SLVSEP0F August   2019  – November 2021 TPSM82821 , TPSM82821A , TPSM82822 , TPSM82822A , TPSM82823 , TPSM82823A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 PWM and PSM Operation
      2. 8.3.2 Low Dropout Operation (100% Duty Cycle)
      3. 8.3.3 Soft Start-up
      4. 8.3.4 Switch Current Limit and Hiccup Short Circuit Protection
      5. 8.3.5 Undervoltage Lockout
      6. 8.3.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable
      2. 8.4.2 Output Discharge
      3. 8.4.3 Power Good Output
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 1.8-V Output Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Setting the Output Voltage
          2. 9.2.1.2.2 Feedforward capacitor
          3. 9.2.1.2.3 Input and Output Capacitor Selection
        3. 9.2.1.3 Application Performance Curves
          1. 9.2.1.3.1 TPSM82821 Performance Curves
          2. 9.2.1.3.2 TPSM82821A Performance Curves
          3. 9.2.1.3.3 TPSM82822 Performance Curves
          4. 9.2.1.3.4 TPSM82822A Performance Curves
          5. 9.2.1.3.5 TPSM82823 Performance Curves
          6. 9.2.1.3.6 TPSM82823A Performance Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Consideration
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Models and Simulators
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIL|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1.1 Design Requirements

The design guidelines provide a component selection to operate the device within the recommended operating conditions.

Table 9-1 lists the components used for Figure 9-1. Table 9-2 lists the components used for Figure 9-2.

Table 9-1 List of Components
REFERENCE DESCRIPTION MANUFACTURER
C1 Ceramic capacitor, 4.7 µF, 6.3 V, X7R, size (0603), JMK107BB7475MA Taiyo Yuden
C2 Ceramic capacitor, 2 × 10 µF, 10 V, X7R, size (0603), GRM188Z71A106MA73D muRata
Ceramic capacitor, 1 × 22 µF, 6.3 V, X6S, size (0603), JMK107BC6226MA-T Taiyo Yuden
C3 Ceramic capacitor, 120 pF, 50 V, size (0603), 06035A121JAT2A

AVX
R1 Resistor, 200 kΩ, 1% accuracy std
R2 Resistor, 100 kΩ, 1% accuracy std
R3 Resistor, 100 kΩ, 1% accuracy std
Table 9-2 List of Components
REFERENCE DESCRIPTION MANUFACTURER
C1 Ceramic capacitor, 4.7 µF, 6.3 V, X7R, size (0603), JMK107BB7475MA Taiyo Yuden
C2 Ceramic capacitor, 22 µF, 4 V, X5R, size (0402), AMK105EBJ226MV-F Taiyo Yuden
R3 Resistor, 100 kΩ, 1% accuracy std