SLVSE26B November   2017  – April 2018 TPSM84824

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Simplified Schematic
  3. 3 Description
    1.     Transient Response
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics (VIN = 12 V)
    8. 6.8 Typical Characteristics (VIN = 5 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Switching Frequency (RT)
      3. 7.3.3  Synchronization (CLK)
      4. 7.3.4  Output On/Off Enable (EN)
      5. 7.3.5  Input Capacitor Selection
      6. 7.3.6  Output Capacitor Selection
      7. 7.3.7  TurboTrans (TT)
        1. 7.3.7.1 Low-ESR Output Capacitors
        2. 7.3.7.2 Transient Response
          1. 7.3.7.2.1 Transient Waveforms (VIN = 12 V)
      8. 7.3.8  Undervoltage Lockout (UVLO)
      9. 7.3.9  Soft Start (SS/TR)
      10. 7.3.10 Sequencing (SS/TR)
      11. 7.3.11 Power Good (PGOOD)
      12. 7.3.12 Safe Start-up into Pre-Biased Outputs
      13. 7.3.13 Overcurrent Protection
      14. 7.3.14 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Setting the Switching Frequency
        4. 8.2.2.4 Input Capacitors
        5. 8.2.2.5 Output Capacitors
        6. 8.2.2.6 TurboTrans Resistor
        7. 8.2.2.7 Application Waveforms
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 EMI
      1. 10.3.1 EMI Plots
    4. 10.4 Package Specifications
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

MOL Package
24-Pin QFM
Top View
TPSM84824 SDPinPackage2.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME NO.
AGND 3, 9, 23 G Analog ground. Zero voltage reference for internal references and logic. These pins should be connected to one another externally using an analog ground plane on the PCB. Do not connect this pin to PGND; the connection is made internal to the device.
DNC 4 Do Not Connect. Do not connect this pin to AGND, PGND, or to any other voltage. This pin is connected to internal circuitry.
EN 10 I Enable. Float or pull high to enable the device. Connect a resistor divider to this pin to implement adjustable undervoltage lockout and hysteresis.
FB 2 I Feedback input of the regulator. Connect the output voltage feedback resistor divider to this pin.
PGND 12, 13, 14, 15, 18, 19, 20, 21 G Power ground. This is the return current path for the power stage of the device. Connect these pins to the input source, the load, and to the bypass capacitors associated with VIN and VOUT using power ground planes on the PCB. Pads 12 and 21 should be connected to the ground planes using multiple vias for improved thermal performance.
PGOOD 7 O Power-Good flag. This open drain output asserts low if the output voltage is outside of the PGOOD thresholds, VIN is lower than its UVLO threshold, EN is low, device is in thermal shutdown or device is in soft-start. Use a 10-kΩ to 100-kΩ pullup resistor to logic rail or other DC voltage no higher than 6.5 V.
RT/CLK 24 I Switching frequency setting pin. In RT mode, an external timing resistor adjusts the switching frequency. In CLK mode, the device synchronizes to an external clock input to this pin.
SS/TR 6 I Soft-start and tracking pin. Connecting an external capacitor to this pin adjusts the output voltage soft-start ramp slower than its 1.25-ms default setting. A voltage applied to this pin allows for tracking and sequencing control.
SW 16, 17 O Switch node. Do not place any external components on these pins or tie them to a pin of another function.
TT 5 I TurboTrans pin. Internal loop compensation network. Connect the required TurboTrans resistor between this pin and AGND. See the TurboTrans (TT) section for the value of the resistor. Do not leave this pin floating.
VIN 11, 22 I Input voltage. Supplies voltage to the power switches of the converter and all of the internal circuitry. Connect these pins to the input source and connect external input capacitors between these pins and PGND, close to the device. These pins should be connected to internal VIN layers using multiple vias for improved thermal performance.
VOUT 1, 8 O Output voltage. These pins are connected to the internal output inductor. Connect these pins to the output load and connect external output capacitors between these pins and PGND, close to the device. These pins should be connected to internal VOUT layers using multiple vias for improved thermal performance.
(1) G = Ground, I = Input, O = Output