 EVM JEDEC 51-5
RθJA Junction-to-ambient thermal resistance 27.4 73.0 35.0 52.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance n/a(3) 34.1 n/a(3) 52.0 °C/W
RθJB Junction-to-board thermal resistance n/a(3) 20.9 n/a(3) 16.9 °C/W
ψJT Junction-to-top characterization parameter (–3)(2) (–1.4)(2) 11.1 12.8 °C/W
ψJB Junction-to-board characterization parameter 10.2 20.6 14.8 16.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report and Thermal Consideration.
(2) Case top temperature can be higher than temperature of active circuit because of inductor power dissipation. This results in a negative Junction-to-top characterization parameter.
(3) Not applicable to an EVM