SLVSEP0F August   2019  – November 2021 TPSM82821 , TPSM82821A , TPSM82822 , TPSM82822A , TPSM82823 , TPSM82823A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 PWM and PSM Operation
      2. 8.3.2 Low Dropout Operation (100% Duty Cycle)
      3. 8.3.3 Soft Start-up
      4. 8.3.4 Switch Current Limit and Hiccup Short Circuit Protection
      5. 8.3.5 Undervoltage Lockout
      6. 8.3.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable
      2. 8.4.2 Output Discharge
      3. 8.4.3 Power Good Output
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 1.8-V Output Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Setting the Output Voltage
          2. 9.2.1.2.2 Feedforward capacitor
          3. 9.2.1.2.3 Input and Output Capacitor Selection
        3. 9.2.1.3 Application Performance Curves
          1. 9.2.1.3.1 TPSM82821 Performance Curves
          2. 9.2.1.3.2 TPSM82821A Performance Curves
          3. 9.2.1.3.3 TPSM82822 Performance Curves
          4. 9.2.1.3.4 TPSM82822A Performance Curves
          5. 9.2.1.3.5 TPSM82823 Performance Curves
          6. 9.2.1.3.6 TPSM82823A Performance Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Consideration
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Models and Simulators
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIL|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

A proper layout is critical for the operation of any switched mode power supply, especially at high switching frequencies. Therefore, the PCB layout of the TPSM8282x/TPSM8282xA demands careful attention to ensure best performance. A poor layout can lead to issues like bad line and load regulation, instability, increased EMI radiation, and noise sensitivity. Refer to the Five Steps to a Great PCB Layout for a Step-Down Converter Technical Brief for a detailed discussion of general best practices. Specific recommendations for the device are listed below.

  • The input capacitor should be placed as close as possible to the VIN and GND pins of the device. This is the most critical component placement. Route the input capacitor directly to the VIN and GND pins avoiding vias.
  • Place the output capacitor ground close to the VOUT and GND pins and route it directly avoiding vias.
  • Place the FB resistors, R1 and R2, and the feedforward capacitor CFF close to the FB pin to minimize noise pickup.
  • The recommended layout is implemented on the EVM and shown in its TPSM8282xEVM-080 Evaluation Module User's Guide
  • The recommended land pattern for the TPSM8282x/TPSM8282xA is shown at the end of this data sheet. For best manufacturing results, it is important to create the pads as solder mask defined (SMD), when some pins (such as VIN, VOUT, and GND) are connected to large copper planes. Using SMD pads keeps each pad the same size and avoids solder pulling the device during reflow.