SLVSGJ4C October   2022  – July 2023 TPSM82912 , TPSM82913 , TPSM82913E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Smart Config (S-CONF)
      2. 7.3.2  Device Enable (EN/SYNC)
      3. 7.3.3  Device Synchronization (EN/SYNC)
      4. 7.3.4  Spread Spectrum Modulation
      5. 7.3.5  Output Discharge
      6. 7.3.6  Undervoltage Lockout (UVLO)
      7. 7.3.7  Power-Good Output
      8. 7.3.8  Noise Reduction and Soft-Start Capacitor (NR/SS)
      9. 7.3.9  Current Limit and Short-Circuit Protection
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fixed Frequency Pulse Width Modulation
      2. 7.4.2 Low Duty Cycle Operation
      3. 7.4.3 High Duty Cycle Operation (100% Duty Cycle)
      4. 7.4.4 Second Stage L-C Filter Compensation (Optional)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 External Component Selection
          1. 8.2.2.2.1 Switching Frequency Selection
          2. 8.2.2.2.2 Output Capacitor Selection
          3. 8.2.2.2.3 Ferrite Bead Selection for Second L-C Filter
          4. 8.2.2.2.4 Input Capacitor Selection
          5. 8.2.2.2.5 Setting the Output Voltage
          6. 8.2.2.2.6 NR/SS Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.1 Smart Config (S-CONF)

This S-CONF pin configures the device based on the resistor value. This pin is read after EN/SYNC goes high. The device configuration cannot be changed during operation. The S-CONF value is re-read if EN is pulled below 200 mV or if VIN falls below UVLO. Table 7-1 shows the configuration options of the following:

  • Switching frequency
  • Spread spectrum modulation
  • Output discharge
  • Synchronization
Table 7-1 S-CONF Device Configuration Modes
S-CONFSWITCHING FREQUENCYSPREAD SPECTRUMOUTPUT DISCHARGESYNCHRONIZATION
VIN2.2 MHzOFFOFFNo
GND1 MHzOFFOFFNo
4.87 kΩ2.2 MHzOFFOFF1.9 MHz to 2.42 MHz
6.04kΩ2.2MHzTriangleOFFNo
7.5 kΩ2.2 MHzRandomOFFNo
9.31 kΩ1 MHzOFFOFF0.9 MHz to 1.2 MHz
11.5kΩ1 MHzTriangleOFFNo
14.3 kΩ1 MHzRandomOFFNo
Discharge On
18.2 kΩ2.2 MHzOFFONNo
22.1 kΩ1 MHzOFFONNo
27.4 kΩ2.2 MHzOFFON1.9 MHz to 2.42 MHz
34 kΩ2.2 MHzTriangleONNo
42.2 kΩ2.2 MHzRandomONNo
52.3 kΩ1 MHzOFFON0.9 MHz to 1.2 MHz
64.9kΩ1 MHzTriangleONNo
80.6 kΩ1 MHzRandomONNo