SLVSEP0F August 2019 – November 2021 TPSM82821 , TPSM82821A , TPSM82822 , TPSM82822A , TPSM82823 , TPSM82823A
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TPSM8282x | UNIT | ||
---|---|---|---|---|
μSiL (JEDEC 51-7) | TPSM8282xEVM-080 TPSM8282xAEVM-127 | |||
10-PINS | ||||
RθJA | Junction-to-ambient thermal resistance | 92.6 | 64.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 49.6 | n/a (2) | °C/W |
RθJB | Junction-to-board thermal resistance | 27.7 | n/a (2) | °C/W |
ψJT | Junction-to-top characterization parameter | 5.8 | 4.3 | °C/W |
ψJB | Junction-to-board characterization parameter | 26.9 | 22.4 | °C/W |