SLVSGJ4C October   2022  – July 2023 TPSM82912 , TPSM82913 , TPSM82913E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Smart Config (S-CONF)
      2. 7.3.2  Device Enable (EN/SYNC)
      3. 7.3.3  Device Synchronization (EN/SYNC)
      4. 7.3.4  Spread Spectrum Modulation
      5. 7.3.5  Output Discharge
      6. 7.3.6  Undervoltage Lockout (UVLO)
      7. 7.3.7  Power-Good Output
      8. 7.3.8  Noise Reduction and Soft-Start Capacitor (NR/SS)
      9. 7.3.9  Current Limit and Short-Circuit Protection
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fixed Frequency Pulse Width Modulation
      2. 7.4.2 Low Duty Cycle Operation
      3. 7.4.3 High Duty Cycle Operation (100% Duty Cycle)
      4. 7.4.4 Second Stage L-C Filter Compensation (Optional)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 External Component Selection
          1. 8.2.2.2.1 Switching Frequency Selection
          2. 8.2.2.2.2 Output Capacitor Selection
          3. 8.2.2.2.3 Ferrite Bead Selection for Second L-C Filter
          4. 8.2.2.2.4 Input Capacitor Selection
          5. 8.2.2.2.5 Setting the Output Voltage
          6. 8.2.2.2.6 NR/SS Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.